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Journal ArticleDOI

wall Superheat Excursions in the Boiling incipience of Dielectric Fluids

Avram Bar-Cohen, +1 more
- 01 Jun 1988 - 
- Vol. 9, Iss: 3, pp 19-31
TLDR
In this paper, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.
Abstract
Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

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Citations
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Proceedings ArticleDOI

2 phase microprocessor cooling system with controlled pool boiling of dielectrics over micro-and-nano structured Integrated Heat Spreaders

TL;DR: In this article, a microprocessor cooling technique based on pool boiling of a dielectric fluid, HFE-7000 with a compact closed loop thermosyphon, which requires no pumping or auxiliary components to operate.
Book ChapterDOI

Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure

TL;DR: Experiments on nucleate saturated pool boiling were performed on dielectric fluids suitable for direct-immersion cooling of electronic devices as discussed by the authors, and the effects of pressure on boiling curves and heat transfer coefficients were studied.
Journal ArticleDOI

Boiling incipience of highly wetting liquids in horizontal confined space

TL;DR: In this article, boiling incipience of highly wetting liquids (n-pentane), in transient conditions, in horizontal confined space between a vertical heating cylinder and a disk was investigated.
Book ChapterDOI

Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids

TL;DR: In this article, a direct cooling with inert, dielectric liquids may well become the technique of choice for the thermal management of future electronic systems, due to the efficiency of phase-change processes and the simplicity of natural circulation.
Journal ArticleDOI

Pool Boiling of Resin-Impregnated Motor Windings Geometry

TL;DR: In this paper, the fluorocarbon Novec 7000 was used for pool boiling on copper surfaces, both flat and modified to reflect the geometry of resin-impregnated windings of an electrical machine.
References
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Book

Convective boiling and condensation

TL;DR: In this paper, the basic models of two-phase flow are discussed and empirical treatments of two phase flow are provided. But the authors focus on convective boiling and condensing.
Journal ArticleDOI

Heat-transfer correlations for natural convection boiling

TL;DR: In this article, a regression analysis was applied to the nearly 5000 existing experimental data points for natural convection boiling heat transfer, which can best be represented by subdividing the substances into four groups (water, hydrocarbons, cryogenic fluids and refrigerants) and employing a different set of dimensionless numbers for each group of substances.
Book

Thermal Analysis and Control of Electronic Equipment

TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Journal ArticleDOI

The Evolution of Enhanced Surface Geometries for Nucleate Boiling

TL;DR: A survey of the evolution of surface geometries that promote high-performance nucleate boiling can be found in this paper, where the authors survey the development of a high area density of stable nucleation sites whose performance does not deteriorate with time.