Showing papers in "Journal of Micromechanics and Microengineering in 2013"

Polymer-based flexible capacitive sensor for three-axial force measurements

Abstract: We have developed a flexible-substrate-based three-axial force sensor, composed of finger-shaped electrode capacitors, whose operation is based on the measurement of a capacitance change induced upon applying a three-axial load. The electrode design supports high sensitivity to shear forces. An overall flexibility of the sensor and elasticity of the capacitor's dielectric is obtained by integrating three polymers in the sensor's technology process, namely polyimide, parylene-C, and polydimethylsiloxane, combined with standard metallization processes. We have theoretically modeled the sensor's capacitance and its three-axial force sensitivity. The unit capacitors have static capacitances in the range of 20 pF. The electro-mechanical characterization of the capacitors reveals in the normal direction a sensitivity Sz = 0.024 kPa−1 for pressures <10 kPa, whereas for higher pressures the measured sensitivity Sz = 6.6 × 10−4 kPa−1. Typical measured shear force sensitivity Sx = 2.8 × 10−4 kPa−1. These values give our transducer high potential for use in skin-like sensing applications.

Thin film Lamb wave resonators in frequency control and sensing applications: a review

Abstract: This work makes an overview of the progress made during the last decade with regard to a novel class of piezoelectric microwave devices employing acoustic Lamb waves in micromachined thin film membranes. This class of devices is referred to as either thin film Lamb wave resonators or piezoelectric contour-mode resonators both employing thin film aluminum nitride membranes. These devices are of interest for applications in both frequency control and sensing. High quality factor Lamb wave resonators exhibiting low noise, low loss and thermally stable performance are demonstrated and their application in high resolution gravimetric and pressure sensors further discussed. A specific emphasis is put on the ability of these devices to operate in contact with liquids. Future research directions are further outlined.

A review of micro-contact physics for microelectromechanical systems (MEMS) metal contact switches

Abstract: Innovations in relevant micro-contact areas are highlighted, these include, design, contact resistance modeling, contact materials, performance and reliability. For each area the basic theory and relevant innovations are explored. A brief comparison of actuation methods is provided to show why electrostatic actuation is most commonly used by radio frequency microelectromechanical systems designers. An examination of the important characteristics of the contact interface such as modeling and material choice is discussed. Micro-contact resistance models based on plastic, elastic-plastic and elastic deformations are reviewed. Much of the modeling for metal contact micro-switches centers around contact area and surface roughness. Surface roughness and its effect on contact area is stressed when considering micro-contact resistance modeling. Finite element models and various approaches for describing surface roughness are compared. Different contact materials to include gold, gold alloys, carbon nanotubes, composite gold-carbon nanotubes, ruthenium, ruthenium oxide, as well as tungsten have been shown to enhance contact performance and reliability with distinct trade offs for each. Finally, a review of physical and electrical failure modes witnessed by researchers are detailed and examined.

Direct fabrication of high-resolution three-dimensional polymeric scaffolds using electrohydrodynamic hot jet plotting

Abstract: This paper presents the direct three-dimensional (3D) fabrication of polymer scaffolds with sub-10 µm structures using electrohydrodynamic jet (EHD-jet) plotting of melted thermoplastic polymers. Traditional extrusion-based fabrication approaches of 3D periodic porous structures are very limited in their resolution, due to the excessive pressure requirement for extruding highly viscous thermoplastic polymers. EHD-jet printing has become a high-resolution alternative to other forms of nozzle deposition-based fabrication approaches by generating micro-scale liquid droplets or a fine jet through the application of a large electrical voltage between the nozzle and the substrate. In this study, we successfully apply EHD-jet plotting technology with melted biodegradable polymer (polycaprolactone, or PCL) for the fabrication of 2D patterns and 3D periodic porous scaffold structures in potential tissue engineering applications. Process conditions (e.g. electrical voltage, pressure, plotting speed) have been thoroughly investigated to achieve reliable jet printing of fine filaments. We have demonstrated for the first time that the EHD-jet plotting process is capable of the fabrication of 3D periodic structures with sub-10 µm resolution, which has great potential in advanced biomedical applications, such as cell alignment and guidance.

