Patent
Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
Roy D. Mead,Jeffrey W. Pierce +1 more
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TLDR
In this paper, a laser via drilling system, and a method of use thereof, is provided, where the output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams.Abstract:
A laser via drilling system, and a method of use thereof, is provided. The apparatus uses two or more laser systems to achieve processing parameter flexibility. The output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams. The operational flexibility of the system can be further enhanced through the use of multiple EO modulators and a polarization sensitive beam splitter.read more
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Laser irradiation apparatus
TL;DR: In this article, the uniformity of laser annealing can be improved by the minimum number of homogenizers, which is shown to be the case in the case of linear laser light.
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TL;DR: In this article, an energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided.
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Laser segmented cutting
TL;DR: In this paper, a long cut path is divided into short segments, from about 10 µm to 1 mm, and the laser output is scanned within a first short segment for a predetermined number of passes before being moved to and scanned within another short segment (122) for a certain time interval.
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Femtosecond laser processing system with process parameters, controls and feedback
TL;DR: In this paper, a femtosecond laser based laser processing system has been proposed for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.
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Methods and systems for thermal-based laser processing a multi-material device
James J. Cordingley,Jonathan S. Ehrmann,David M. Filgas,Shepard D. Johnson,Joohan Lee,Donald V. Smart,Donald J. Svetkoff +6 more
TL;DR: In this article, a method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided.
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Patent
Semiconductor laser highpower amplifier system
TL;DR: In this article, a high power laser optical amplifier system for material processing comprises multiple stage fiber amplifiers with rejection of propagating ASE buildup in and between the amplifier stages as well as elimination of SBS noise providing output powers in the range of about 10 μJ to about 100 μJ or more.
Patent
Method for rapid imaging of thermographic materials by extending exposure time in a single beam laser scanner
TL;DR: In this article, the authors used time domain integration (TDI) mode imaging to expose thermographic materials, such as thermal printing plates, which can not be properly exposed in single spot scanners such as internal drum scanners, but can be exposed by the extended exposure time of TDI scanning.