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Method for plasma etching a chromium layer through a carbon hard mask suitable for photomask fabrication

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TLDR
In this article, a method for etching chromium and forming a photomask using a carbon hard mask is described, which is useful for fabricating photomasks. But this method requires the chromium layer to be partially exposed through a patterned hard mask.
Abstract
Methods for etching chromium and forming a photomask using a carbon hard mask are provided. In one embodiment, a method of a chromium layer includes providing a substrate in a processing chamber, the substrate having a chromium layer partially exposed through a patterned carbon hard mask layer, providing a process gas containing chlorine and carbon monoxide into the etching chamber, and maintaining a plasma of the process gas and etching the chromium layer through the carbon hard mask layer. The method of etching a chromium layer through a patterned carbon hard mask layer is useful for fabricating photomasks.

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References
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Patent

Method of depositing an amorphous carbon layer

TL;DR: In this article, the amorphous carbon film is used as a hardmask for hard-masking an integrated circuit and an anti-reflective coating for deep ultraviolet (DUV) lithography.
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Method of etching and cleaning using fluorinated carbonyl compounds

TL;DR: In this paper, a method comprising etching a material under plasma etching conditions using an etching composition which has a GWP of no greater than about 3000 and which comprises at least one etchant compound having a formula selected from the group consisting of FCO-CO-[(CR 1 R 2 ) m −CO] n −F and FCOCO-R 3 -CO-N −F, and wherein: m=0, 1, 2, 3, 4, or 5; n=1; R 1 & R 2 represent H, F or C
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TL;DR: In this paper, a process for depositing silicon carbide using a silane-based material with certain process parameters that is useful for forming a suitable ARC for IC applications is presented. But the authors do not consider the effect of the thickness of the underlying layer for a given reflectivity.
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