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B. C. Valek
Researcher at Lawrence Berkeley National Laboratory
Publications - 10
Citations - 628
B. C. Valek is an academic researcher from Lawrence Berkeley National Laboratory. The author has contributed to research in topics: Electromigration & Deformation (engineering). The author has an hindex of 8, co-authored 10 publications receiving 607 citations.
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Journal ArticleDOI
Submicron X-ray diffraction and its applications to problems in materials and environmental science.
Nobumichi Tamura,Richard Celestre,Alastair A. MacDowell,Howard A. Padmore,Ralph Spolenak,B. C. Valek,N. Meier Chang,Alain Manceau,J. R. Patel +8 more
TL;DR: The availability of high brilliance third generation synchrotron sources together with progress in achromatic focusing optics allows us to add submicron spatial resolution to the conventional century-old x-ray diffraction technique as discussed by the authors.
Journal ArticleDOI
Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
Arief Suriadi Budiman,William D. Nix,Nobumichi Tamura,B. C. Valek,Kaustubh S. Gadre,Jose A. Maiz,Ralph Spolenak,J. R. Patel +7 more
TL;DR: In this paper, the extent of electromigration-induced plasticity is dependent on the linewidth of the interconnects and the grain bending and formation of subgrain structures, while only grain rotation is observed in narrower lines.
Journal ArticleDOI
High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron X-ray diffraction
Nobumichi Tamura,Alastair A. MacDowell,Richard Celestre,H. A. Padmore,B. C. Valek,John C. Bravman,Ralph Spolenak,W. L. Brown,T. Marieb,H. Fujimoto,B. W. Batterman,J. R. Patel +11 more
TL;DR: In this article, an X-ray synchrotron technique capable of mapping orientation and strain/stress in polycrystalline thin films with submicron spatial resolution is presented.
Journal ArticleDOI
Electromigration-induced plastic deformation in passivated metal lines
B. C. Valek,John C. Bravman,Nobumichi Tamura,Alastair A. MacDowell,Richard Celestre,H. A. Padmore,Ralph Spolenak,W. L. Brown,B. W. Batterman,J. R. Patel +9 more
TL;DR: In this paper, the authors used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu) test line.
Journal ArticleDOI
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
TL;DR: In this article, a grain-by-grain analysis was obtained from diffracted Laue patterns about the changes of grain orientation before and after electromigration, and a different mechanism of grain growth under electromigration from the normal grain growth was proposed and discussed.