Showing papers on "Substrate (printing) published in 1975"

Method for removing photoresist layer from substrate by ozone treatment

Abstract: Method and apparatus for removing a photoresist layer from a substrate surface of different material, such as a semiconductor slice, in the fabrication of an electronic structure, involving exposure of the photoresist layer to an ozone-containing gaseous atmosphere in a reaction zone of a reactor. The ozone is present as an active reagent in the gaseous atmosphere to which the layer of photoresist material is exposed in an amount sufficient to react with all of the photoresist material in the layer thereof, with the photoresist material being removed from the underlying substrate surface in response to its exposure to the ozone. The photoresist material being treated by the ozone for stripping thereof may be either a negative or positive photoresist. Gaseous reaction products resulting from treatment of the substrate and removal of the photoresist layer therefrom are directed through an ozone reduction chamber prior to the discharge of the exhaust gases created by the reaction of the ozone with the photoresist material, wherein any excess ozone contained in the exhaust gases is reduced to molecular oxygen.

Process for stretching incremental portions of an orientable thermoplastic substrate and product thereof

Abstract: There is disclosed a novel process and product produced thereby for the selective stretching of incremental portions of a substrate of a synthetic thermoplastic material selected from the group consisting of a thermoplastic orientable polymer or a blend of a thermoplastic orientable copolymer in which there is admixed an incompatible second phase selected the group consisting of an incompatible polymer or inorganic material. The substrate is stretched in grooved roller pairs by controlling the velocity of introduction of the substrate to maintain the velocity substantially identical to the surface velocity of the roller pair. Stretching of the blends produce an opaque, low density porous sheet.

Method for coating a substrate

Abstract: An improved method is described for coating a substrate in a system in which an insulating layer is also formed on one portion of a conductive target plate which is bombarded with ions. One such system is a reactive sputtering system in which a predetermined partial pressure of a reactive gas is established between a reactive metal target plate and the substrate. The bombarding ions are formed in a glow discharge plasma which may be magnetically confined. In accordance with the invention, an ac potential is applied to the target plate in order to prevent arcing which is believed due to the dielectric breakdown of the insulating layer.

Method and apparatus for detection of antibodies and antigens

Abstract: Method and apparatus for the detection of antibodies and antigens based upon the effect that any arbitrary antigen will adsorb onto a substrate in a monomolecular layer only, but that a corresponding specific antibody for such arbitrary antigen will bond thereto to form a bimolecular layer on the substrate. A first layer of antigen is adsorbed onto a substrate and the coated substrate is then exposed to a solution suspected of containing the specific antibody of interest. The substrate is then examined to determine whether a monomolecular or bimolecular layer is adhering thereon. Optical, including visual, electrical, and chemical means for examining the coated substrate are disclosed. The method can be reversed by replacing the antigen in each step above with its specifically reacting antibody and by replacing the antibody with its specific antigen.

In-mold coating composition and method of applying same

Abstract: An in-mold coating composition is disclosed which includes (a) an isocyanate-terminated material containing an excess of reactive isocyanate groups and (b) a material selected from the group consisting of a composition containing reactive hydrogen atoms, generally hydroxyl groups, and a catalyst capable of trimerizing the terminal isocyanate groups. The coating composition is applied to a molded substrate, such as an FRP part, by placing a charge of the composition in the mold on the substrate, the charge being sufficient to provide a coating having a thickness less than about 20 mils. Appropriate pressure is then applied to the charge, such as by closing the mold, so that the coating composition is forced to cover substantially the entire surface area of the substrate, filling any surface defects. The composition is cured to yield a crosslinked, isocyanate-based coating which adheres tightly to the substrate.

Illumination-panel for liquid crystal display of similar device

Abstract: An illumination panel for the enhancement of image brightness of a liquid crystal display for a watch or similar device is disclosed. The panel has an internal light source with a suitably shaped and reflectorized coating to substantially direct internal and external light in the desired direction. More particularly, a transparent layer or member with an internal light source mounted at one end is selectively coated with a metallic reflecting material to reflect light from the internal source and from external sources through a crosshatched surface or a matte finished window on the surface of the member. The window may be defined by the reflectorized coating. The member is mounted adjacent to the exterior surface of the bottom substrate of the liquid crystal display. Diffused light is transmitted from the internal light source of the illumination panel through the bottom substrate of the display.

Process for the manufacture of abrasive material

Abstract: Process for the manufacture of abrasive material in which (1) an abrasive mix is brought to fusion as in an electric arc furnace, (2) a relatively cold substrate is dipped into the molten material whereby a layer of solid abrasive material is quickly frozen (or plated) on the substrate, (3) the plated substrate is withdrawn from the molten material and (4) the solidified abrasive material is broken away from the substrate and collected for further processing to produce abrasive grain.

