Showing papers on "Copper plating published in 1976"

Coating aluminum with a strippable copper deposit

Abstract: of the Disclosure An improvement in providing a mechanically strippable copper plate on an aluminum carrier is achieved by pretreating the aluminum carrier with an alkaline, aqueous, alkali metal zincate composition containing a small amount of` one or more water soluble iron, cobalt or nickel salts, and removing sub-stantially all of the deposited zincate coating with acid prior to copper plating.

Composite and method for making thin copper foil

Abstract: The improved method of the invention comprises disposing a chromium oxide release layer on the surface of a thin inexpensive metal carrier, such as foil, depositing copper on the release layer to form a thin copper foil, and readily peeling the thus-formed copper foil from the release layer on the carrier. The release layer can be formed in situ from chromium metal electroplated on the carrier. The freshly prepared release layer contains numerous small sites on which electroplating of the copper can be easily carried out to produce pore-free copper foil. The method, which employs the carrier-release layer composite of the invention, is inexpensive and efficient, since readily available, inexpensive metal carriers can be used and no complicated copper foil-carrier separation steps need be resorted to. Moreover, it can increase the bondability of the thin copper foil thus produced to plastic during lamination thereof.

Acid copper plating and additive composition therefor

Abstract: An acid plating bath and an improved process for electrodepositing level copper coatings are described The improved copper plating baths and method include a bath soluble organic leveling compound which is obtained by reacting one or more epihalohydrins with one or more nitrogen-containing compounds which may be substituted pyridines, quinolines, isoquinoline or benzimidazole Particularly improved results are obtained if the acid copper bath also contains, in addition to the leveling agent, a bath-soluble brightening agent and a wetting agent The presence of the above-described leveling agent in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities

Porous metallic layer and formation

Abstract: A metallic porous layer is formed on copper or copper alloy base material by providing a loose coating of copper or steel powder matrix, bonding metal alloy consisting of copper and phosphorous, or copper and antimony and a liquid binder, partially heating to evolve the liquid binder and further heating to 1350°-1550° F. to braze the bonding metal alloy to the base material and matrix.

Process for the fabrication of printed circuits

Abstract: A metal surface such as an endless strip of stainless steel is masked with a plating resist, leaving exposed areas to form a desired circuit pattern. The circuit pattern comprising a high density major layer and a roughened surface layer is formed by copper electroplating on the masked metal surface as same is made cathodic in a copper sulfate bath and successively held opposite to first and second insoluble anodes therein. In order to realize a high copper deposition rate, the electrolyte is caused to flow turbulently at an elevated temperature through the spacings between the metal surface and the first and second anodes. The completed circuit pattern has its roughened surface layer bonded to an adhesive-coated strip of insulating base and is separated from the metal surface. If desired, an adhesive-coated strip of overlay may then be bonded to the circuit pattern on the insulating base strip. The complete process can be automated.

Process for regenerating and for recovering metallic copper from chloride-containing etching solutions

Abstract: Copper values are recovered in metallic form from a solution containing such values along with chloride ions by, first, selectively removing the chloride ions from the solution, and then electrowinning the copper from the chloride-free solution. The process is particularly useful in recovering copper values from etching solutions in a metallic form, such as "wire-grade" metallic copper, that is available for fabrication into commercial copper products. The process is preferably applied to ammoniacal etching solutions derived from the manufacture of printed electronic circuit boards. As so applied, the chlorides are selectively removed by liquid-liquid extraction procedures, resulting in a substantially chloride-free, acidic stripping solution containing the copper values, which solution is subjected to electrolysis for winning copper metal. The aqueous raffinate from the extraction stage is treated for the removal of residual organic and is available for reuse as an etching solution when brought up to the necessary strength by addition of ammonia.

Apparatus and method for automatically maintaining an electroless copper plating bath

Abstract: Apparatus and a method are disclosed for replenishing an electroless plating bath with those of its components which are consumed during plating operation, in order that the concentration of components be maintained as nearly constant as possible in the working bath. The system involves withdrawing from the bath a small sample stream at fixed rate, and subjecting this automatically to a sequence of analyses. The system is particularly adapted to control of electroless copper solutions comprising copper ion, hydroxide and formaldehyde as the consumable components. Sequential analyses are made of the sample stream for these components using instrumentation to control actuators which introduce replenisher solutions into the plating tank in response to signals generated by the instruments whenever deviation occurs from a pre-set level. Standardized test solutions of known concentration and rate of feed are introduced into the test stream to optomize test conditions during the analyses. Changes in bath composition occurring during normal plating operations thus provide changes in instrument readings which are analogs of the concentration of the respective components and signals produced by such readings serve to activate the respective replenisher solution feed controls.

