Proceedings ArticleDOI
Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact
Seungbae Park,Chirag Shah,Jae Kwak,Changsoo Jang,James M. Pitarresi,Tae-Sang Park,Se-Young Jang +6 more
- pp 914-923
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TLDR
In this paper, a non-contact optical technique has been proposed for measurement of full-field impact response using a pair of synchronized high-speed cameras captured the images of board assembly subjected to JEDEC standard impact, at rates up to 15,000 pictures per second.Abstract:
Product durability due to drop shock is a critical element for assessment of reliability for handheld devices. So far, no simulation model for a board-level drop has been extensively validated by experiments for its predictions of global (full-field) dynamic response. Accelerometers and strain gages which are traditionally utilized to measure the response at selected locations, fail to assess the global strain gradients and complex mode shapes. In this work, a novel non-contact optical technique has been proposed for measurement of full-field impact response. Pair of synchronized high-speed cameras capture the images of board assembly subjected to JEDEC standard impact, at rates up to 15,000 pictures per second. A digital image correlation (DIC) system has been integrated with the cameras to analyze the acquired images to give dynamic deformation, shape and strain over the entire surface of board during impact. A finite element model for the drop test has been developed using ANSYS/LS-DYNA. The numerical solution has been fully validated against experimental measurements of acceleration, strain and warpage at series of instants of time after impact. Effect of tightening torque at PCB mounts has been studied comprehensively with regards to the eigenvalues and mode shapes, and the necessity for accurate modeling of dynamic contact conditions existing at the supports has been demonstrated. Simulation model has been further used to assess the drop impact reliability of components on the board. Excellent correlation of all simulation results with the measured data validates the experimental and numerical propositions made in this work for analyzing a board-level drop impact.read more
Citations
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Proceedings ArticleDOI
Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact
TL;DR: In this paper, a relative damage index based on the lead-free interconnect transient strain history from digital image correlation, explicit finite-elements, cohesive-zone elements, and component's survivability envelope is developed for life-prediction of two-lead-free electronic alloy systems.
Journal ArticleDOI
Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration
TL;DR: In this article, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-lead-free solder alloy systems.
Journal ArticleDOI
Dynamic responses of PCB under product level free drop impact
TL;DR: A repeatable free-drop system is developed with an adjustable pair of forks to control the impact orientation during the guided free drop, and Digital Image Correlation technique is applied to measure and produce the full-field dynamic responses of PCB.
Journal ArticleDOI
The Effect of Solder Joint Microstructure on the Drop Test Failure—A Peridynamic Analysis
Javad Mehrmashhadi,Yuye Tang,Xiaoliang Zhao,Zhanping Xu,Jianbiao John Pan,Q. V. Le,Florin Bobaru +6 more
TL;DR: In this paper, the authors investigate the drop reliability of different solder joint microstructures using a coupled board-level finite element analysis and the microscale peridynamic (PD) simulations that can capture fracture in the heterogeneous solder joint.
Proceedings ArticleDOI
Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics
TL;DR: A peridynamic-theory based drop and shock model has been developed via finite element code using truss elements [Macek 2007] which enables the implementation of perid dynamic theory in a commercial finite-element platform.
References
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Journal ArticleDOI
Full-field dynamic displacement and strain measurement using advanced 3d image correlation photogrammetry: part 1
T. Schmidt,J. Tyson,K. Galanulis +2 more
Journal ArticleDOI
Impact life prediction modeling of TFBGA packages under board level drop test
TL;DR: For the first time, an accurate life prediction model is proposed for board level drop test to estimate the number of drops to failure for a package, and a failure-free state can be determined, and drop test performance of new package design can be quantified, and further enhanced through modeling.
Proceedings ArticleDOI
Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact
TL;DR: In this paper, a comprehensive dynamic responses of printed circuit board and solder joints, e.g., acceleration, strains, and resistance, are measured and analyzed with a multichannel real-time electrical monitoring system, and simulated with a novel input acceleration (Input-G) method.
Journal ArticleDOI
Full-field dynamic displacement and strain measurement—specific examples using advanced 3d image correlation photogrammetry: part ii
T. Schmidt,J. Tyson,K. Galanulis +2 more
Proceedings ArticleDOI
Modal analysis and dynamic responses of board level drop test
TL;DR: In this article, the effects of test variables, such as drop height, number of PCB mounting screws, tightness of screws, and number of felt layers, are studied by comparing and analyzing the dynamic responses.
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