Unconventional applications of wire bonding create opportunities for microsystem integration

Abstract: Automatic wire bonding is a highly mature, cost-efficient and broadly available back-endprocess, intended to create electrical interconnections in semiconductor chip packaging. Modern production wi ...

Transfer of thin Au films to polydimethylsiloxane (PDMS) with reliable bonding using (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive

Abstract: This paper describes the transfer of thin gold films deposited on rigid silicon substrates to polydimethylsiloxane (PDMS) with reliable and strong bonding. Modification of the Au surfaces with (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive was carried out to promote adhesion between Au and PDMS. The degree of bonding with respect to the concentration of MPTMS, treatment time and methods of deposition was investigated by a simple adhesion test using two different adhesive tapes. The effect of hydrolysis of MPTMS is discussed based on the bonding mechanism of MPTMS to the PDMS prepolymer. Also, the adsorption of MPTMS on Au deposited by different methods is discussed. The results indicate that liquid deposition of MPTMS provides the strongest adhesion between Au and PDMS among the different deposition methods and the different linker molecules. Based on these studies, the Au patterns with linewidth of less 2 μm were successfully transferred to PDMS with reliable and strong bonding in a full 3 inch wafer scale, using a dry peel-off process. (Some figures may appear in colour only in the online journal)

Integration of functional materials and surface modification for polymeric microfluidic systems

Abstract: The opportunity for the commercialization of microfluidic systems has surged over the recent decade, primarily for medical and the life science applications. This positive development has been spurred by an increasing number of integrated, highly functional lab-on-a-chip technologies from the research community. Toward commercialization, there is a dire need for economic manufacture which involves optimized cost for materials and structuring on the front-end as well as for a range of back-end processing steps such as surface modification, integration of functional elements, assembly and packaging. Front-end processing can readily resort to very well established polymer mass fabrication schemes, e.g. injection molding. Also assembly and packaging can often be adopted from commercially available processes. In this review, we survey the back-end processes of hybrid material integration and surface modification which often need to be tailored to the specifics of miniaturized polymeric microfluidic systems. On the one hand, the accurate control of these back-end processes proves to be the key to the technical function of the system and thus the value creation. On the other hand, the integration of functional materials constitutes a major cost factor. (Some figures may appear in colour only in the online journal)

Injection molding of high aspect ratio sub-100?nm nanostructures

Abstract: We have explored the use of mold coatings and optimized processing conditions to injection mold high aspect ratio nanostructures (height-to-width >1) in cyclic olefin copolymer (COC). Optimizing the molding parameters on uncoated nickel molds resulted in slight improvements in replication quality as described by height, width and uniformity of the nanoscopic features. Use of a mold temperature transiently above the polymer glass transition temperature (Tg) was the most important factor in increasing the replication fidelity. Surface coating of the nickel molds with a fluorocarbon-containing thin film (FDTS) greatly enhanced the quality of replicated features, in particular at transient mold temperatures above Tg. Injection molding using the latter mold temperature regime resulted in a bimodal distribution of pillar heights, corresponding to either full or very poor replication of the individual pillars. The poorly replicated structures on nickel molds with or without FDTS coatings all appeared fractured. We investigated the underlying mechanism in a macroscopic model system and found reduced wetting and strongly decreased adhesion of solidified COC droplets on nickel surfaces after coating with FDTS. Reduced adhesion forces are consistent with lowered friction that reduces the risk of fracturing the nanoscopic pillars during demolding. Optimized mold surface chemistry and associated injection molding conditions permitted the fabrication of square arrays of 40 nm wide and 107 nm high (aspect ratio >2.5) pillars on a 200 nm pitch.

CO2 laser cutting and ablative etching for the fabrication of paper-based devices

Abstract: We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.

Flat and robust out-of-plane vibrational electret energy harvester

Abstract: This paper reports the design, fabrication and testing of two types of out-of-plane electret energy harvesters. Copper plates and flexible printed circuit board (FPCB) were used to fabricate the harvesters for a lower fabrication cost and a more robust structure. Several dielectric materials were investigated and SiO2/Si3N4?double layers were found to have better charge stability. The measured surface potential and charge density of the SiO2/Si3N4?electret were??400?V and 13.5 mC m?2, respectively. It was found that charge stability could be improved by multiple corona charging cycles. Using SiO2/Si3N4?as the electret material, the measured power output was 20.7??W at 110?Hz for 2?G acceleration with a 50?M? load for the copper harvester and 0.82??W at 172?Hz for 2?G acceleration with a 30?M? load for the FPCB harvester.

