Showing papers on "Electroplating published in 1982"

Copper electroplating process

Abstract: A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.

Laser-enhanced plating and etching: mechanisms and applications

Abstract: We have developed experimental electroplating, electrodeless plating, and etching techniques that use a focused laser beam to define the localized plating or etching region. Enhancements in plating (etching) rates up to ≅1O3 to 1O4, compared to background rates, have been observed in the region of laser irradiation. A thermal model has been developed to describe the observed effects over the entire overpotential (polarization) curve. In the low overpotential region the enhancement is dominated by the increase in the local charge-transfer kinetics due to the local increase in temperature produced by absorption of the laser energy by the cathode (anode). At higher overpotentials, in the mass-transport-limited region, the main enhancement occurs due to hydrodynamic stirring caused by the the large local temperature gradients. Examples of gold, nickel, and copper electroplating are described to illustrate the value of this technique for micron-sized circuit personalization and repair. Additional examples of electroless laser-enhanced plating and exchange plating are also described.

Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire

Abstract: Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process of this invention involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

High‐Speed Selective Electroplating with Single Circular Jets

Abstract: High‐speed selective electroplating of circular deposits with a jet system was investigated by both experimental and theoretical studies. Direct measurement of current distribution was made with a sectioned electrode made of concentric rings. Three systems were studied, including alkaline ferricyanide reduction, copper deposition from acidified sulfate solution, and copper deposition from an acidified sulfate solution that also contained a ferric/ferrous redox couple. In these systems, current distribution data were obtained upon controlled variation of jet Reynolds number, electrolyte conductivity, reactant concentration, and applied total current. A mathematical model of the process was developed that included mass transfer, ohmic resistance, charge transfer, cell geometry, and multiple electrode reactions. The mathematical model was used to generate dimensionless contour maps indicating generalized conditions under which selective high‐speed electroplating can be accomplished.

Automated system for laser mask definition for laser enhanced and conventional plating and etching

Abstract: A laser enhanced electroplating system or etching system or conventional electroplating or etching system includes a continuous electrochemical processing system with a sheet of material to be treated electrochemically passed from a supply roller to a plating bath and out over an exit roller with the plating system under automatic control. A rinse-tank is also proved in series with the plating tank. The sheet to be treated electrochemically can be coated with a protective film which prevents electrochemical action from occurring where it is present, but which sheet can be removed in a predetermined location. One removes the protective film where desired to provide a mask by means of a laser which is scanned under automatic control. Then the plating or etching operation occurs through the openings in the mask. A rinse-tank contains a solvent capable of removing the mask from the sheet subsequent to the plating or etching operation. An array of lasers can be employed. An array of lasers can be multiplexed, synchronously activated or pulsed. The electrochemical operation can be performed with the concomitant application of energy from the laser in order to enhance the chemical action in areas from which the masking (protective) film has been removed. The laser can be scanned by means of a mirror, which oscillates or can be fixed. The masking material is composed of an organic material such as glycol phthalate, paraffin, photoresist, gelatin, etc.

Alkaline plating baths and electroplating process

Abstract: Cyanide-free plating baths for the electrodeposition of copper alloys comprise aqueous alkaline mixtures which contain copper and either lead or tin ions and a chelating agent selected from glucoheptonic acid and its salts. Processes for electroplating using the bath and for removing the metal ions from the spent baths by pH adjustment are also disclosed.

Ultra-high current density electroplating cell

Abstract: The electroplating cell includes a reservoir of electroplating solution into which a workpiece supporting and locating structure is able to be lowered. The workpiece supporting structure supports and locates a plurality of semi-cylindrical bearing elements in a column around a cylindrical anode structure. A plating cavity is defined between the bearing elements and the anode structure. The anode structure includes a tubular anode basket having a plurality of apertures therein and a woven liner along its interior. A copper rod is attached to the anode basket and extends along its central axis for supplying electrical potential to pellets of the plating metal disposed within the anode basket and for rotating the anode basket. A plurality of vanes are attached to the exterior of the anode basket for rotation through the plating cavity to stir the plating solution. A first pump circulates plating solution from the reservoir into the plating cavity at a rate of about 20 to 60 gallons per minute and a second pump draws plating solution out of the anode basket at a rate of less than 10 gallons per minute. The remaining solution escapes from the top of the plating cavity and returns to the plating reservoir.

Palladium plating procedure

Abstract: A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

Multi-layer multi-metal electroplated protective coating

Abstract: This invention is directed to the formation of highly protective electroplated multi-metal coatings over an iron basis metal. The high degree of protection is obtained by the deposition of three sucessive layers of two dissimilar metal layers that form a galvanic cell in which one of the two adjacent metals is anodic to the other so that the corroding anodic electroplate will spread the attack laterally and thus prevent the corrosive media from drilling through to the base metal. The coating comprises an initial layer of sulfur free nickel followed in sucession by a sulfur containing bright nickel, cadmium, copper, sulfur free nickel, sulfur containing nickel and microporous chromium.

