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Patent

Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates

TLDR
In this paper, a laser via drilling system, and a method of use thereof, is provided, where the output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams.
Abstract
A laser via drilling system, and a method of use thereof, is provided. The apparatus uses two or more laser systems to achieve processing parameter flexibility. The output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams. The operational flexibility of the system can be further enhanced through the use of multiple EO modulators and a polarization sensitive beam splitter.

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Citations
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Patent

Laser irradiation apparatus

TL;DR: In this article, the uniformity of laser annealing can be improved by the minimum number of homogenizers, which is shown to be the case in the case of linear laser light.
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Energy efficient, laser-based method and system for processing target material

TL;DR: In this article, an energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided.
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Laser segmented cutting

TL;DR: In this paper, a long cut path is divided into short segments, from about 10 µm to 1 mm, and the laser output is scanned within a first short segment for a predetermined number of passes before being moved to and scanned within another short segment (122) for a certain time interval.
Patent

Femtosecond laser processing system with process parameters, controls and feedback

TL;DR: In this paper, a femtosecond laser based laser processing system has been proposed for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
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Methods and systems for thermal-based laser processing a multi-material device

TL;DR: In this article, a method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided.
References
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Patent

Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile

TL;DR: In this paper, a diode-pumped laser system incorporates a polarization state control device that provides a trim profile (84) having minimal striations (64) on a target material (42).
Patent

Topographer for real time ablation feedback having synthetic wavelength generators

TL;DR: In this article, a surface contouring system may be provided with a topographer to measure the surface contours using superheterodyne synthetic wavelength interferometry, which can be applied to diverse uses such as corneal ablation procedures, precision machining operations, and vibration analysis.
Patent

Method and device for stand-off laser drilling and cutting

TL;DR: In this article, a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave.
Patent

Multi-pulse laser beam generation method and device and laser beam machining method and apparatus using multi-pulse laser beam

TL;DR: In this article, a method and a device are provided for generating a multi-pulse laser beam including at least three laser beams, from a single pulse laser beam oscillated from the single laser beam source, with the beam in the first direction being outputted as a first pulse beam of the multiuser laser beam.
Patent

Apparatus and process for high speed laminate processing with computer generated holograms

TL;DR: In this article, an optical train is disclosed which enables large substrates to be processed from relatively small optical masks containing subaperture groups, which enables both ablation of local openings within the substrates and preparation of surfaces surrounding such openings for both cleansing of the working surface of the substrate as well as preparation of the surface for further processing such as plating.
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