Microinjection molding of microsystem components: new aspects in improving performance

Abstract: Microinjection molding (µIM) is considered to be one of the most flexible, reliable and cost effective manufacturing routes to form plastic micro-components for microsystems. The molding machine, mold tool fabrication, material selection and process controlling in this specific field have been greatly developed over the past decades. This review aims to present the new trends towards improving micro-component performance by reviewing the latest developments in this area and by considering potential directions. The key concerns in product and mold designing, essential factors in simulation, and micro-morphology and resultant properties are evaluated and discussed. In addition, the applications, variant processes and outlook for µIM are presented. Throughout this review, decisive considerations in seeking improved performance for microsystem components are highlighted.

Flat flexible polymer heat pipes

Abstract: Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid–vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.

A highly sensitive pressure sensor using a Au-patterned polydimethylsiloxane membrane for biosensing applications

Abstract: We report on the fabrication and characterization of a highly sensitive pressure sensor using a Au film patterned on a polydimethylsiloxane (PDMS) membrane. The strain-induced change in the film resistance was utilized to perform the quantitative measurement of absolute pressure. The highest sensitivity obtained for a 200 µm thick PDMS film sensor was 0.23/KPa with a range of 50 mm Hg, which is the best result reported so far, over that range, for any pressure sensor on a flexible membrane. The noise-limited pressure resolution was found to be 0.9 Pa (0.007 mm Hg), and a response time of ~200 ms, are the best reported results for these sensors. The ultrahigh sensitivity is attributed to the strain-induced formation of microcracks, the effect of which on the resistance change was found to be highly reversible within a certain pressure range. A physical model correlating the sensitivity with the sensor parameters and crack geometry has been proposed.

Micro-chip initiator realized by integrating Al/CuO multilayer nanothermite on polymeric membrane

Abstract: We have developed a new nanothermite based polymeric electro-thermal initiator for non-contact ignition of a propellant. A reactive Al/CuO multilayer nanothermite resides on a 100 µm thick SU-8/PET (polyethyleneterephtalate) membrane to insulate the reactive layer from the silicon bulk substrate. When current is supplied to the initiator, the chemical reaction Al+CuO occurs and sparkles are spread to a distance of several millimeters. A micro-manufacturing process for fabricating the initiator is presented and the electrical behaviors of the ignition elements are also investigated. The characteristics of the initiator made on a 100 µm thick SU-8/PET membrane were compared to two bulk electro-thermal initiators: one on a silicon and one on a Pyrex substrate. The PET devices give 100% of Al/CuO ignition success for an electrical current >250 mA. Glass based reactive initiators give 100% of Al/CuO ignition success for an electrical current >500 mA. Reactive initiators directly on silicon cannot initiate even with a 4 A current. At low currents (<1 A), the initiation time is two orders of magnitude longer for Pyrex initiator compared to those obtained for PET initiator technology. We also observed that, the Al/CuO thermite film on PET membrane reacts within 1 ms (sparkles duration) whereas it reacts within 4 ms on Pyrex. The thermite reaction is 40 times greater in intensity using the PET substrate in comparison to Pyrex.

Enhancement of the thermo-mechanical properties of PDMS molds for the hot embossing of PMMA microfluidic devices

