Journal ArticleDOI
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Yi Li,Ching-Ping Wong +1 more
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TLDR
In this article, the authors discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry, and discuss the potential of ECAs to replace tin-lead metal solders in all applications.Abstract:
Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element to another. There are increasing concerns with the use of tin–lead alloy solders in recognition of hazards of using lead. Lead-free solders and electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of tin-lead solder. ECAs consist of a polymeric resin (such as, an epoxy, a silicone, or a polyimide) that provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and a metal filler (such as, silver, gold, nickel or copper) that conducts electricity. ECAs offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions (enabling the use of heat-sensitive and low-cost components and substrates), fewer processing steps (reducing processing cost), low stress on the substrates, and fine pitch interconnect capability (enabling the miniaturization of electronic devices). Therefore, conductive adhesives have been used in liquid crystal display (LCD) and smart card applications as an interconnect material and in flip–chip assembly, chip scale package (CSP) and ball grid array (BGA) applications in replacement of solder. However, no currently commercialized ECAs can replace tin–lead metal solders in all applications due to some challenging issues such as lower electrical conductivity, conductivity fatigue (decreased conductivity at elevated temperature and humidity aging or normal use condition) in reliability testing, limited current-carrying capability, and poor impact strength. Considerable research has been conducted recently to study and optimize the performance of ECAs, such as electrical, mechanical and thermal behaviors improvement as well as reliability enhancement under various conditions. This review article will discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry.read more
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Proceedings ArticleDOI
Electrical properties of ACA joints assisted by conjugated molecular wires
TL;DR: In this paper, conjugated dithiols were incorporated into ACA formulations to construct the molecular wire junction between conductive fillers and metal pads to facilitate the electron transport through the joint.
Journal ArticleDOI
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints
TL;DR: In this article, the effect of printed circuit board (PCB) and component finishes on the reliability of isotropic conducting adhesives (ICAs) joints was investigated. And the results showed that the effect was very adhesive material dependent.
Proceedings ArticleDOI
Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment
TL;DR: In this article, a reflectionmode photoplethysmographic (rPPG) patch probe has been used for non-invasive physiological assessment through electrically conductive adhesives (ECAs) based manufacture processes.
Proceedings ArticleDOI
Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package
Hanshuang Liang,Todd Houghton,Zeming Song,Teng Ma,Hoa Nguyen,George Chen,Hanqing Jiang,Hongbin Yu +7 more
TL;DR: In this paper, a 2D laser scanning technique is used to map the 2D strain distribution within an electronic package, which can help improve the structure or layout design of mechanical and electronic devices.
Proceedings ArticleDOI
Transmission property of adhesive interconnect for high frequency applications
TL;DR: In this paper, the effects of two chip materials, Si and gallium arsenide (GaAs), and the metal pattern gap between the signal line and ground plane in the coplanar waveguide (CPW) on the RF performance of the flip chip module were investigated.
References
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Book
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Journal ArticleDOI
Lead-free Solders in Microelectronics
Mulugeta Abtew,Guna S Selvaduray +1 more
TL;DR: The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.
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