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Method for fabricating a semiconductor device using a catalyst introduction region

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TLDR
In this article, a high-quality crystalline silicon film, having the crystal growth direction aligned in one direction and having no grain boundaries, is obtained using the newly introduced catalyst elements efficiently diffuse only inside the island-patterned amorphous silicon films.
Abstract
Into an amorphous silicon film, catalyst elements for accelerating the crystallization are introduced. After patterning the amorphous silicon films in which the catalyst elements have been introduced into an island pattern, a heat treatment for the crystallization is conducted. Thus, the introduced catalyst elements efficiently diffuse only inside the island-patterned amorphous silicon films. As a result, a high-quality crystalline silicon film, having the crystal growth direction aligned in one direction and having no grain boundaries, is obtained. Using the thus formed crystalline silicon film, semiconductor devices having a high performance and stable characteristics are fabricated efficiently over the entire substrate, irrespective of the size of the devices.

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References
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Journal ArticleDOI

Silicide formation and silicide‐mediated crystallization of nickel‐implanted amorphous silicon thin films

TL;DR: In this paper, the nucleation and growth of isolated nickel disilicide precipitates in amorphous Si thin films and the subsequent low-temperature silicide-mediated crystallization of Si was studied using in situ transmission electron microscopy.
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Low temperature crystallization and pattering of amorphous silicon films

TL;DR: In this paper, a very thin discontinuous film of a nucleating site forming material over the amorphous Si prior to rapid thermal anneal is used to reduce the temperature of polycrystalline Si to a temperature range from 550° C to 650° C.
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Method for manufacturing semiconductor device

TL;DR: In this article, an impurity is injected into a polycrystalline Si film 45, and the impurity ions are diffused to an Si substrate 11 to form diffusion layers 26, 32.
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Low temperature crystallization and patterning of amorphous silicon films on electrically insulating substrates

TL;DR: In this paper, a patterning of the deposition of the nucleating site forming material on the glass substrate was proposed to selectively crystallize only in areas in contact with the forming material.
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Process for fabricating thin film transistor

TL;DR: In this paper, a pattern is transferred on silicon film crystallized by annealing, the silicon film is annealed by radiation of intense rays for a short time, and then the area not crystallised by annesaling is also crystallized, the oxide film is then etched.