Abstract: We present a cost-efficient and rapid prototyping technique for polymethylmethacrylate (PMMA) microfluidic devices using a polydimethylsiloxane (PDMS)-based hot embossing process. Compared to conventional hot embossing methods, this technique uses PDMS molds with enhanced thermo-mechanical properties. To improve the replication performance, increases in both PDMS stiffness and hardness were achieved through several processing and curing means. First, the amount of curing agent was increased from 1/10 to 1/5 with respect to the amount of prepolymer. Second, the cured PDMS was thermally aged either over three days at 85 ◦ C or for 30 min at 250 ◦ C. Those combined steps led to increases in stiffness and hardness of up to 150% and 32%, respectively, as compared to standard PDMS molds. Using these enhanced molds, structures with features of the order of 100 μm in PMMA are successfully embossed using a standard laboratory press at 150 ◦ C. The PDMS molds and process produce identical structures through multiple embossing cycles (10) without any mold damage or deterioration. A Y-shaped microfluidic mixer was fabricated with this technique. The successful demonstration of this enhanced PDMS-based hot embossing technique introduces a new approach for the rapid prototyping of polymer-based microfluidic devices at low-cost. (Some figures may appear in colour only in the online journal)

An electret-based energy harvesting device with a wafer-level fabrication process

Abstract: This paper presents a MEMS energy harvesting device which is able to generate power from two perpendicular ambient vibration directions. A CYTOP polymer is used both as the electret material for electrostatic transduction and as a bonding interface for low-temperature wafer bonding. The device consists of a four-wafer stack, and the fabrication process for each wafer layer is described in detail. All the processes are performed at wafer scale, so that overall 44 devices can be fabricated simultaneously on one 4-inch wafer. The effect of fabrication issues on the resonant frequency of the device is also discussed. With a final chip size of about 1 cm2, a power output of 32.5 nW is successfully harvested with an external load of 17 MΩ, when a harmonic vibration source with an RMS acceleration amplitude of 0.03 g (∼0.3 m s−2) and a resonant frequency of 179 Hz is applied. These results can be improved in an optimized design.

Fabrication of 3D fractal structures using nanoscale anisotropic etching of single crystalline silicon

Abstract: When it comes to high-performance filtration, separation, sunlight collection, surface charge storage or catalysis, the effective surface area is what counts. Highly regular fractal structures seem to be the perfect candidates, but manufacturing can be quite cumbersome. Here it is shown-–for the first time—that complex 3D fractals can be engineered using a recursive operation in conventional micromachining of single crystalline silicon. The procedure uses the built-in capability of the crystal lattice to form self-similar octahedral structures with minimal interference of the constructor. The silicon fractal can be used directly or as a mold to transfer the shape into another material. Moreover, they can be dense, porous, or like a wireframe. We demonstrate, after four levels of processing, that the initial number of octahedral structures is increased by a factor of 625. Meanwhile the size decreases 16 times down to 300 nm. At any level, pores of less than 100 nm can be fabricated at the octahedral vertices of the fractal. The presented technique supports the design of fractals with Hausdorff dimension D free of choice and up to D = 2.322.

Inertial focusing in a straight channel with asymmetrical expansion–contraction cavity arrays using two secondary flows

Abstract: The focusing of particles has a variety of applications in industry and biomedicine, including wastewater purification, fermentation filtration, and pathogen detection in flow cytometry, etc. In this paper a novel inertial microfluidic device using two secondary flows to focus particles is presented. The geometry of the proposed microfluidic channel is a simple straight channel with asymmetrically patterned triangular expansion–contraction cavity arrays. Three different focusing patterns were observed under different flow conditions: (1) a single focusing streak on the cavity side; (2) double focusing streaks on both sides; (3) half of the particles were focused on the opposite side of the cavity, while the other particles were trapped by a horizontal vortex in the cavity. The focusing performance was studied comprehensively up to flow rates of 700 µl min−1. The focusing mechanism was investigated by analysing the balance of forces between the inertial lift forces and secondary flow drag in the cross section. The influence of particle size and cavity geometry on the focusing performance was also studied. The experimental results showed that more precise focusing could be obtained with large particles, some of which even showed a single-particle focusing streak in the horizontal plane. Meanwhile, the focusing patterns and their working conditions could be adjusted by the geometry of the cavity. This novel inertial microfluidic device could offer a continuous, sheathless, and high-throughput performance, which can be potentially applied to high-speed flow cytometry or the extraction of blood cells.

Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging

Abstract: We present a novel method for the fabrication of void-free copper-filled through-glass-vias (TGVs), and their application to the wafer-level radio frequency microelectromechanical systems (RF MEMS) packaging scheme. By using the glass reflow process with a patterned silicon mold, a vertical TGV with smooth sidewall and fine pitch could be achieved. Bottom-up void-free filling of the TGV is successfully demonstrated through the seedless copper electroplating process. In addition, the proposed process allows wafer-level packaging with glass cap encapsulation using the anodic bonding process, since the reflowed glass interposer is only formed in the device area surrounded with silicon substrate. A simple coplanar waveguide (CPW) line was employed as the packaged device to evaluate the electrical characteristics and thermo-mechanical reliability of the proposed packaging structure. The fabricated packaging structure showed a low insertion loss of 0.116 dB and a high return loss of 35.537 dB at 20 GHz, which were measured through the whole electrical path, including the CPW line, TGVs and contact pads. An insertion loss lower than 0.1 dB and a return loss higher than 30 dB could be achieved at frequencies of up to 15 GHz, and the resistance of the single copper via was measured to be 36 mΩ. Furthermore, the thermo-mechanical reliability of the proposed packaging structure was also verified through thermal shock and pressure cooker test.

Nonlinear dynamics of an electrically actuated imperfect microbeam resonator: Experimental investigation and reduced-order modeling

Abstract: We present a study of the dynamic behavior of a microelectromechanical systems (MEMS) device consisting of an imperfect clamped–clamped microbeam subjected to electrostatic and electrodynamic actuation. Our objective is to develop a theoretical analysis, which is able to describe and predict all the main relevant aspects of the experimental response. Extensive experimental investigation is conducted, where the main imperfections coming from microfabrication are detected, the first four experimental natural frequencies are identified and the nonlinear dynamics are explored at increasing values of electrodynamic excitation, in a neighborhood of the first symmetric resonance. Several backward and forward frequency sweeps are acquired. The nonlinear behavior is highlighted, which includes ranges of multistability, where the nonresonant and the resonant branch coexist, and intervals where superharmonic resonances are clearly visible. Numerical simulations are performed. Initially, two single mode reduced-order models are considered. One is generated via the Galerkin technique, and the other one via the combined use of the Ritz method and the Pade approximation. Both of them are able to provide a satisfactory agreement with the experimental data. This occurs not only at low values of electrodynamic excitation, but also at higher ones. Their computational efficiency is discussed in detail, since this is an essential aspect for systematic local and global simulations. Finally, the theoretical analysis is further improved and a two-degree-of-freedom reduced-order model is developed, which is also capable of capturing the measured second symmetric superharmonic resonance. Despite the apparent simplicity, it is shown that all the proposed reduced-order models are able to describe the experimental complex nonlinear dynamics of the device accurately and properly, which validates the proposed theoretical approach.

Surface acoustic wave devices on AlN/3C-SiC/Si multilayer structures

Abstract: Surface acoustic wave (SAW) propagation characteristics in a multilayer structure including a piezoelectric aluminum nitride (AlN) thin film and an epitaxial cubic silicon carbide (3C–SiC) layer on a silicon (Si) substrate are investigated by theoretical calculation in this work. Alternating current (ac) reactive magnetron sputtering was used to deposit highly c-axis-oriented AlN thin films, showing the full width at half maximum (FWHM) of the rocking curve of 1.36° on epitaxial 3C–SiC layers on Si substrates. In addition, conventional two-port SAW devices were fabricated on the AlN/3C–SiC/Si multilayer structure and SAW propagation properties in the multilayer structure were experimentally investigated. The surface wave in the AlN/3C–SiC/Si multilayer structure exhibits a phase velocity of 5528 m s−1 and an electromechanical coupling coefficient of 0.42%. The results demonstrate the potential of AlN thin films grown on epitaxial 3C–SiC layers to create layered SAW devices with higher phase velocities and larger electromechanical coupling coefficients than SAW devices on an AlN/Si multilayer structure. Moreover, the FWHM values of rocking curves of the AlN thin film and 3C–SiC layer remained constant after annealing for 500 h at 540 °C in air atmosphere. Accordingly, the layered SAW devices based on AlN thin films and 3C–SiC layers are applicable to timing and sensing applications in harsh environments.

