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Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Yi Li,Ching-Ping Wong +1 more
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TLDR
In this article, the authors discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry, and discuss the potential of ECAs to replace tin-lead metal solders in all applications.Abstract:
Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element to another. There are increasing concerns with the use of tin–lead alloy solders in recognition of hazards of using lead. Lead-free solders and electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of tin-lead solder. ECAs consist of a polymeric resin (such as, an epoxy, a silicone, or a polyimide) that provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and a metal filler (such as, silver, gold, nickel or copper) that conducts electricity. ECAs offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions (enabling the use of heat-sensitive and low-cost components and substrates), fewer processing steps (reducing processing cost), low stress on the substrates, and fine pitch interconnect capability (enabling the miniaturization of electronic devices). Therefore, conductive adhesives have been used in liquid crystal display (LCD) and smart card applications as an interconnect material and in flip–chip assembly, chip scale package (CSP) and ball grid array (BGA) applications in replacement of solder. However, no currently commercialized ECAs can replace tin–lead metal solders in all applications due to some challenging issues such as lower electrical conductivity, conductivity fatigue (decreased conductivity at elevated temperature and humidity aging or normal use condition) in reliability testing, limited current-carrying capability, and poor impact strength. Considerable research has been conducted recently to study and optimize the performance of ECAs, such as electrical, mechanical and thermal behaviors improvement as well as reliability enhancement under various conditions. This review article will discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry.read more
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Die Attach Materials for High Temperature Applications: A Review
TL;DR: This literature work seeks to review the numerous research attempts thus far for high temperature die attach materials on wide band gap materials of silicon carbide, gallium nitride and diamond, document their successes, concerns and application possibilities, all of which are essential for highTemperature reliability.
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An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre-Mimetic 3D Network
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An overview of multifunctional epoxy nanocomposites
TL;DR: The state-of-the-art multifunctional epoxy nanocomposites with magnetic, electrically conductive, thermally conductive and flame retardant properties of the past few years are reviewed in this article.
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High-Temperature Lead-Free Solders: Properties and Possibilities
Journal ArticleDOI
E-waste: a problem or an opportunity? Review of issues, challenges and solutions in Asian countries:
Sunil Herat,Pariatamby Agamuthu +1 more
TL;DR: This article aims to present a review of challenges and issues faced by Asian countries in managing their e-waste in a sustainable way.
References
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Journal ArticleDOI
Adhesion of polyimide to annealed 301 stainless-steel films
TL;DR: In this paper, several chemical treatments for the surface preparation of 301 austenitic stainless steel for bonding to polyimide films of pyromellitic dianhydride-oxydianiline (PMDA-ODA) are compared and characterized by means of surface analysis.
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