J
Jin-Soo Kim
Researcher at Seoul National University
Publications - 308
Citations - 26566
Jin-Soo Kim is an academic researcher from Seoul National University. The author has contributed to research in topics: CRISPR & Genome editing. The author has an hindex of 66, co-authored 264 publications receiving 21375 citations. Previous affiliations of Jin-Soo Kim include UPRRP College of Natural Sciences & Korea University of Science and Technology.
Papers
More filters
Journal ArticleDOI
Interim Results of the Phase 1 Study of Tnb-486, a Novel CD19xCD3 T-Cell Engager, in Patients with Relapsed/Refractory (R/R) B-NHL
Jing-Zhou Hou,Ryan Jacobs,Seok-Goo Cho,Sumana Devata,Sameh Gaballa,Dok Hyun Yoon,Don A. Stevens,Jin-Soo Kim,Ben Buelow,Ranjit Nair +9 more
TL;DR: In this article , the authors presented the interim results of the ongoing FIH phase 1 study of TNB-486 in R/R B-NHL, where the primary objectives were to assess the safety, tolerability and pharmacokinetics of the drug when administered as monotherapy and to determine the optimal biologically active dose.
Journal ArticleDOI
Novel organic bottom anti-reflective coating materials for 193 nm lithography
TL;DR: In this paper, the performance and compatibility of organic BARC materials (HEART004) designed to work for lithographic applications at 193 nm were reported. And the PAR710 showed good compatibility with HEART004 at 210/spl deg/C of baking temperature.
Journal ArticleDOI
Diffusion Tensor Imaging Predicts Motor Functional Outcome after Acute Hypertensive Intracerebral Hemorrhage
TL;DR: The amount of hematoma correlated with motor function on admission, but did not show correlation with the degree of motor recovery, and FA ratio analysis calculated from FA values of DTI could be a prognostic factor of motor function improvement in patients with hypertensive ICH.
Journal ArticleDOI
Experimental study of bump void formation according to process conditions
TL;DR: In general, fewer voids were formed using the electroless nickel electroless palladium immersion gold (ENEPIG) pad finish than the organic solderability preservative (OSP) pad finishes, however, the suitability of the pad finish was different depending on the type of paste.