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Proceedings ArticleDOI

New test methodology for resistive open defect detection in memory address decoders

Mohamed Azimane, +1 more
- pp 123-128
TLDR
It is demonstrated that the fault coverage of the resistive open defects in the memory address decoders are not completely covered by applying the well-known March tests and special test pattern sequences published in the literature.
Abstract
Intra-gate resistive open defects not only cause sequential behaviour in CMOS memory address decoders, but also lead to delay behaviour. This paper evaluates the fault coverage of the resistive open defects in the memory address decoders. It shows that both the strong and the weak open defects are not completely covered by applying the well-known March tests and special test pattern sequences published in the literature. We demonstrate that the fault coverage is increased by varying the duty cycle of the internal clock of the address decoder. For the self-timed memories, we introduce a simple DFT technique to control the duty cycle of the internal clock which activates/deactivates the word lines. Using defect-oriented test, we also created a fault dictionary based on the defect location, transistor types, the terminal name and also the faulty behaviour. The fault dictionary in combination with the bit-map fail data will facilitate the localization of the open defects.

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Citations
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Journal ArticleDOI

Experimental Characterization of CMOS Interconnect Open Defects

TL;DR: Recommendations to generate stuck-at, IDDQ and delay test are discussed in order to improve the detectability of open defects and the history effect on the delay caused by resistive opens.
Proceedings ArticleDOI

Defective behaviours of resistive opens in interconnect lines

TL;DR: The static and dynamic behavior of the defective lines have been electrically characterized taking into account the location of the defect as well as its resistive value to allow the extraction of general information useful for the prediction and detection of the faulty behavior caused by the defect.
Journal ArticleDOI

Opens and Delay Faults in CMOS RAM Address Decoders

TL;DR: This paper presents a complete electrical analysis of address decoder delay faults "ADFs" caused by resistive opens in RAMs, based on generating appropriate sensitizing address transitions and the corresponding sensitizing operation sequences.
Journal ArticleDOI

Memory test experiment: industrial results and data

TL;DR: The results of 12 well-known and three fault-primitive-based memory test algorithms applied to 0.13 micron technology 512 kB single-port SRAMs are presented in this paper.
Journal ArticleDOI

Test Set Development for Cache Memory in Modern Microprocessors

TL;DR: The methodology used to develop effective and efficient cache tests, and the way it is implemented to optimize the test set used at Intel to test their 512-kB caches manufactured in a 0.13- mum technology are discussed.
References
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Book

Testing Semiconductor Memories: Theory and Practice

TL;DR: Memory modeling functional testing: reduced functional RAM chip model Functional RAM chip testing functional ROM chip testingfunctional memory array testing functional memory board testing electrical testing: parametric testing dynamic testing on chip testing conclusions: address line scrambling various proofs software package.
Proceedings ArticleDOI

High volume microprocessor test escapes, an analysis of defects our tests are missing

TL;DR: In this paper, defects found in a high volume microprocessor when shipping at a low defect level are explored to forecast the need for better tools and methods to earlier achieve high quality goals.
Proceedings ArticleDOI

Functional memory faults: a formal notation and a taxonomy

TL;DR: Using this notation, the space of all possible memory faults has been constructed and it has been shown that this space is infinite, and contains the currently established fault models.
Journal ArticleDOI

Resistance characterization for weak open defects

TL;DR: Characterizing weak opens can help researchers assess the need for delay fault tests, and it is shown that strong open defects can cause a circuit to malfunction, but even weak open defects could cause it to function poorly.
Proceedings ArticleDOI

Testing for resistive opens and stuck opens

TL;DR: The effects on test results of three test conditions as well as test patterns applied are evaluated and five Murphy chips are diagnosed as having stuck open defects and one chip is diagnosed asHaving a resistive open defect.