Modeling and bonding-free fabrication of flexible fluidic microactuators with a bending motion

Abstract: Flexible fluidic actuators recently attracted the interest of the microsystem community, especially for soft robotic applications including minimally invasive surgery. These actuators, based on a well-known actuator design where a void is surrounded by an asymmetric elastic structure, can achieve large bending strokes when pressurized. Miniaturized versions of these actuators typically fail due to poor bonding of constituting components, and further, there is little theoretical understanding of these devices. This paper presents a new actuator design which does not require any bonding and provides new insights into the modeling of these actuators. The newly developed production process of the actuators is based on out-of-plane high aspect ratio micromolding, which enables high-throughput bonding-free fabrication. Furthermore, a mathematical model based on Euler–Bernoulli's beam equation with a deformable cross section is developed that shows good agreement with validation experiments on prototypes. These theoretical insights greatly facilitate the design and optimization of flexible bending actuators.

A novel generation of 3D SAR-based passive micromixer: efficient mixing and low pressure drop at a low Reynolds number

Abstract: This study introduces a novel generation of 3D splitting and recombination (SAR) passive micromixer with microstructures placed on the top and bottom floors of microchannels called a ?chain mixer?. Both experimental verification and numerical analysis of the flow structure of this type of passive micromixer have been performed to evaluate the mixing performance and pressure drop of the microchannel, respectively. We propose here two types of chain mixer?chain 1 and chain 2?and compare their mixing performance and pressure drop with other micromixers, T-, o- and tear-drop micromixers. Experimental tests carried out in the laminar flow regime with a low Reynolds number range, 0.083 ? Re ? 4.166, and image-based techniques are used to evaluate the mixing efficiency. Also, the computational fluid dynamics code, ANSYS FLUENT-13.0 has been used to analyze the flow and pressure drop in the microchannel. Experimental results show that the chain and tear-drop mixer's efficiency is very high because of the SAR process: specifically, an efficiency of up to 98% can be achieved at the tested Reynolds number. The results also show that chain mixers have a lower required pressure drop in comparison with a tear-drop micromixer.

Two-step flash light sintering process for crack-free inkjet-printed Ag films

Abstract: In this paper, a two-step flash light sintering process for inkjet-printed Ag films is investigated with the aim of improving the quality of sintered Ag films The flash light sintering process is divided into two steps: a preheating step and a main sintering step The preheating step is used to remove the organic binder without abrupt vaporization The main sintering step is used to complete the necking connections among the silver nanoparticles and achieve high electrical conductivity The process minimizes the damage on the polymer substrate and the interface between the sintered Ag film and polymer substrate The electrical conductivity is calculated by measuring the resistance and cross-sectional area with an LCR meter and 3D optical profiler, respectively It is found that the resistivity of the optimal flash light-sintered Ag films (3632 n? m), which is 22886% of that of bulk silver, is lower than that of thermally sintered ones (4084 n? m) Additionally, the polyimide film used as the substrate is preserved with the inkjet-printed pattern shape during the flash light sintering process without delamination or defects

Fabrication of a two-dimensional piezoelectric micromachined ultrasonic transducer array using a top-crossover-to-bottom structure and metal bridge connections

Abstract: A new design methodology and fabrication process for two-dimensional (2D) piezoelectric micromachined ultrasonic transducer (pMUT) arrays using a top-crossover-to-bottom (TCTB) structure was developed. Individual sensing and actuation of pMUT elements from a small number of connection lines was enabled by the TCTB structure, and the parasitic coupling capacitance of the array was significantly reduced as a result. A 32 × 32 pMUT array with a TCTB structure was fabricated, resulting in 64 connection lines over an area of 4.8 × 4.8 mm2. The top electrodes for each pMUT element were re-connected by metal bridging after bottom-electrode etching caused them to become disconnected. A deep reactive ion etching process was used to compactify the array. Each pMUT element was a circular-shaped K31-type ultrasonic transducer using a 1 µm thick sol–gel lead zirconate titanate (PZT: Pb1.10 Zr0.52 Ti0.48) thin film. To characterize a single element in the 2D pMUT array, the resonant frequency and coupling coefficient of 20 pMUT elements were averaged to 3.85 MHz and 0.0112, respectively. The maximum measured ultrasound intensity in water, measured at a distance of 4 mm, was 4.6 µW cm−2 from a single pMUT element driven by a 5 Vpp sine wave at 2.22 MHz. Potential applications for development of a TCTB-arranged 2D pMUT array include ultrasonic medical imaging, ultrasonic communication, ultrasonic range-finding and handwriting input systems.

