Journal ArticleDOI
Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers
TLDR
In this article, transient flash measurements were performed across bonding interface regions formed under various conditions, in combination with detailed structural examination and measurements of bulk mass density and specific heat, to evaluate the thermal resistance of TLP bonded Cu/Al/Cu interface regions.Abstract:
Transient liquid phase (TLP) bonding of Cu structures with a thin elemental Al intermediate bonding layer is being used to assemble Cu-based, enclosed, microchannel heat exchangers (MHEs). The heterogeneous Cu/Al/Cu TLP bonding interface region, formed during the TLP bonding process, impacts heat transfer of the assembled MHE device. To evaluate the thermal resistance of TLP bonded Cu/Al/Cu interface regions, transient flash measurements were performed across bonding interface regions formed under various conditions, in combination with detailed structural examination and measurements of bulk mass density and specific heat. The flash method is shown to yield quantitative measurements of interfacial thermal resistance values. Our results provide guidance to developing bonding protocols for Cu-based MHEs with optimized heat transfer performance.read more
Citations
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Journal ArticleDOI
Experimental investigation of Cu-based, double-layered, microchannel heat exchangers
Bin Lu,Wen Jin Meng,Fanghua Mei +2 more
TL;DR: In this paper, a double-layered, liquid-liquid counter-flow MHE was constructed and compared with a single-layer MHE and showed similar heat transfer performance while suffering a much lower pressure drop penalty compared to a single layer.
Journal ArticleDOI
Deformation behaviour of Cu and Cu–Al in the dislocation starved regime: A molecular dynamics study
TL;DR: In this paper , the authors show anomalous softening in Cu-Al alloys deformed at 300 K. They show that there are two components to this softening; in addition to the heterogeneous nucleation at solute sites, the reduction in stacking fault energy with alloying addition promotes the (homogeneous) nucleation of partial dislocation loops.
Posted Content
Effect of stacking fault energy on nucleation limited plasticity in Cu-Al alloys
TL;DR: In this paper, the effect of stacking fault energy (SFE) on the deformation behavior of copper and copper-aluminium alloys using molecular dynamics (MD) simulation was studied.
Journal ArticleDOI
MODELISATION DE L'INFLUENCE DU TRAITEMENT THERMIQUE SUR LES PROPRIETES MECANIQUES DES ALLIAGES ALUMINIUM-CUIVRE (Al-Cu)
Saad El Madani,S. Elhamzi,Amina Ibnlfassi,L. Zerrouk,O. Ben Lenda,J. Katten,Y. Ait Yassine,L. Bouirden +7 more
TL;DR: In this article, the authors focused on the modeling of the segregation phenomenon of the four hypoeutectic alloys, Al1%Cu, Al2% Cu, Al3%Cu et Al4%Cu.
References
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Book
Introduction to solid state physics
TL;DR: In this paper, the Hartree-Fock Approximation of many-body techniques and the Electron Gas Polarons and Electron-phonon Interaction are discussed.
Book
Binary alloy phase diagrams
TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.