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Proceedings ArticleDOI

Novel mask inspection flow for better defect review and analysis

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TLDR
Wang et al. as mentioned in this paper proposed a mask inspection flow to improve mask inspection capacity and systematic defect management, which adopted individual defect review system after defect detection in inspection machine and set up unified defect analysis hub.
Abstract
Mask inspection plays a pivotal role in current high grade mask making processes and further its importance is getting bigger. The purpose of inspection process is as follows. One is simple sorting of NG masks that have fatal defects with high sensitivity. The other is improvement of total mask manufacturing process and mask quality using defect source analysis. As semiconductor device is getting shrunk down, the influence of mask defect is increasing. Therefore, there are special needs for the efficient use of such expensive inspection machines and the systematic approach of defect analysis. In this paper, we propose novel mask inspection flow to improve mask inspection capacity and systematic defect management. In general, Inspection process is divided by two steps. One is detection of defects and the other is review for defect analysis. Our concept of new inspection flow is adoption of individual defect review system after defect detection in inspection machine. With this new inspection flow using defect review system, we could increase inspection capacity by 30% and set up unified defect analysis hub.

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Citations
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Proceedings ArticleDOI

Auto-classification and simulation of mask defects using SEM and CAD images

TL;DR: In this paper, a combination of a SEM defect review tool and defect disposition and simulation software is proposed, which uses high-resolution SEM images of defects to do defect review, defect disposition, and wafer printing simulation of defects automatically or manually.
Proceedings ArticleDOI

New method of identification of false or nuisance defects using defect imaging system DIS-05

TL;DR: In this article, a defect review tool developed from CD-SEM is presented for identification, classification and judgment of false or nuisance defects, which uses secondary electron and backscattered electron images.
Proceedings ArticleDOI

Cost-effective pattern inspection system using Xe-Hg lamp in challenge of sub-65-nm node

TL;DR: In this paper, the advantages of using Xe-Hg lamp instead of a DUV laser are presented and evaluated performances of the defect inspection system with programmed defect mask and production mask.
References
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Proceedings ArticleDOI

Defect printability measurement on the KLA-351: correlation to defect sizing using the AVI metrology system

TL;DR: In this paper, the AVI Photomask Metrology System provides measurement repeatability better than 5 nm, and significantly better correlation to printability than Scanning Electron Microscope (SEM) measurements.
Proceedings ArticleDOI

PRIMADONNA: a system for automated defect disposition of production masks using wafer lithography simulation

TL;DR: DIVAS as discussed by the authors is a system called Defect Inspection Viewing, Archiving, and Simulation (DIVAS) that fully uses and efficiently manages this wealth of defect information in the manufacturing process.
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