Journal ArticleDOI
wall Superheat Excursions in the Boiling incipience of Dielectric Fluids
TLDR
In this paper, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.Abstract:
Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.read more
Citations
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Journal ArticleDOI
Review of pool boiling enhancement by surface modification
TL;DR: In this paper, a comprehensive review of published articles addressing passive enhancement of pool boiling using surface modification techniques is provided, including macroscale, microscale, and nanoscale surfaces, as well as multiscale (hybrid-scale), and hybrid-wettability techniques.
Journal ArticleDOI
Onset of Nucleate Boiling and Active Nucleation Site Density During Subcooled Flow Boiling
TL;DR: In this paper, a correlation for predicting the wall superheat and wall heat flux at ONB has been developed from the data obtained in this study and that reported in the literature.
Book ChapterDOI
Thermal Control of Electronic Equipment and Devices
G. P. Peterson,Alfonso Ortega +1 more
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Journal ArticleDOI
Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid
TL;DR: In this paper, an experimental study of boiling heat transfer from a simulated microelectronic component immersed in a stagnant pool of dielectric Fluorinert (FC-72) is presented.
Journal ArticleDOI
Boiling heat transfer phenomena from microporous and porous surfaces in saturated FC-72
J.Y. Chang,Seung M. You +1 more
TL;DR: In this article, the performance of micro-porous enhanced surfaces using five different sizes of diamond particles was studied using one-dimensional transient thermal conduction (TTC) to calculate the superheated liquid layer thickness.
References
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Journal ArticleDOI
Transient boiling heat transfer from two different heat sources: Small diameter wire and thin film flat surface on a quartz substrate
TL;DR: In this paper, transient boiling heat transfer data for two different heater surface geometries submerged in liquid nitrogen is reported, and the heat transfer coefficient for both geometry generally agrees with values predicted from classical transient pure conduction equations.
Journal ArticleDOI
Ultra-High Density VLSI Modules
J. Ciccio,R. Thun +1 more
TL;DR: In this paper, a novel packaging approach is described for low-power digital VLSI (very large-scale integration) technologies, which provides low-capacity interconnections throughout and eliminates higher packaging levels.
Journal ArticleDOI
An Evaporative-Gravity Technique for Airborne Equipment Cooling
M. Mark,M. Stephenson,C. Goltsos +2 more
TL;DR: In this article, the development and design of an evaporative system utilizing gravity return flow is discussed, and the test results of such a system are compared with those obtained utilizing a conventional metallic conductive paths technique.
Book ChapterDOI
Operational limits of a submerged condenser
TL;DR: In this article, the operating characteristics of an experimental submerged condenser system are described and related to specific operational modes, and the relevant thermal transport mechanism is examined and shown to accurately define the upper and lower bounds of system operation.
Journal ArticleDOI
Multi-fluid subdued boiling; theoretical analysis of multi-fluid interface bubbles
TL;DR: The recently discovered boiling phenomenon called "multi-fluid subdued boiling" is discussed in this article, where it has been observed that when a beaker containing two immiscible liquids of dissimilar densities is heated at the bottom, the vapobr ubbles rise in the lower liquid until they reach the liquid-liquid interface.