Showing papers on "Electroless nickel plating published in 1993"
15 Mar 1993
TL;DR: In this article, Ni/P-bumps were produced by electroless nickel plating on different samples and the shear strength and electrical resistance were investigated for different initial states of aluminum bondpads.
Abstract: Electroless nickel bumping is a low cost approach to bumping. This method can also be used to convert the aluminum bondpad to a solderable surface (Ni/Au) for flip-chip application. In this study, Ni/P-bumps were produced by electroless nickel plating on different samples. For the pretreatment of aluminum bondpads, a commercial zincate solution was modified. The shear strength and the electrical resistance were investigated for different initial states of aluminum bondpads. It is shown that residues on the aluminum from the semiconductor fabrication can cause an increase in the electrical resistance and a decrease in shear strength. On clean aluminum bondpads, bumps with a shear strength of 180 cN and an electrical resistance below 1 m Omega have been achieved. Thermal cycling shows no significant decrease in the shear strength. >
39 citations
Journal Article•
TL;DR: In this paper, a detailed introduction to plating of ABS plastics is given, with a step-by-step study of the whole process from pre-etchants to electroless nickel.
Abstract: This is a general, yet chemically detailed introduction to plating of plastics. The emphasis is on plating of ABS plastics, with explanations for the widespread use of this plastic. Many concepts, from the three-dimensional structure of ABS plastics, to the use of Pourbaix diagrams to explain electroless nickel plating, are integrated. The result is a step-by-step study of the whole process, from pre-etchants to electroless nickel. ESCA characterization and transmission electron micriscopy are used to explain the surface chemistry
24 citations
TL;DR: In this paper, an electroless Ni-P plating was introduced as the interlayer in the modification of the TiN coating, and the corrosion behavior of the coating assembly was evaluated using the salt spray test and the polarization technique.
Abstract: TiN films were prepared by reactive r.f. magnetron sputtering on low carbon steel substrates. An electroless Ni-P plating was introduced as the interlayer in the modification of the TiN coating. The corrosion behaviour of the TiN coating assembly was evaluated using the salt spray test and the polarization technique. For a thicker Ni-P interlayer (greater than 5 μm), no appreciable corrosion was observed up to hundreds of hours after salt spray testing. The polarization curve indicates a barrier-type passive film in the TiN/Ni 3 P/Fe coating assembly. The corrosion currents for TiN/Fe, Ni 3 P/Fe and TiN/Ni 3 P/Fe are 200, 40–70 and 6–7 μA cm -2 respectively. It appears that the electroless Ni-P interlayer modified TiN coating has better anticorrosion resistance than pure TiN coating on low carbon steel.
23 citations
TL;DR: In this article, the effects of heat treatment on the hardness, bonding strength, phase composition, structure, friction and wear behaviour of the electroless NiP coating was investigated, and the wear mechanisms for the coating were proposed.
17 citations
Patent•
30 Aug 1993
TL;DR: In this paper, a method for forming a gold conductor pattern by electroless plating which has excellent bondability of a gold wire and a low manufacturing cost was proposed. But the method was not suitable for the case of printed wiring boards.
Abstract: PURPOSE: To provide a bonding pad for a printed wiring board and a method for forming a gold conductor pattern by electroless plating which has excellent bondability of a gold wire and a low manufacturing cost. CONSTITUTION: An area unnecessary for gold plating of a conductor pattern 4 formed on a surface of a board 2 is coated with a solder resist 6. An amorphous first electroless nickel film 7 is formed on the pattern 4 not coated with the resist 6 by electroless nickel plating. Then, a crystalline second electroless nickel film 8 containing 3-8% of phosphorus content is formed on a surface of the film 7 by electroless nickel plating. Thereafter, an electroless gold plating film 9 is formed on a surface of the film 8 by electroless gold plating in which substitution reaction is the main reaction. COPYRIGHT: (C)1995,JPO
12 citations
Journal Article•
TL;DR: In this article, the authors report on research in various areas of metal finishing and show that it is a realistic goal to eliminate discharge of spent electroless nickel chemistry and hypophosphite removal.