Coated abrasive disc

Abstract: A coated abrasive disc is prepared for use in power driven abrading, grinding, buffing tools and the like, by coating a substrate disc or sheet of fibrous paperboard, or like material, as by means of a patterned adhesive transfer roll, embossing or the like, to form rows of geometrically patterned adhesive coated areas in the substrate; and then applying finely divided abrasive material over the adhesive coated areas to form a geometrical pattern of abrasive coated areas on the substrate with rows of uncoated scavenging channels extending between the abrasive coated areas and opening onto the outer or peripheral edge of the abrasive coated disc. In the use of the new abrasive coated disc the scarfings or debris from the operation of the abrasive coated disc, as when used on a metal surface, or the like, are discharged by centrifugal force through the uncoated scavenging channels to the outer or peripheral edge of the new abrasive coated disc, thereby enhancing the efficiency and use of the new abrasive coated disc.

Electrochemical system using conductive plastic

Abstract: In a conductor-electrolyte-active material electrochemical environment, the conductor is protected against corrosion by that portion of the conductor in contact with the electrolyte and active material being formed of plastic filled with vitreous carbon. Adequate conductivity is obtained by finely dividing the vitreous carbon and loading the plastic with 40%-80% carbon by volume. The filled plastic is particularly effective as a bipolar plate substrate. A layer of lead-antimony foil bonded to the carbon-filled plastic provides a good surface for adhering active materials. A lead sheet can be bonded to the substrate to define a low resistance terminal. Forming the edges of the substrate of thicker sections of unfilled -- hence nonconductive -- plastic allows the plates to be stacked to define a battery.

Novel beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads

Abstract: A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconnected with the chip devices extend beyond the periphery of the chip and a plurality of solder mounds having a lower melting point than said beam-leads extends from the surface of the chip to a point beyond the plane of the beam-leads. This chip structure permits a method of automatic alignment of said plurality of beam-leads with a corresponding plurality of beam-leads on a dielectric substrate which involves placing the chip on the substrate so that said plurality of solder mounds are respectively in registration with a plurality of corresponding solder-wettable land pads on said non-wettable dielectric substrate. The structure is then heated to melt the solder mounds, wetting said land pads and thereby moving the chip so as to bring said beam-leads into registration with a plurality of corresponding land leads.

Article transferring apparatus

Abstract: A vacuum applicating apparatus for dispensing and applying measured lengths of tape on a moving substrate. The apparatus has a plurality of rotating applicating segments which are driven by a driving wheel. The segments can be disposed so that tape is fed onto the segments from a continuous supply of tape at a slow speed; the tape is then severed into measured lengths and the lengths are applied in spaced relationship onto a faster moving substrate.

Fabrication techniques for multilayer ceramic modules

Abstract: Metallized through-holes are provided in insulating substrates by placing the substrate onto an absorbant carrier and screening a metallization paste, which contains a metal component dispersed in an organic solvent, into the holes. The carrier absorbs the solvent and a portion of the paste adheres to the carrier. When the carrier is stripped from the substrate it carries with it the center portion of the paste to leave a thin layer of paste on the inner surface of the substrate.

Sintered cemented carbide body coated with three layers

Abstract: A triple coated cemented hard metal carbide product in which a cemented metal carbide substrate is coated with, first, a metal carbide coating, in such a manner so as to create a carbon deficient area in the substrate, then, a metal carbo-nitride and, finally, a metal nitride coating so as to take advantage of the metal carbide and metal nitride properties in order to protect the cemented metal carbide substrate from corrosive atmospheres and abrasion due to frictional wear.

Laminated structures and methods and compositions for producing same

Abstract: Methods for bonding two substrates, one of which is polymeric, which comprise coating the surface of at least one substrate with an adhesive composition comprising a major component which is an adhesive for the first substrate and a minor disperse phase which is a solution of a polymer in a solvent for the polymeric substrate and contacting the coated surface of the one substrate with the surface of the other substrate, together with adhesive compositions useful for joining such substrates, laminates so formed, and articles comprised of such laminates.

Graphic arts and graphic media

Abstract: Graphic arts media are provided which offer raised, three-dimensional effects. A basic medium is formulated of a colorant, film-forming binder, a solvent vehicle and thermally expandable microspheres. The microspheres are treated to preclude or inhibit solvation in the solvent vehicle by coating with a compound which is a non-solvent for the microspheres but which preferentially wets the surface thereof. Alkyl alcohols having about 3 to 5 carbon atoms in the alkyl chain are employed. The medium is selectively applied to a substrate, dried, and heated to expand the microspheres.

