Proceedings ArticleDOI
Thermal analysis of thermal spreaders used in power electronics cooling
Yvan Avenas,M. Ivanova,N. Popova,C. Schaeffer,Jean-Luc Schanen,A. Bricard +5 more
- Vol. 1, pp 216-221
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TLDR
In this article, a 40% decrease of thermal resistance between the heat source and the ambient is expected, and thermal simulations on copper/water and silicon/water heat pipes are provided.Abstract:
Currently the thermal losses of power electronic devices like IGBTs are increasing. At the same time, their sizes are decreasing. Consequently heat sinks have to dissipate very large heat flux densities. Therefore the thermal environment is a main issue in their performance and reliability. In order to improve heat transfers, materials with high thermal conductivity seem very interesting. Because they are expensive, we propose to replace them with heat pipes. Firstly an experimental study is described in order to show the interests of heat pipes in power electronics cooling. Then thermal simulations on copper/water and silicon/water heat pipes are provided. Thanks to them, heat spreaders made with heat pipes and heat spreaders made with plain material are compared. A 40% decrease of the thermal resistance between the heat source and the ambient is expected.read more
Citations
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Experimental investigations of flat plate heat pipes with interlaced narrow grooves or channels as capillary structure
TL;DR: In this article, two different flat plate heat pipes (FPHPs) are tested in different heat fluxes and working fluid filling ratios, and the temperature fields and overall thermal resistances of the heat pipes under different experimental conditions are studied.
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Numerical simulation and experimental verification of a flat two-phase thermosyphon
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Proceedings ArticleDOI
Numerical simulation on heat pipe for high power LED multi-chip module packaging
TL;DR: In this paper, a new packaging architecture the system in package (SiP) configuration is used in the high power LED packaging, and a copper/water miniature heat pipe is chosen to dissipate heat based on the LED packaging structure and the input power of the system.
References
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Book
Heat Pipe Science And Technology
TL;DR: In this article, the authors present a detailed analysis of non-conventional heat pipe properties, including variable conductance heat pipes, and their properties in terms of heat transfer and mass transfer.
Journal ArticleDOI
Flat Miniature Heat Pipes With Micro Capillary Grooves
TL;DR: In this article, a detailed experimental and theoretical analysis on maximum heat transfer capabilities of two copper-water FMHP's with diagonal trapezoidal micro capillary grooves and one copper water FMHP with axial rectangular micro-capillary grasps is presented.
Journal ArticleDOI
Experiments and Analyses of Flat Miniature Heat Pipes
TL;DR: In this article, two flat copper-water axially grooved miniature heat pipes are fabricated employing the electric-discharge-machining (EDM) wire-cutting method.
Journal ArticleDOI
Ultrahigh-capacity micromachined heat spreaders
TL;DR: In this paper, micro heat pipes and micro-scale flat-plate heat pipes are examined as an alternative to polycrystalline diamond or aluminum nitride (AIN) ceramic heat spreaders.
Silicon heat pipes for cooling electronics
TL;DR: In this article, the authors investigated the feasibility of using a 635 mm (25 mil) thick silicon substrate with embedded heat pipes to transfer heat away from the chip and showed that it is both technically and commercially feasible.