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Proceedings ArticleDOI

Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications

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TLDR
In this paper, the authors presented a comprehensive technology for manufacturing sintered silver specimen for micro bending test, which can still be tested with nano-enter equipment and the corresponding stress-strain curves were obtained with transformation functions computed by a FE model.
Abstract
The increased attention for sintered silver as die attach attracts also interest in its reliability assessment. Since the porous joint material shows rate-dependent behaviour at elevated temperature, its visco-plastic behaviour needs to be quantified. Though tensile tests are frequently used for that task is still a challenge to manufacture homogeneous specimens large enough to be safely handled and tensile tested. In this paper the we have presented a comprehensive technology for manufacturing sintered silver specimen for micro bending test. The sample length is about 10 mm but can still be tested with nanoindenter equipment. These specimens were bent at 25 °C at different strain rates. The corresponding stress-strain curves were obtained with transformation functions computed by a FE model. Tensile specimens of sintered silver were manufactured and tensile tested at 25, 100 and 175 °C for investigation of rate dependency and relaxation behaviour. For 25 °C no rate dependency was observed. At 100 °C and 175 °C significant reduction of tensile strength and increase of tensile strain was observed at smaller strain rates. The creep was caused by thermal activation of inner surface diffusion.

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Journal ArticleDOI

Characterization and reconstruction for stochastically distributed void morphology in nano‑silver sintered joints

TL;DR: In this article, a holistic approach including both void morphology characterization and reconstruction stages is developed for the reconstruction of Stochastically Distributed Void Morphologies (SDVMs) in nano-silver sintered joints.
Proceedings ArticleDOI

Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics

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Proceedings ArticleDOI

Interaction of advanced copper metallization with the assembly and interconnection technology

TL;DR: In this paper , a simulative approach is used to compare various copper and Al metallization in active power cycling of a double-sided sintered SiC power module.
References
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Journal ArticleDOI

Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology

TL;DR: In this article, the authors review the current understanding of the mechanics governing elastic-plastic indentation as they pertain to load and depth-sensing indentation testing of monolithic materials and provide an update of how they now implement the method to make the most accurate mechanical property measurements.
Journal ArticleDOI

A methodology for determining mechanical properties of freestanding thin films and MEMS materials

TL;DR: In this paper, a chip-level membrane deflection experiment is presented for the investigation of sub-micron thin films and microelectro-mechanical systems, where a Mirau microscope interferometer is positioned below the membrane to observe its response in real time.
Journal ArticleDOI

Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

TL;DR: In this article, the authors used curvature and submicron indentation measurements to study the strength of thin aluminum and tungsten thin films on silicon substrates and found that the film strength increased with decreasing thickness.
Journal ArticleDOI

Elastic and plastic properties of thin films on substrates : nanoindentation techniques

TL;DR: In this paper, the authors describe nanoindentation techniques that have been developed for measuring the elastic and plastic properties of thin films with thickness on the order of micrometers.
Journal ArticleDOI

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging

TL;DR: In this paper, the authors discuss the main methods of applying Ag pastes/laminates as die-attach materials and the related processing conditions, and the long-term reliability of sintered Ag joints.
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