Journal ArticleDOI
Interface formation in infiltrated Al(Si)/diamond composites
TLDR
In this paper, the authors investigated the interface formation in infiltrated Al-based composites with high-volume fractions of monocrystalline synthetic diamond particles, and discussed the interface characteristics with respect to process conditions and Al matrix chemistry.About:
This article is published in Diamond and Related Materials.The article was published on 2006-09-01. It has received 125 citations till now. The article focuses on the topics: Diamond & Synthetic diamond.read more
Citations
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Journal ArticleDOI
Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles
TL;DR: In this paper, an effective way to apply a vapor deposited chromium coating onto diamond particles was used to overcome the interface problem, and the results showed that the densification, interfacial bonding and thermal conductivity of coated composites were evidently enhanced compared to that of uncoated composites.
Journal ArticleDOI
On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites
Ludger Weber,Reza Tavangar +1 more
TL;DR: In this article, the evolution of thermal conductivity and the coefficient of thermal expansion as a function of the alloying content of boron and chromium in the copper matrix in Cu-X/diamond composites is presented.
Journal ArticleDOI
Selective interfacial bonding in Al(Si)–diamond composites and its effect on thermal conductivity
TL;DR: In this paper, metal-matrix composites were produced by reinforcing aluminum and aluminum-silicon with diamond single crystals via two different liquid metal infiltration techniques, gas pressure infiltration and mechanically assisted infiltration (squeeze casting).
Journal ArticleDOI
Review of metal matrix composites with high thermal conductivity for thermal management applications
TL;DR: In this article, the problems involved in the fabrication and the brazing of these composites were elucidated and the main focus was put on the discussion of the methods to overcome these difficulties.
Journal ArticleDOI
Fabrication and properties of graphite flakes/metal composites for thermal management applications
TL;DR: In this paper, a novel fabrication process is discussed which consists of using mixtures of graphite flakes and other material with different morphology, and the thermal properties of the resulting composites are also reported.
References
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Journal ArticleDOI
Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance
TL;DR: In this article, a modification of the original theories of Rayleigh and Maxwell permitted the deriva tion of expressions for the effective thermal conductivity of composites consisting of a continuous matrix phase with dilute concentrations of dispersions with spherical, cylin drical and flat plate geometry with a thermal barrier resistance at the interface between the components.
Book
The Properties of natural and synthetic diamond
TL;DR: In this article, the authors present a survey of the state of the art in Solid State, Geology and Growth, and Mechanical and Industrial Engineering, with an emphasis on the following:
Journal ArticleDOI
Comprehensive composite materials
Anthony Kelly,Carl Zweben +1 more
TL;DR: In this paper, a multi-reference source spanning the whole composites science field, including fiber reinforcements and general theory of composites, polymer matrix composites; metal matrix composite; test methods, non-destructive evaluation and smart composites.
Journal ArticleDOI
Thermal properties of diamond/copper composite material
TL;DR: The composite of diamond and copper have a potential for a heat spreading substrate with high performance and high reliability because not only its thermal conductivity is high but its coefficient of thermal expansion can be tailored according to a semiconductor material of electronics devices.
Related Papers (5)
Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance
On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites
Ludger Weber,Reza Tavangar +1 more