Abstract: Pollution abatement may come about by improvement in existing processes, replacement of existing chemistries, implementation of process control technologies and the introduction of new metal finishing techniques. This article reports on research in various areas of metal finishing. Modern rinsing strategies must take into account the necessity for complete diffusion of dragged out material, and for recuperation and evaporative recovery techniques, filtration of electrolyzed organic additives is necessary. Advances in electroless nickel chemistry and hypophosphite removal are discussed, showing that it is a realistic goal to eliminate discharge of spent electroless nickel chemistry and hypophosphite removal are discussed, showing that it is a realistic goal to eliminate discharge of spent electroless nickel plating solutions
12 citations
Journal Article•
TL;DR: In this article, the effect of temperature and pH on the deposition rate has been studied and a suitable rate equation is proposed, which is based on the rate equation proposed in this paper.
Abstract: Nickel-phosphorus coatings have been obtained by electroless plating from acidic solutions containing sodium potassium tartrate and sodium hypophosphite Allylthiourea has been used to stabilize the solution. Boric acid and sodium chloride enhance the plating process. The effect of temperature and pH on the deposition rate has been studied and a suitable rate equation is proposed
11 citations
TL;DR: In this paper, the effect of graphite on the strength of electroless nickel plating on cast iron was studied, and it was found that the graphite existing at the interface between the plating film and the substrate propagated to the surface of the film, unlike carbon steel.
Abstract: The effect of graphite on the strength of electroless nickel plating on cast iron was studied. Specimens of cast irons with four types of graphite and of 0.4% carbon steel were prepared and machined into plates with dimensions of 10 mm × 3 mm × 80 mm. Electroless nickel plating, about 40 μm thick, was deposited on the test pieces. The plated test pieces were tested by three-point bending tests using both acoustic emission (AE) and microscopic observation to evaluate the strength of the plating film. It was found that the first AE signal was generated when the cracks initiated and the final AE signal was generated when the film was fractured by crack penetration into the film. In addition it was found that film cracks on cast iron were initiated by the graphite existing at the interface between the plating film and the substrate, and propagated to the surface of the film, unlike carbon steel. The strength of the plating film on cast iron measured by this method, decreased more sharply with increasing amount of graphite than with graphite shape. Observations of cast iron surfaces at early stages of plating showed that the nickel was deposited only on the matrix and not on the graphite. It is believed that the non-deposited areas of the cast iron acted as types of defects. It is concluded that the strength of electroless nickel plating film on cast iron is strongly influenced by graphite on the surface.
9 citations
TL;DR: In this article, several surface modifications were applied to polycrystalline alumina (PCA) samples to study their effects on surface morphology and frictional coefficients, including ion implantation of chromium ions (Cr+), ion beam assisted deposition of diamond-like carbon (DLC), coatings of gamma-irradiated polymers (PEO), and electroless nickel plating of a composite material of polytetrafluoroethylene dispersed in a nickel phosphorus matrix.
Abstract: Several methodologies of surface modifications were applied to polycrystalline alumina (PCA) samples to study their effects on surface morphology and frictional coefficients. Modified surfaces were first tested in a specially designed frictional apparatus against wires of stainless steel (SS) and beta-titanium (β-Ti) alloys and then evaluated by scanning electron microscopy. Techniques included ion implantation of chromium ions (Cr+), ion beam assisted deposition of diamond-like carbon (DLC), coatings of gamma-irradiated polymers (PEO), and electroless nickel plating of a composite material of polytetrafluoroethylene dispersed in a nickel phosphorus matrix, Niflor NT® (NF). Implanting ions into the bulk material had no effect on surface morphology. Although covering the surface, the DLC coating mimicked the underlying topography. The coatings of PEO and NF obliterated and smoothed over the normally rough and faceted PCA surfaces. When compared to control samples, neither the Cr+ or DLC process reduced the friction normally seen against SS and β-Ti wires. When tested in both the dry and wet states, the PEO coated samples retained their traditional levels of frictional resistance. Only the composite material, NF, successfully reduced the friction when compared with controls. Although this composite coating is not recommended for oral use, the results show that simply smoothing over the rough surface is inadequate for friction reduction; the surface must somehow also be made lubricious.
