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New imaging technique for 64M-DRAM

TLDR
In this paper, a new photolithographic technique called SHRINC (Super High Resolution by Illum-nation Control ) is proposed to improve the resolution and depth-of-focus by optimum arrangement of the illumination system in respect of the angle of the 1st-order of diffraction generated by the reticle pitch.
Abstract
We have established a new photolithographic technique called SHRINC ( Super High Resolution by Illum-Nation Control ) which is based on an innovative illumination system. SHRINC improves the resolution and depth-of-focus ( DOF ) by optimum arrangement of the illumination system in respect of the angle of the 1st-order of diffraction generated by the reticle pitch. The capabilities of SHRINC have been studied by computer simulation. Results from phase shift, annular illumination, and conventional illumination are compared with those of SHRINC. The results show that using SHRINC with 0.35μm line and space patterns, the DOF, defined as the distance over which the aerial image contrast exceeds 60%, is 2.5x larger than that obtained with conventional illumination, and almost the same as that with phase shift techniques. In our experiments we have obtained a critical resolution of 0.275μm and more than 2.8 μm DOF with 0.35μm L/S patterns, using an i-line stepper and SHRINC illumination. Moreover SHRINC is effective not only for simple line and space patterns, but also for complicated patterns with 0.30 or 0.35μm design rules, such as memory cell patterns or peripheral circuit patterns in the DRAM. From these results we conclude that i-line steppers with SHRINC will make possible pass production of 64M-DRAMs with single layer resist.

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Book

Principles of Lithography

TL;DR: The second edition of this book as discussed by the authors was written to address several needs, and the revisions for the second edition were made with those original objectives in mind, and many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail.
Proceedings ArticleDOI

Resolution enhancement technology: the past, the present, and extensions for the future

TL;DR: The primary resolution enhancement techniques (RETs) of OPC, PSM and OAI are categorized according to their control of the fundamental properties of a wave: amplitude, phase, and direction as discussed by the authors.
Journal ArticleDOI

Wavefront Engineering for Photolithography

Marc D. Levenson
- 01 Jul 1993 - 
TL;DR: The inner structures of everyday items such as the personal computer fall into that size category and warrant our interest as discussed by the authors, and the critical dimensions of individual features of state-of-the-art memory chips are now as small as 500 nanometers and are getting smaller.
Journal ArticleDOI

High resolution optical lithography or high throughput electron beam lithography

TL;DR: In this paper, the history of resolution improvement efforts in optical lithography and throughput improvement in electron beam lithography through the development history of dynamic random access memories (DRAMs).
Proceedings ArticleDOI

Contact hole formation by multiple exposure technique in ultralow-k1 lithography

TL;DR: In this paper, the double line and space (L&S) formation method with L&S masks and dipole illumination was found to have high capability to fabricate about 0.3-k1 contact hole (C/H) pattern.
References
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Journal ArticleDOI

Introduction to Fourier Optics

Joseph W. Goodman, +1 more
- 01 Apr 1969 - 
TL;DR: The second edition of this respected text considerably expands the original and reflects the tremendous advances made in the discipline since 1968 as discussed by the authors, with a special emphasis on applications to diffraction, imaging, optical data processing, and holography.
Book

Principles of Lithography

TL;DR: The second edition of this book as discussed by the authors was written to address several needs, and the revisions for the second edition were made with those original objectives in mind, and many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail.
Proceedings ArticleDOI

Resolution enhancement technology: the past, the present, and extensions for the future

TL;DR: The primary resolution enhancement techniques (RETs) of OPC, PSM and OAI are categorized according to their control of the fundamental properties of a wave: amplitude, phase, and direction as discussed by the authors.
Journal ArticleDOI

Wavefront Engineering for Photolithography

Marc D. Levenson
- 01 Jul 1993 - 
TL;DR: The inner structures of everyday items such as the personal computer fall into that size category and warrant our interest as discussed by the authors, and the critical dimensions of individual features of state-of-the-art memory chips are now as small as 500 nanometers and are getting smaller.
Journal ArticleDOI

High resolution optical lithography or high throughput electron beam lithography

TL;DR: In this paper, the history of resolution improvement efforts in optical lithography and throughput improvement in electron beam lithography through the development history of dynamic random access memories (DRAMs).
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