Substrate holder for etching thin films

Abstract: Substrate holder for etching thin films by means of an ion beam in which a driving device moves the surface of a substrate placed on a turntable with respect to the ion beam, which holder includes a friction disk which rotates in rolling contact with a surface of a driving disk carrying the turntable and is spaced from the axis of the driving disk by a distance equal to that at which the point of impact of the ion beam on the substrate is located.

Vapor deposition apparatus

Abstract: Multi-layer coating apparatus and system for coating a substrate having a coating chamber and means for advancing the substrate in a horizontal position through the coating chamber. The coating chamber is provided with means for depositing the coating on the bottom side of the substrate as it is advanced through the chamber. Means is provided for preventing one substrate from bumping into another and for providing a predetermined spacing from the substrates as they are advanced through the coating chamber.

Lightweight reflector assembly

Abstract: An inexpensive, lightweight reflective assembly member having good optical quality is provided. The reflective assembly is particularly adaptable to accommodating temperature variations without providing destructive thermal stresses and reflective slope errors. The reflective assembly may consist of a thin lamina reflective surface member and a lightweight substrate member of cellular structure. The respective materials may be chosen so that the coefficient of thermal expansion will be approximately the same. The substrate can comprise a cellular glass block while the reflective lamina member can be a thin sheet of glass with appropriate reflective coating. The lamina and cellular substrate member can be bonded together to form the reflective assembly. The method of fabrication includes abrading the cellular substrate with an abrasive master die to form an appropriate concave surface. An adhesive can be applied to the abraded surface and a lamina reflective surface can be placed under a uniform pressure to conform the reflective surface onto the desired abraded surface of the substrate.

Laminates and coated substrates

Abstract: A process for producing a laminate by coating a continuous first layer of a film forming material onto a release sheet, distributing flock fibers uniformly onto the first layer, drying the first layer to form a film and secure the flock fibers thereto in a substantially upstanding position, coating the tips of the flock fibers with a flock adhesive, marrying the flocked film to a substrate backing layer such that the coated tips contact the said substrate layer, permanently setting the flock adhesive, and then removing the release sheet. Laminates obtained by such method are also described.

Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips

Abstract: An improved conductor patterned substrate assembly is disclosed which permits direct attachment of integrated circuit chips to a metallized array while preventing stress buildup due to thermal cycling and/or bonding temperatures. A circuit is formed on a flexible substrate of insulative material which is suitable for withstanding solder, thermal compression bonding, or eutectic die attachment temperatures. The circuit includes a fine line pattern of leads extending up to the edge of a hole in the substrate substantially centered within the pattern of the integrated circuit pad dimensions. The subject assembly can thus be used face down bonding of integrated circuit chips which have bump metallization on the contact pads thereof. Thermal distortion of the substrate during bonding is minimized by the central hole thus preventing undue stresses from being applied to the chip bonds by the substrate. The assembly also provides for full support for the conductor leads throughout their entire length, in order to maintain dimensional and spacial stability especially for bonding larger multi-pad chips.

Method of making a differentially shrunk flocked fabric, and flocked fabric product

Abstract: A pattern is printed with adhesive as a design on certain selected areas of a shrinkable substrate and the adhesive is dried. Flock is preferably applied to the selected design prior to drying. Supplemental adhesive is then applied to other areas ("background" areas) of the substrate, and is dried. Preferably such supplemental adhesive is applied over the surface of the entire substrate and over the adhering flock that has already been applied, and the entire substrate plus existing flock is covered with additional flock, followed by drying of the adhesive. The entire substrate thus prepared is then subjected to shrinkage, causing differential shrinkage of the design areas and the background areas, and producing a fabric having a novel three-dimensional pattern or design. The fabric product preferably has a plurality of upstanding flock fibres and the substrate is shrunken more tightly in some areas than in others.

Method of forming a contoured laminate

Abstract: A method of bonding a flexible superstrate, such as a flexible finish sheet, to a contoured substrate, such as a contoured fiberboard, particularly in mass production. The disclosed method includes supporting the contoured substrate in a downwardly facing cavity of a female die. The substrate may be coated with adhesive before receipt in the die cavity. A flexible superstrate is then positioned beneath the die cavity on a flexible sealing sheet. The die is then closed and a vacuum is drawn through the die cavity and contoured substrate to draw the sealing sheet into the die cavity. The flexible superstrate or finish sheet is thus drawn in face-to-face contact with the contoured face of the substrate, bonding the finish sheet to the substrate.