9 citations
TL;DR: Anodic stripping voltammograms of electroless nickel-phosphorus films showed two distinct peaks, which were attributed to the presence of two distinct solid phases as mentioned in this paper, which yielded a phosphorus-rich surface.
Abstract: Anodic stripping voltammograms of electroless nickel-phosphorus films showed two distinct peaks, which were attributed to the presence of two distinct solid phases. Partial anodic stripping, leaving the more noble material intact, yielded a phosphorus-rich surface. A quartz microbalance electrode was used to monitor the early stages of both open-circuit and fixed potential plating in a low temperature electroless nickel plating bath on this surface, as well as on normal electroless nickel-phosphorus and pure nickel films
9 citations
TL;DR: In this article, a commercially available process of electroless nickel plating was applied to steel as an intermediate layer for diamond chemical vapour depositions, by reason of the buffering material being softer than diamond and the stress relaxing, with increasing nickel thickness.
Patent•
21 May 1993
TL;DR: Stabilized electroless nickel plating baths employing a hypophosphite reducing agent and conducted under electroless plating conditions which are treated to remove and control phosphite anions by the addition of lithium hydroxide to form insoluble dilithium phosphite readily recoverable from the bath on a batch or continuous basis as discussed by the authors.
Abstract: Stabilized electroless nickel plating baths employing a hypophosphite reducing agent and conducted under electroless plating conditions which are treated to remove and control phosphite anions by the addition of lithium hydroxide to form insoluble dilithium phosphite readily recoverable from the bath on a batch or continuous basis.
Patent•
12 Mar 1993
TL;DR: In this article, a black oxide film was formed on the surface of a cap having a light transmission window, and the reflection light of the window was absorbed through the black oxide films. But the effect of this film on the airtightness of the cap was not analyzed.
Abstract: PURPOSE: To prevent the generation of a stray light, by forming a black oxide film on the surface of a cap having a light transmission window, and by 'absorbing the reflection light of the window through the black oxide film CONSTITUTION: On the top surface of a main body 20 of a cap, a light 21 to be transmitted is formed After the main body 20 of the cap is cleaned by an acid treatment, etc, the main body 20 of the cap is subjected to an electroless nickel plating, and a film 22 of the electroless nickel plating is formed on its surface The electroless nickel plating is made to be the plating containing sulphur That is, the electroless nickel plating bath is so prepared as to contain sulphur or a sulphur compound Thereby, the reflection light of the incidence light in case of the light reception of the cap is absorbed by the inside surface of the main body 20 of the cap which is subjected to a blackening treatment, and the generation of any stray light can be prevented Also, since the adhesive property of the oxide film of the plating film 22 to a low melting point glass 23 is good, the good adhesive strength of the main body 20 of the cap to a light transmission window 24 is obtained, and the airtight characteristic of the cap can be improved COPYRIGHT: (C)1994,JPO&Japio
Patent•
20 Apr 1993
TL;DR: In this paper, an electroless nickel plating method for a Zn-Al alloy capable of giving a perfect plating film having excellent adhesion, corrosion resistance and appearance was proposed.
Abstract: PURPOSE:To provide an electroless nickel plating method for a Zn-Al alloy capable of giving a perfect plating film having excellent adhesion, corrosion resistance and appearance. CONSTITUTION:When a Zn-Al alloy is subjected to electroless nickel plating, it is pretreated by surface conditioning and degreasing and a palladium-amine complex is stuck to the relevant alloy to carry out catalyzing treatment. Metallic palladium is then deposited by reduction to activate the alloy and electroless nickel striking is carried out prior to electroless nickel plating.
Patent•
09 Aug 1993TL;DR: In this article, a glass plate is provided with one or a few monolayers of silane, which are subsequently treated with an aqueous Pd sol which is stabilized with a water-soluble polymer, such as PVA and PVP.
Abstract: Using an electroless nickel bath, a black matrix (13) is provided between the colour filter patterns (7, 9, 11) on a passive plate for an LCD. For this purpose, a glass plate (1) is provided with one or a few monolayers of silane (3), which are subsequently treated with an aqueous Pd sol which is stabilized with a water-soluble polymer, such as PVA and PVP. In this treatment catalytic Pd nuclei (5) are formed which are capable of initiating electroless nickel plating from an electroless nickel bath which contains stabilizers.
