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Plasma oxidation of aluminum film on GaAs—A study by Auger spectroscopy and transmission electron microscopy

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TLDR
In this article, an amorphous GaAs-oxide film with a Ga/As concentration ratio of unity all the way to the GaAs substrate was achieved by using the Aloxide film as a preferential filter for the migration of Ga and As.
Abstract
Plasma oxidation of thin polycrystalline aluminum films (∼100 A) on GaAs has shown that oxidation of aluminum proceeds by an initial rapid grain‐boundary oxidation of the aluminum followed by a slower oxidation towards the centers of the individual grains. Continued oxidation results in the growth of Ga‐As‐ oxide layers on both sides of the Al‐oxide film indicating that the oxidation of GaAs proceeds by an electric‐field‐assisted in‐migration of oxygen through the Al‐oxide layer toward the interface and the out‐migration of Ga and As toward the surface. This oxidation process can be used to form an amorphous film of Al‐oxide on GaAs. By using the Al‐oxide film as a preferential filter for the migration of Ga and As, an amorphous Ga‐As‐oxide film with a Ga/As concentration ratio of unity all the way to the GaAs substrate can also be achieved.

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Citations
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Journal ArticleDOI

Detection of excess crystalline As and Sb in III‐V oxide interfaces by Raman scattering

TL;DR: In this article, the anomalous peaks from oxidized GaAs and InAs were determined to be from excess As in the interface between the oxides and underlying semiconductors, and from the frequencies, line shapes, and polarization selection rules, the excess As and Sb are in the crystalline semimetal phase, as distinct from the amorphous phase.
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A NEW RESONANT ELLIPSOMETRIC TECHNIQUE FOR CHARACTERIZING THE INTERFACE BETWEEN GaAs AND ITS PLASMA-GROWN OXIDE.

TL;DR: In this article, a standing-wave condition is applied to a thin transparent dielectric layer on an absorbing substrate, which efficiently couples the S wave to the substrate, simulating a cavity resonance in the dielectrics and maximizing the complex reflectance ratio.
Journal ArticleDOI

Transport number measurements during plasma anodization of Si, GaAs, and ZrSi2

TL;DR: In this article, the transport number of cations t+ in oxides grown by anodization in oxygen plasma has been investigated using Xe atom markers and Rutherford backscattering techniques were used to determine the change in Xe marker position related to the change of oxide thickness.
Journal ArticleDOI

Oxidation of GaAs in an oxygen multipole plasma

TL;DR: In this article, the electrical properties of metal-oxide-semiconductor structures are controlled by interface states in the whole band gap: in the upper half (near the middle of the gap) densities in the range 1013 cm-2 eV-1 of rather slow interface states (which are unable to follow a 1 MHz signal at room temperature) and in the lower half “faster” interface states are detected from C(V) measurements on n-type and p-type samples.
References
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Book

Characterization of solid surfaces

TL;DR: In the last decade or so, a number of developments have shown that, for many purposes, the distribution of defects within a material can confer important new properties on the material as discussed by the authors.
Journal ArticleDOI

General formalism for quantitative Auger analysis

TL;DR: In this paper, the basic formalisms for treatment of the homogeneous surface and the layered structure are presented; their use and typical limitations are demonstrated by examining some applications, such as surface chemical composition analysis.
Journal ArticleDOI

Transmission electron microscopy of cross sections of large scale integrated circuits

TL;DR: In this paper, a cross-sectional view of a CMOS RAM with poly-Si gates and tungsten second metal was obtained by using transmission electron microscopy (TEM).
Journal ArticleDOI

Plasma oxidation of GaAs

TL;DR: In this paper, a new process for plasma oxidation of GaAs has been developed, which has amorphous structure, with composition and thickness uniformity better than ±10% over areas ≲1 cm2.
Journal ArticleDOI

Multipurpose plasma reactor for materials research and processing

TL;DR: The operation of the Bell Laboratories large capacity, multipurpose plasma reactor for materials research and processing is discussed in this article, where the design of the reactor is such that all the plasma parameters can be independently controlled.
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