Device for electrodeposition of aluminum

Abstract: A device for electrodepositing aluminum from an aprotic oxygen-free and water-free aluminum-organic electrolyte which comprises an annular electroplating tank which is subdivided into concentric sub-cells with each cell having electrolyte and anode plates. To charge and discharge workpiece holders into and out of the device includes a charging lock and also a separate discharging lock.

Coumarin process and nickel electroplating bath

Abstract: A process and electroplating bath for use in electrodepositing nickel on a base where the electroplating bath includes a coumarin compound and an aryl hydroxy carboxylic acid compound, such as salicylic acid, present in a combined amount effective to provide a ductile, self-leveling nickel deposit. The bath may further include hexyne diol and/or a material selected from the group consisting of primary acetylenic alcohols and adducts of primary acetylenic alcohols, as well as mixtures thereof. It has been found that excellent leveling and physical properties can be maintained utilizing such a bath, while at the same time, the usual coumarin concentration level can be reduced significantly and process life can be dramatically extended. In addition, additives such as butyne diol, and/or aldehydes such as formaldehyde and chloral hydrate may be utilized. It has also been found that corrosion resistance is substantially improved utilizing the process and electroplating bath of the present invention.

Electroplating apparatus with constant velocity agitation

Abstract: Apparatus is disclosed, for mechanically agitating, in a non-reciprocating manner, a permalloy composition used in an electroplating procedure, in such a way as to apply a film of improved uniformity of composition and thickness thus avoiding limitations of prior electroplating processes which, due to uneven boundary layer flow patterns caused by reciprocating agitation, result in non-uniformities in film composition and thickness.

Process for electroplating palladium

Abstract: The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form of and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.

Process of electroplating a nickel-zinc alloy on steel strip

Abstract: An electroplating process is disclosed for coating metal strip or sheet with a nickel-zinc alloy comprising at least 80% nickel Steel sheet coated with the alloy exhibits excellent weldability

Process for producing silicon

Abstract: A process for producing silicon includes forming an alloy of copper and silicon and positioning the alloy in a dried, molten salt electrolyte to form a solid anode structure therein. An electrically conductive cathode is placed in the electrolyte for plating silicon thereon. The electrolyte is then purified to remove dissolved oxides. Finally, an electrical potential is applied between the anode and cathode in an amount sufficient to form substantially pure silicon on the cathode in the form of substantially dense, coherent deposits.

Highly corrosion resistant surface treated steel plate

Abstract: PURPOSE: To obtain a titled steel plate having good corrosion resistance, paintability, and weldability by carrying out electroplating of metals (alloys) of Zn, Ni, etc. on the surface of a steel plate and forming a diffusion layer of said metals (alloys) by heating in the steel then carrying out plating of a Zn-Ni alloy on the surface of the steel plate. CONSTITUTION: Metallic plating of Zn, Ni, Sn, Cr or consisting essentially of these metals is carried out thinly on both front and rear surfaces of a steel plate. The plating in this case is carried out preferably at 0.5W20g/m 2 per one side. The steel plate after the plating is heated in a nonoxidative atmosphere to diffuse said plating metal thoroughly into the steel. Zn-Ni alloy plating is carried out on at least one surface of the steel plate formed with the diffused layer, whereby the intended surface treated steel plate having high corrosion resistance is obtained. The Zn-Ni alloy plating has a sacrificial effect of preventing corrosion when the content of Ni is 10W20wt% and is the range where the corrosion resistance is high. COPYRIGHT: (C)1983,JPO&Japio

Production of boride diffused alloy

Abstract: PURPOSE: To produce an electrical contact and sliding material having a surface part dispersed uniformly with borides and having excellent performance, by penetrating and dispersing B in a metallic material having the surface layer part consisting of a thin layer contg. gold, silver, etc. and Be, Mg, Al, etc. CONSTITUTION: ≥1 Kinds among Be, Mg, Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Ga, As, Zr, Nb, Mo, Pd, Cd, Ta, W and Pt are coated on the surface of gold, silver gold alloy, or silver alloy which is a base material by electroplating or the like; thereafter, the material is heat-treated to diffuse said element into the surface layer part, and metallic material of which the surface layer part from at least the surface down to 0.01W0.1mm depth contains 0.5W40atom% the above-mentioned elements as an alloy or fine particles and the balance is gold, silver gold alloy, or silver alloy is obtd. B is penetrated and diffused in such metallic material to form the fine particles consisting of the borides of the above-mentioned elements in the surface layer part of the metallic material, whereby the boride diffused alloy is produced and a metallic material suited for an electrical contact material, a sliding material, etc. is obtd. COPYRIGHT: (C)1984,JPO&Japio

Metal plated polyamide articles

Abstract: Disclosed is an improved process for preparing metal plated thermoplastic compositions by electroless metal deposition and subsequent electrolytic plating. This process comprises the sequence of etching a filled thermoplastic resin substrate with dilute acid solution, treating with a sensitizer such as a tin salt, activating with a noble metal salt solution, electroless metal deposition using an electroless copper or nickel plating solution, and electrolytic plating with a metal selected from the group consisting of copper, nickel, chromium, or combinations thereof. The improvement is in the use of a wollastonite filler having an average particle size of less than about 3.5 microns, wherein 95 numerical percent of the particles are smaller than 10 microns in the longest dimension. The resulting electroplated articles exhibit a mirror-like finish and a peel strength of at least about 3 lbs./in. Also disclosed is a nylon-6 plating composition useful in the process containing the above-described wollastonite filler and an organosilane coupling agent.