Effect of thermal treatment on the chemical resistance of polydimethylsiloxane for microfluidic devices

Abstract: We investigated the use of thermally treated polydimethylsiloxane (PDMS) for chemically-resistant microchannels. When the PDMS underwent the thermal treatment at 300 °C, swelling was reduced and the surface of the PDMS microfluidic channel endured well in the extracting media such as dichloromethane. Furthermore, despite the small decrease in size after thermal treatment, both the channel shape and transparency were maintained without showing fluid leakage. The thermally treated PDMS had more hydrophilic properties compared to the untreated PDMS. A single step post-casting process described in this work does not require complex chemical treatments or introduction of foreign materials to the host PDMS substrate, thus expanding the application area of PDMS-based microfluidics.

Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

Abstract: This work presents the simultaneous fabrication of ambient relative humidity (RH) and temperature sensors arrays, inkjet-printed on flexible substrates and subsequently encapsulated at foil level. These sensors are based on planar interdigitated capacitors with an inkjet-printed sensing layer and meander-shaped resistors. Their combination allows the compensation of the RH signals variations at different temperatures. The whole fabrication of the system is carried out at foil level and involves the utilization of additive methods such as inkjet-printing and electrodeposition. Electrodeposition of the printed lines resulted in an improvement of the thermoresistors. The sensors have been characterized and their performances analyzed. The encapsulation layer does not modify the performances of the sensors in terms of sensitivity or response time. This work demonstrates the potential of inkjet-printing in the large-area fabrication of light-weight and cost-efficient gas sensors on flexible substrates.

Ag dot morphologies printed using electrohydrodynamic (EHD) jet printing based on a drop-on-demand (DOD) operation

Abstract: Electrohydrodynamic (EHD) jet printing technology is an attractive method for micro-scale electronic device fabrication. The primary advantage of EHD jet printing compared with conventional inkjet printing is the capability to print at resolutions below 10 µm and to eject high-viscosity ink. In this study, by using drop-on-demand (DOD) jetting, we printed silver (Ag) dots onto a silicon (Si)-wafer and evaluated the dot uniformity. Furthermore, we investigated the effects of substrate surface energy and substrate temperature on the dot morphology. We also investigated the effects of overprinting on the dot morphologies. Our results show that we successfully created uniform dot patterns under 10 µm by using EHD jet printing. In addition the dot diameter approached 14 µm while the substrate was heated up to 40 °C. We also found that on the hydrophobic Si-wafer, increasing the substrate temperature and the number of overprinting could be used as an alternative method for increasing the aspect ratio of dot and suppressing the coffee-stain effect.

Parametrically excited MEMS vibration energy harvesters with design approaches to overcome the initiation threshold amplitude

Abstract: Resonant-based vibration harvesters have conventionally relied upon accessing the fundamental mode of directly excited resonance to maximize the conversion efficiency of mechanical-to-electrical power transduction. This paper explores the use of parametric resonance, which unlike the former, the resonant-induced amplitude growth, is not limited by linear damping and wherein can potentially offer higher and broader nonlinear peaks. A numerical model has been constructed to demonstrate the potential improvements over the convention. Despite the promising potential, a damping-dependent initiation threshold amplitude has to be attained prior to accessing this alternative resonant phenomenon. Design approaches have been explored to passively reduce this initiation threshold. Furthermore, three representative MEMS designs were fabricated with both 25 and 10 ?m thick device silicon. The devices include electrostatic cantilever-based harvesters, with and without the additional design modification to overcome initiation threshold amplitude. The optimum performance was recorded for the 25 ?m thick threshold-aided MEMS prototype with device volume ?0.147?mm3. When driven at 4.2?ms?2, this prototype demonstrated a peak power output of 10.7 nW at the fundamental mode of resonance and 156 nW at the principal parametric resonance, as well as a 23-fold decrease in initiation threshold over the purely parametric prototype. An approximate doubling of the half-power bandwidth was also observed for the parametrically excited scenario.