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Tin-based reactive solders for ceramic/metal joints

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TLDR
In this article, contact angle measurements on silicon-nitride substrates were conducted on tin-based alloys, containing titanium and zirconium, to determine the suitability of these alloys as filler metals for low-temperature joining of ceramics.
Abstract
Contact angle measurements on silicon-nitride substrates were conducted on tin-based alloys, containing titanium and zirconium, to determine the suitability of these alloys as filler metals for low-temperature joining of ceramics. Titanium-containing alloys exhibited excellent wettability characterized by contact angles less than 20 deg, whereas the Zr-containing alloys exhibited contact angles around 50 deg. The superior wettability of the Sn−Ti alloys is attributed to the higher activity coefficient of Ti in Sn−Ti alloys. The liquidus temperature of the Sn−Ti alloys is in the 400°C to 600°C range. Hence, these alloys are expected to reduce the residual stress problem.

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Advances in brazing of ceramics

TL;DR: The main parameters in direct brazing of ceramics to metals are reviewed in this article, with primary emphasis on those influencing wetting of solid ceramic materials by liquid filler metals, which has provided a basis for substantial reduction of the contact angle.
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Wetting of ceramic materials by liquid silicon, aluminium and metallic melts containing titanium and other reactive elements: A review

TL;DR: In this paper, a special effort is made to analyse the Ti-induced wetting of ceramics in terms of the chemical reactivity and interface microchemistry. And the importance of interactions between the interfacially active element (Ti) and other alloying elements in the metallic melts is elucidated with numerous experimental results.
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Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics

TL;DR: In this article, the wettability of Sn3.5Ag4Ti(Ce,Ga) solder was determined at temperatures 800, 850 and 900 degrees in dependence on wetting time.
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Microstructural Evolution at the Bonding Interface during the Early-Stage Infrared Active Brazing of Alumina

TL;DR: In this paper, infrared brazing of Al2O3 and alloy 42 using a silver-base active braze alloy was investigated at 900 °C for 0 to 300 seconds, with a heating rate of 3000 °C/min.
Journal ArticleDOI

Interlayer design for joining pressureless sintered sialon ceramic and 40Cr steel brazing with Ag57Cu38Ti5 filler metal

TL;DR: In this article, an interlayer design and test was made to enhance the joining strength of the pressureless sintered sialon ceramic and 40Cr steel, which was performed by vacuum brazing using Ag57Cu38Ti5 filler metal.
References
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Book

Binary alloy phase diagrams

TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
Journal ArticleDOI

Model predictions for the enthalpy of formation of transition metal alloys II

TL;DR: In this article, the authors present a computer program in Algol 60 by means of which enthalpy effects can be calculated for binary alloys in which at least one transition metal is involved.
Book

Free Energy of Formation of Binary Compounds: An Atlas of Charts for High-Temperature Chemical Calculations

TL;DR: The most important thermodynamic quantity for the practicing chemist is the Gibbs free-energy change, ΔG, which accompanies any reaction as mentioned in this paper, which can be calculated from the standard free energy of formation, δGf, of the species involved.
Journal ArticleDOI

The wetting of alumina and vitreous carbon by copper-tin-titanium alloys

TL;DR: In this paper, the wetting behavior of copper-rich copper-tin-titanium alloys on alumina and vitreous carbon substrates was determined using the sessile drop technique.
Journal ArticleDOI

Oxidation Behavior of Silver- and Copper-Based Brazing Filler Metals for Silicon Nitride/Metal Joints

TL;DR: In this article, the oxidation behavior of reactive-element-containing brazing filler metals at 600°C was studied, and it was shown that adding Ni and Si to these alloys failed to reduce spallation.
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