Patent
Semiconductor light emitting diodes having reflective structures and methods of fabricating same
Reads0
Chats0
TLDR
In this paper, a diode region having first and second opposing faces is described, where an n-type and a p-type layer, an anode contact that ohmically contacts the p type layer and extends on the first face, and a cathode contact, which is configured to reflect substantially all light that emerges from a first face back into the second face.Abstract:
Light emitting diodes include a diode region having first and second opposing faces that include therein an n-type layer and a p-type layer, an anode contact that ohmically contacts the p-type layer and extends on the first face, and a cathode contact that ohmically contacts the n-type layer and also extends on the first face. The anode contact and/or the cathode contact may further provide a hybrid reflective structure on the first face that is configured to reflect substantially all light that emerges from the first face back into the first face. Related fabrication methods are also described.read more
Citations
More filters
Patent
Light emitting diode package
TL;DR: In this paper, a light-emitting diode package is described, consisting of a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in serial with each other, and a fluorescent body for converting the wavelength of light emitted by the light emitting diodes.
Patent
Semiconductor light-emitting device and method for manufacturing same
Akihiro Kojima,Yoshiaki Sugizaki +1 more
TL;DR: In this paper, a semiconductor light-emitting device is described, which consists of a light emitting layer and a light blocking member provided on a side surface of the semiconductor layer and being opaque to light emitted from the light emitting layers.
Patent
Semiconductor light-emitting device and method of manufacturing the same
Jong-in Yang,Taehyung Kim,Si-hyuk Lee,Sang-Yeob Song,Cheolsoo Sone,Hak-Hwan Kim,Jin-Hyun Lee +6 more
TL;DR: In this article, a semiconductor light-emitting device is described, which consists of a first electrode layer, an insulating layer, a second electrode layer and an active layer that are sequentially stacked on a substrate.
Patent
Light Emitting Device
TL;DR: By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organics layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathodes, and transmission of the injected electrons can also be performed with good efficiency as discussed by the authors.
Patent
Wafer-level light emitting diode package and method of fabricating the same
Won Cheol Seo,Dae Sung Cho +1 more
TL;DR: In this article, a wafer-level light emitting diode (LED) package and a method of fabricating the same is described. But the method is not suitable for the fabrication of a large number of LEDs.
References
More filters
Journal ArticleDOI
30-W/mm GaN HEMTs by field plate optimization
Yifeng Wu,Adam William Saxler,Marcia Moore,R.P. Smith,Scott Sheppard,P. Chavarkar,T. Wisleder,Umesh K. Mishra,P. Parikh +8 more
TL;DR: In this article, a GaN high-electron-mobility-transistors (HEMTs) on SiC were fabricated with field plates of various dimensions for optimum performance, and an enhancement in radio frequency (RF) current-voltage swings was achieved with acceptable compromise in gain, through both reduction in the trapping effect and increase in breakdown voltages.
Journal ArticleDOI
30% external quantum efficiency from surface textured, thin‐film light‐emitting diodes
TL;DR: In this article, the authors showed that by separating thin-film LEDs from their substrates (by epitaxial lift-off, for example), it is much easier for light to escape from the LED structure and thereby avoid absorption.
Patent
Power surface mount light emitting die package
TL;DR: In this article, a light emitting die package includes a substrate, a reflector plate, and a lens, which can be raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip.
Patent
Multiple encapsulation of phosphor-LED devices
TL;DR: In this article, a semiconductor device has a light-emitting diode covered by a transparent spacer which separates the LED from a uniformly thick fluorescent material containing layer such that there is a more uniform lighting of the fluorescent material to provide a uniform white light.
Patent
Enhanced light extraction in LEDs through the use of internal and external optical elements
TL;DR: In this paper, the authors describe new LEDs having light extraction structures (26) on or within the LED to increase its efficiency, providing surfaces for reflecting, refracting or scattering light into directions that are more favorable for the light to escape into the package.
Related Papers (5)
Wafer-level light emitting diode package and method of fabricating the same
Won Cheol Seo,Dae Sung Cho +1 more