TL;DR: The role of carboxylic acids commonly used in electroless nickel plating is examined in this paper, where the Raman spectra of nickel(II) acetate, propionate, citrate, oxalate, formate and malonate and their respective sodium or potassium solids in both the solid state and aqueous solution have been obtained.
Abstract: Carboxylic acids are added to electroless nickel plating solutions mainly as «complexing agents». The present study examines the role of some carboxylic acids commonly used in electroless nickel plating. The Raman spectra of nickel(II) acetate, propionate, citrate, oxalate, formate and malonate and their respective sodium or potassium solids in both the solid state and aqueous solution have been obtained
Patent•
26 Feb 1993
TL;DR: In this paper, the authors proposed to keep a high Q even in high temperature and high humidity by overlapping a corrosion resistant metallic layer onto a chemical plating copper layer on a dielectric ceramic and heat-treating the layers.
Abstract: PURPOSE:To keep a high Q even in a high temperature and high humidity by overlapping a corrosion resistant metallic layer onto a chemical plating copper layer on a dielectric ceramic and heat-treating the layers. CONSTITUTION:A ceramic compact forming a copper coating film on it, is immersed in a nickel sulfate based electroless nickel plating liquid to form an Ni film having about 0.5mum thickness, and the heat treatment at temperature of 60-600 deg.C, preferably 300 deg.C for 30 minutes, is applied to it. Then, bottom face of the ceramic is ground and an electrode layer is formed to the other face. By such constitution a high Q is maintained even in high temperature and high humidity.
TL;DR: In this paper, various factors influencing the adhesion between glass and electroless nickel plated films were investigated and it was found that the use of glycine as a complexing agent resulted in films that exhibited good adhesion.
Abstract: Various factors influencing the adhesion between glass and electroless nickel plated films were investigated. In terms of the film, it was found that the use of glycine as a complexing agent resulted in films that exhibited good adhesion. Adhesive strength also increased at lower pH and lower plating bath temperature. In terms of pretreatment, etching was important to improving adhesion. Adhesive strength was greatest when the glass was first etched with sodium hydroxide, next etched with hydrofluoric acid and then treated with methylate. Adhesion was also increased by decreasing the level of dissolved oxygen in the catalyzing treatment solution and plating bath.
Patent•
12 Feb 1993
TL;DR: In this paper, the authors proposed to obtain the electromagnetic wave shield performance through few steps by applying coating on the surface side of plastic product that is necessary to be plated after applying activation processing on the products entirely to form a catalyzer layer and bringing the entire products into contact with an electroless plating solution so that the metallic plating film may be precipitated on the non-coated section.
Abstract: PURPOSE:To efficiently obtain the electromagnetic wave shield performance through few steps by applying coating on the surface side of plastic product that is necessary to be plated after applying activation processing on the products entirely to form a catalyzer layer and bringing the entire products into contact with an electroless plating solution so that the metallic plating film may be precipitated on the non-coated section CONSTITUTION:A housing parts 11 is immersed entirely in a catalyzer form a tin- paradium colloid-based catalyzer layer 21 wholely over a front surface 11a and a rear surface 11b Next, while the surface 11b, etc, are left for plating processing as they are, the surface 11a unnecessary to be plated is mainly applied with outer coating to form a coating film 13 Then the parts 11 is entirely immersed in an electroless copper plating bath to be applied with electroless plating, so that the electroless copper plating film 23 is selectively formed only on the surface 11b using the layer 21 remaining only on the surface 11b as a core The parts 11 is further immersed in an electroless nickel plating bath to precipitate and form an electroless nickel plating film 25 for the rust preventive film of the film 23
TL;DR: In this article, composites of graphite particles codeposited to an electroless Ni-B matrix obtained from the bath using dimethylamine borane (DMAB) as the reducing agent were produced, and the physical properties of the coatings were studied.
Abstract: Composite coatings of graphite particles codeposited to an electroless Ni-B matrix obtained from the bath using dimethylamine borane (DMAB) as the reducing agent were produced, and the physical properties of the coatings were studied. It was possible to obtain composites containing up to 5.5wt% of graphite particles. The hardness of the coatings decreased with increasing graphite content. Ni-B-graphite composite coatings were found to have good self-lubricating properties and their contact resistance was as low as that of Ni-B coatings.