Method of spray-coating with metal alloys

Abstract: A metal coating is deposited on a metal substrate by means of a method which consists in sand-blasting the metal substrate, in heating the substrate to a temperature between 100° and 650° C, then in spraying a powder of nickel or cobalt alloy having a high value of hardness and containing reducing agents as well as agents for reducing the melting point, the spraying operation being performed at a distance of 50 to 200 mm from the nozzle of a spray-gun and at a velocity within the range of 100 to 250 meters per second.

Method of laminating graphite sheets to a metal substrate

Abstract: A method for bonding graphite sheets to a metallic substrate. The metallic substrate is provided with a coating of low melt metal which forms an intermetallic phase or zone at the interface between the substrate and coating. The coated substrate while in solidified condition is placed in a press between a pair of graphite sheets. Heat is applied to the substrate and graphite sheets while under pressure to a temperature slightly above the melting point of the substrate coating but below the temperature which will destroy the intermetallic interface. The substrate and graphite sheets are cooled while maintained under pressure in the press with the graphite sheets becoming firmly bonded to the metallic substrate by the resolidified metal coating.

Film laminates having a reirradiated layer

Abstract: The seal strength, dimensional stability, bond strength between plies, and ink adhesion of certain film laminates may be significantly increased by irradiating the substrate, forming the laminate, and then irradiating the entire laminate whereas in the prior art the practice is to only irradiate the substrate layer prior to forming the laminate.

Air firable base metal conductors

Abstract: A paste for forming a thick film conductor of a base metal on a non-conductive substrate comprises a base metal powder (particularly nickel) which ordinarily would oxidize when fired in air, boron powder and a vehicle. In one embodiment, the paste may also contain glass frit. By proper selection of the composition, in particular the amounts of boron and glass frit, a base metal conductor can be formed which strongly adheres to the substrate and has excellent conductive properties. Ranges of compositions are disclosed within which the pastes can be fired in air and produce conductive thick films and outside which conductive properties are inferior and/or the bond strength is unsatisfactory.

Electronic watch construction

Abstract: Electronic substrate of the electronic watch is the principal carrier of the electronics and electrical interconnections. It carries two alignment notches with top and bottom spacers embracing the substrate and engaging the alignment notches. The visual horological display is located in the top spacer and the batteries are located in the bottom spacer. Springs press onto the substrate and are contactable for input to the watch electronics. All important parts are keyed together for ease of assembly and accuracy of alignment.

Novel metal‐clad optical components and method of isolating high‐index substrates for forming integrated optical circuits

Abstract: One of the difficulties in integrated optics is to form passive and active devices of different materials on a common substrate. We have solved part of the difficulty by introducing a technique of isolating low‐index devices from a high‐index substrate. We also report novel metal‐clad optical components which can be formed on any substrate.

Relative humidity detector

Abstract: A relative humidity detector, is formed upon a substrate such as glass or amorphous quartz. An aluminum layer evaporated onto the substrate has a layer of Al2 O3 anodized thereover to a thickness of 5,000 to 10,000 angstroms. A gold upper metallic layer overlies an adherent layer of chromium upon the Al2 O3 to a combined thickness of 1000 Angstroms. After the substrate has been mounted onto an appropriate header, it is submerged in a water bath for about 8 to 12 hours. It is then heated at a temperature of about 120° C. for 6 to 12 hours. The submersion and heating process produces an impedance variation at 1000 Hz which is linear over the relative humidity range of between zero and 100%. In another embodiment, an electrode of gold over chromium evaporated onto a portion of the substrate forms a first electrode. A layer of aluminum evaporated over the substrate and a portion of the first electrode has a layer of Al2 O3 thereover. A layer of gold overlying an adherant layer of chromium is formed over a portion of the layer of Al2 O3. A second electrode of gold and chrome overlies an edge portion of the top gold layer, and extends away from it onto the underlying substrate. Electrical connections are made to the first and second electrodes.

Coating compositions, processes for depositing the same, and articles resulting therefrom

Abstract: Ceramic dielectric coating compositions are disclosed as well as processes for depositing the coating compositions on a substrate and the coated article resulting therefrom. A ferroelectric or piezoelectric powder material such as the barium titanate type or lead zirconate-titanate type is mixed with a phosphate additive and water to form an acidic flowable mass with a consistency suitable for depositing by various means on a substrate. Depositing means include painting, dipping, spraying, and silk-screen techniques. After deposition on the substrate, the coating composition is dried, preferably at an elevated temperature, to form a composite article of the substrate with an adherent ferroelectric or piezoelectric coating composition thereon.