scispace - formally typeset
Proceedings ArticleDOI

Interconnect architecture exploration for low-energy reconfigurable single-chip DSPs

Reads0
Chats0
TLDR
The results indicate that the hierarchical generalized mesh structure shows the most promise in terms of energy efficiency, as it can optimize both local and global connections.
Abstract
In this paper we present and analyze a number of interconnect architectures for reconfigurable systems targeting applications in the areas of wireless communication and multimedia processing. Several interconnect architectures suitable for heterogeneous elements are proposed and then a methodology to evaluate the architectures is described. The results indicate that the hierarchical generalized mesh structure shows the most promise in terms of energy efficiency, as it can optimize both local and global connections.

read more

Citations
More filters
Proceedings ArticleDOI

Orion: a power-performance simulator for interconnection networks

TL;DR: Orion is presented, a power-performance interconnection network simulator that is capable of providing detailed power characteristics, in addition to performance characteristics, to enable rapid power- performance trade-offs at the architectural-level.
Journal ArticleDOI

Power reduction techniques for microprocessor systems

TL;DR: It is concluded that power management is a multifaceted discipline that is continually expanding with new techniques being developed at every level and it remains too early to tell which techniques will ultimately solve the power problem.
Proceedings ArticleDOI

Powering networks on chips: energy-efficient and reliable interconnect design for SoCs

TL;DR: This work considers energy consumption reduction, under guaranteed quality of service, as a main objective in system design, in systems on chips that can be designed and produced in five to ten years from today.
Proceedings ArticleDOI

aSOC: A Scalable, Single-Chip Communications Architecture

TL;DR: A new single-chip interconnect architecture, adaptive System-On-a-Chip, is described that not only provides scalable data transfer, but also can be easily reconfigured as application-level communication patterns change.
Journal ArticleDOI

A 1-V heterogeneous reconfigurable DSP IC for wireless baseband digital signal processing

TL;DR: A heterogeneous reconfigurable platform enables the flexible implementation of baseband wireless functions at energy levels between 10 and 100 MOPS/mW, six times higher than traditional digital signal processors.
References
More filters
Journal ArticleDOI

The Network Architecture of the Connection Machine CM-5

TL;DR: The Connection Machine Model CM-5 supercomputer as discussed by the authors is a massively parallel computer system designed to offer performance in the range of 1 teraflops (1012 floating point operations per second).
Proceedings ArticleDOI

HSRA: high-speed, hierarchical synchronous reconfigurable array

TL;DR: A novel reconfigurable computing array, the High-Speed, Hierarchical Synchronous Reconfigurable Array (HSRA), and its supporting tools are introduced, which demonstrates that computing arrays can achieve efficient, high-speed operation.
Proceedings ArticleDOI

Ultra-low-power domain-specific multimedia processors

TL;DR: This work presents a hybrid architecture template that can be used to implement ultra-low-power programmable processors for signal processing applications.
Proceedings ArticleDOI

Guide to using field programmable gate arrays (FPGAs) for application-specific digital signal processing performance

TL;DR: The benefits of using an FPGA as a DSP co-processor, as well as, a stand-alone DSP engine, are described in detail.
Proceedings ArticleDOI

Performance-oriented placement and routing for field-programmable gate arrays

TL;DR: A performance-oriented placement and routing tool for field-programmable gate arrays using recursive geometric partitioning for simultaneous placement and global routing, and a graph-based strategy for detailed routing that optimizes source-sink pathlengths, channel width and total wire-length.