Patent•
11 Dec 1993
TL;DR: In this paper, an electroless nickel plating film was formed on an electrode pattern formed on the surface of a substrate such as of ceramic by baking, etc, of silver or palladium-containing silver through electroless Nickel plating.
Abstract: PURPOSE:To form an excellent electroless nickel plating film only on an electrode pattern formed on the surface of a substrate such as of ceramic by baking, etc, of silver or palladium-containing silver through electroless nickel plating CONSTITUTION:Silver or palladium-containing silver paste is applied to a substrate surface at a silver-pattern printing step 2, and baked at a baking step 3 to form an electrode pattern, the electrode pattern is treated with an acidic liquid at an acidic-liquid treating step 6 and treated with a reducing liquid at a reducing-liquid treating step 8, and an electroless nickel plating film of a uniform thickness is formed onto the electrode pattern at an electroless nickel plating step 9
Patent•
30 Mar 1993
TL;DR: In this article, an electroless nickel plating layer was used to enhance the soldering strength of a beam and pins in the printing head actuator of a wire dot type printer by diffusion bonding.
Abstract: PURPOSE:To enhance the soldering strength of a beam and pins in the printing head actuator of a wire dot type printer. CONSTITUTION:After the pin bonding end part 8a of a beam 8 is covered with masking, an electroless nickel plating layer 8b for diffusion bonding is formed to the surface of the beam 8. After masking is removed, the electroless nickel plating layer 8b is formed to the surface of the beam 8 excepting the pin bonding end part 8a and the beam 8 is bonded to an armature 7 by diffusion bonding and a pin 9 is soldered to the pin bonding end part 8a of the beam 8.
Patent•
23 Feb 1993
TL;DR: In this article, a polishing fluid for an electroless nickel plating film, is manufactured by dispersing alumina in water and adjusting the pH to 2.8 or lower with sulfuric acid to give an alumina dispersion, adding colloidal silica to the dispersion and then adding nickel carbonate thereto to adjust the pH.
Abstract: PURPOSE:To manufacture a polishing fluid which is excellent in the dispersion stability of alumina, has a good polishing effect even after long-term, and is suitable for polishing an electroless nickel plating film, especially an Ni-P film, on, e.g. a hard disc. CONSTITUTION:A polishing fluid for an electroless nickel plating film, is manufactured by dispersing alumina in water and adjusting the pH to 2.8 or lower with sulfuric acid to give an alumina dispersion, adding colloidal silica to the dispersion, and then adding nickel carbonate thereto to adjust the pH to 5 to 7.
TL;DR: In this article, it has been confirmed that the film of deposited nickel exhibits higher adhesion strength if a nickel displacement process is used instead of the zincate process, and that adhesion sensitivity depends on the rate of the displacement reaction, which can be controlled by changing the kind of complexing agent and the plating conditions in the displacement bath.
Abstract: Electroless nickel plating on aluminum substrates utilizing a nickel displacement process has been investigated.A zincate process is in general use before electroless nickel plating on aluminum substrates. It has been confirmed, however, that the film of deposited nickel exhibits higher adhesion strength if a nickel displacement process is used instead of the zincate process, and that adhesion strength depends on the rate of the displacement reaction, which can be controlled by changing the kind of complexing agent and the plating conditions in the displacement bath.In addition, fine bumps are required in the TAB or flip chip bonding methods and straight-walled bumps approximately 20μm wide and 15μm high can be formed by electroless nickel deposition utilizing the displacement process.
Patent•
09 Apr 1993
TL;DR: In this article, an anodic reaction is caused to decompose formic acid in the waste liquid together with formalin Gaseous CO2 generated by the anode reaction and gaseous H 2 generated by cathodic reaction are discharged from a duct 12 and a duct 13 respectively, the treated waste liquid is reused as a plating liquid after component adjustment.