Qualitative observations on the diffusion of copper and gold through a nickel barrier

Abstract: To retard failure of gold plated copper parts by diffusion of copper to the gold surface, a layer of nickel is frequently used between the copper and gold as a diffusion barrier. To evaluate the mechanisms whereby the nickel retards the motion of copper atoms to the gold surface, planar tri-couples of Cu/Ni/Au were prepared by electroplating nickel and gold layers on OFHC copper coupons. Diffusion anneals were carried out at temperatures from 150 to 750°C. A qualitative evaluation of diffusion behavior was provided by an electron microprobe utilizing X-ray wavelength dispersive analysis on polished cross sections. Results demonstrate that the nickel layer retards but does not block the transport of copper to the gold surface. Possible mechanisms for the anomalous buildup of copper at the gold/nickel interface and gold at the copper/nickel interface are discussed.

Plating baths for depositing cobalt-lead nickel-lead alloys or combinations thereof and method of coating aluminum articles therewith

Abstract: A method of plating cobalt-lead or nickel-lead alloys upon aluminum base articles. The plating baths comprise salts of the plating metals and have a pH of from 7-12. Both electroless and electroplating bath compositions are disclosed.

Electroless copper solution

Abstract: An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components. The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 μm/hr, which is equal or superior to that of the conventional art.

Method of plating metals

Abstract: A method of plating a metallic substrate by coating said substrate with a specific metallic system; plating at least one metal onto the coating; and heating the coated and plated metallic substrate to a temperature that effects a bonding of said metallic substrate to said coating and the plated metal. The method is utilized to plate metals onto metal substrates; including substrates such as aluminum and zinc.

The copper plating of graphite powders in the manufacture of copper-graphite materials

Abstract: The results are presented of a study of the deposition of copper on graphite powders and of a comparison of chemical and combined (chemical + electrolytic) copper deposition processes. The combined process gives an appreciable saving of copper, improves the qualify of the deposit, and facilitates control of the deposit thickness.

High speed nickel plating method using insoluble anode

Abstract: Excellent high speed nickel plating is achieved by using insoluble anode, detecting changes in the pH value of the plating bath during the plating operation, and supplying nickel ions to the plating bath in response to the detected changes by forcibly contacting the plating bath with metallic nickel pieces.

Liquid ion exchange process for the recovery of copper and nickel

Abstract: A B S T R A C T Ammoniacal leach solutions containing nickel and copper (and possibly other base metal values) are treated by first extracting copper, leaving nickel in the raffinate. The nickel in the raffinate is subsequently extracted with an organic extractant. The nickel-loaded organic extractant is subsequently stripped with a highly concentrated ammonium salt solution to yield a strip concentrate from which nickel or nickel oxide is recover-able without electrolytic treatment. To prevent build-up of copper in the nickel extraction circuit, part or all of the organic extractant from the nickel strip circuit is recycled back to the copper extraction circuit where copper in the organic extractant is eventually stripped. In the copper extraction circuit, the nickel in the re-cycled organic extractant is replaced by copper from the aqueous layer, preventing build-up of nickel in the organic extractant leaving the copper extraction circuit.

Gold plating process and product produced thereby

Abstract: An electroless gold plating process in which the workpiece to be plated has a nickel coating, the process resulting in formation of a nickel/gold alloy that exhibits the majority of the physical characteristics exhibited by pure gold plating.

Electroless copper plating solution

Abstract: An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.

Electroless copper plating bath

Abstract: An electroless aqueous copper plating bath to which an aromatic nitro compound has been added as a stabilizer.

Printed circuit conductor made of pure copper foil - has non-oxidising etchable layer on copper surface

Abstract: The application is to the manufacture of printed circuits, and the object is to minimise the risk of oxydation of the pure copper foil which is especially susceptible to chemical attack by acids and alkalis. This weakness is overcome by coating the copper foil on one or both sides with a non-oxydising, etchable, solderable material before pressing it up together with the insulation substrate material in order to form a laminated structure. The covering material is typically tin, zinc cadmium or nickel, and it may be chemically or electrically deposited onto the surface. If both sides of the foil are covered, the side which is bonded with the substrate is normally made rough.

Beryllium copper plating process

Abstract: A process for plating beryllium copper with an excellent electrically conductive material such as gold for use in high reliability applications wherein a heat treating step is employed after forming to yield a desired hardness spring temper comprising the steps of: providing a copper-rich surface on the beryllium copper; electroplating the copper-rich surface with a diffusion barrier preplate; heat treating the beryllium copper material to a desired temper; and electroplating the material with a high electrically conductive material. This process provides for a void-free, durable gold plate which can be produced by a continuous automated strip plating line before and after heat treating.