Battery having replaceable electrodes

Abstract: A replaceable electrode primary battery utilizing hollow zinc anodic electrodes and hollow nickel oxide cathodic electrodes immersed in a potassium hydroxide electrolyte solution. The electrodes are arranged in stacks formed by electrically conducting guides contacting the outer surfaces of the spherical electrodes, the respective guides forming the battery anode and cathode. Fresh electrodes are added to the top of the stack from a supply of electrodes, causing a spent electrode to be ejected from the bottom of the stack. The ejected electrode floats to the surface of the electrolyte solution and is collected in a holding compartment. The spent electrodes may be reused by electroplating the appropriate material on the outer surface of the spherical shell. The battery finds particular utility with electric vehicles where electrodes may be dispensed from conventional filling stations.

Production of zn-ni alloy electroplated steel plate having high corrosion resistance in worked part

Abstract: PURPOSE: To produce a titled steel plate easily and inexpensively with the same plating soln. in the stage of electroplating a Zn-Ni alloy, by applying lower layer plating thinly at specific current density and quantity of electricity then applying upper layer plating at the higher current density. CONSTITUTION: Two layers of plating are applied on a steel plate, by using the same Zn-Ni plating soln. and in order to make the content of Ni in the under layer higher than the upper layer, the current density is regulated as follows: The under layer plating is applied at 2W<20A/dm 2 current density and 1W300 coulomb quantity of electricity. Then, the upper layer plating is applied at ≥20A/dm 2 current density. The content of Ni in the lower layer plating is increased and is made electrochemically nobler than the upper layer by providing a step to the current density in the above-mentioned way. The layer of the under layer plating is made thin and is made difficult to crack in the stage of working by limiting the quantity of electricity. COPYRIGHT: (C)1983,JPO&Japio

Process for producing a thin tin and zinc plated steel sheet

Abstract: A process for producing a thin tin and zinc plated steel sheet which comprises electroplating zinc on a steel sheet from a zinc electroplating bath containing zinc ions followed by tin-plating the zinc plated steel sheet by immersion or by immersion followed by electroplating in a tinplating bath containing stannous ions, whereby zinc ions from the zinc plated steel sheet replace the stannous ions in the tinplating solution during the immersion tinplating. The resultant solution from the tinplating which contains zinc ions is recycled to make up the zinc electroplating bath.

Surface treated steel sheet having high corrosion resistance and its production

Abstract: PURPOSE: To obtain a laminated steel sheet having excellent corrosion resistance, weldability, etc. by forming a specific amt. of Zn plating layer on a steel sheet and further forming a specific amt. of a Co-W plating layer having a specific compsn. ratio thereon. CONSTITUTION: Zn or Zn alloy plating is applied on a steel sheet to form a plating layer of about ≥3g/cm 2 , more preferably 3W60g/m 2 coating weight. The steel sheet is then subjected to electroplating in a cobalt plating bath contg. 10W100g/l Co and 0.01W10g/l W or Cr to form a Co-W or Co-Cr alloy plating layer of 0.01W10wt%, more preferably 0.05W5wt% content of W or Cr so that the coating weight thereof attains 0.003W3g/m 2 , more preferably 0.01W1g/m 2 . The surface treated steel sheet having the excellent bare corrosion resistance and the excellent corrosion resistance after painting and the excellent weldability is thus obtd. COPYRIGHT: (C)1984,JPO&Japio

Silver plating liquid and silver plating method

Abstract: PURPOSE:To prevent the formation of malignant silver replacement plating when a copper-containing metal is used as a plating base material, by having an aromatic or heterocyclic compound having a specific mercapto group contained in a silver electroplating bath with an alkali silver cyanide base. CONSTITUTION:In a silver electroplating bath containing an alkali silver cyanide such as KAg(CN)2 as a main component, a thiosalicylic acid of benzene, pyridine, furan or pyrazole, 2-mercapto-benzothiazole or an aromatic or heterocyclic compound having a mercapto group bonded directly to its cyclic nucleus is contained as a preventing agent for replacement plating, and also further 2-50g/l cyanide such as KCN is added to the above-mentioned plating bath. If this plating bath is used at an adjusted pH value of 8.0-10.5, the formation of porous silver replacement plating having poor adhesion to the base material can be prevented when a copper-containing metal is used as the plading base metal.

Palladium electroplating procedure

Abstract: A palladium electroplating procedure is described in which the bath is replenished by palladium hydroxide made in a special way. The palladium hydroxide is made by oxidation of palladium diammine dichloride in alkaline aqueous solution using hypochlorite ion as the oxidizing agent. Palladium hydroxide is ideal as a replenishing agent for palladium electroplating baths because it neutralizes hydrogen ions produced in the electroplating process and does not yield anions that accumulate in the bath.