Abstract: PURPOSE:To give a waste liquid chemical change to reuse it as a plating liquid by giving energy to between an anode in a waste liquid housing part housing a waste liquid of electroless nickel plating and a cathode immersed in an electrolytic solution housing part to perform anodic reaction CONSTITUTION:In an outer vessel 2 forming a waste liquid housing part 1 housing a waste liquid of electroless copper or gold plating is arranged an inner vessel 4 forming an electrolytic solution housing part 3 housing an electrolytic solution, such as dilute sulfuric acid A side wall 8 in which a lot of small holes are made, of the inner vessel 4 is covered by an electrolysis dense diaphragm 9 from outside and the inner vessel 4 is made to adjoin the waste liquid housing part 1 through the diaphragm In a treating liquid tank 5 of the constitution, an anode 10 and a cathode 11 are immersed in the waste liquid housing part 1 and the electrolytic solution housing part 3 respectively and prescribed voltage is applied to both the electrodes to perform electrolysis Consequently anodic reaction is caused to decompose formic acid in the waste liquid together with formalin Gaseous CO2 generated by the anodic reaction and gaseous H2 generated by cathodic reaction are discharged from a duct 12 and a duct 13 respectively On the other hand, the treated waste liquid is reused as a plating liquid after component adjustment
Patent•
20 Apr 1993
TL;DR: In this paper, the waste liquid of electroless nickel plating process is used as a substitute for the water for the dissolution of various fertilizers in the production of a liquid compound fertilizer.
Abstract: PURPOSE:To improve the fertilizer response of a liquid compound fertilizer and prevent the pollution of river, etc, by using waste liquid of electroless nickel plating process in the production of a liquid compound fertilizer CONSTITUTION:Waste liquid of electroless nickel plating process is used as a substitute for the water for the dissolution of various fertilizers in the production of a liquid compound fertilizer Organic acids in the waste liquid of electroless nickel plating process can be utilized by this process The reducible phosphoric acid in the waste liquid such as hypophosphorous acid and phosphorous acid can easily be oxidized and recovered as a useful phosphoric acid source by subjecting the electroless nickel plating waste liquid to nickel-removing treatment and/or oxidizing treatment before using as the dissolution water
Patent•
23 Jul 1993TL;DR: In this paper, two electroless nickel plating solutions were proposed for polycarbonate-containing substrates. But these solutions are not suitable for polyethylene and polypropylene polycarbonates.
Abstract: Increases in surface resistivity of electroless nickel coatings on polycarbonate-containing substrates are inhibited by employing two electroless nickel plating solutions. The first solution is one which deposits a metal layer containing phosphorus, if any, in an amount up to 5% by weight and is used to deposit a layer at least 0.5 micron thick. The second solution is one which deposits a layer containing phosphorus in the amount of at least 5% and preferably at least 6% by weight. Another metal layer may be interposed between the two nickel layers.
Patent•
20 Apr 1993
TL;DR: In this paper, an electroless nickel plating waste liquor is added to culture soil such as volcanic ash soil or clay loam and the resultant mixture is granulated and further dried to afford the objective artificial culture soil.
Abstract: PURPOSE:To obtain granular artificial culture soil capable of accelerating growth of crops and expecting a yield increase by adding an electroless nickel plating waste liquor to culture soil, granulating and drying the resultant mixture. CONSTITUTION:An electroless nickel plating waste liquor is added to culture soil such as volcanic ash soil or clay loam and the resultant mixture is granulated and further dried to afford the objective artificial culture soil. Furthermore, the above-mentioned electroless nickel plating waste liquor is preferably presubjected to nickel removing treatment and/or oxidation treatment.
Patent•
09 Jul 1993
TL;DR: In this article, the surface of an Mg alloy substrate for a traveling-wave tube was smoothen by applying a metal plating layer when the substrate was plated. But the surface was not covered with glass beads.
Abstract: PURPOSE:To smoothen the surface of an Mg alloy substrate for a traveling-wave tube and to obtain satisfactory heat conductivity as well as to remove surface defects in Mg alloy stock and to surely coat the surface of the substrate with a metal plating layer when the substrate is plated CONSTITUTION:An Mg alloy substrate is used as a substrate 1 for a traveling- wave tube requiring reduction in weight Mg alloy stock is formed into a prescribed substrate shape and honed with glass beads of >=600 mesh as an abrasive material The surface of the resulting substrate is subjected to copper plating and electroless nickel plating