A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.

System comprising a semiconductor device and structure

A device comprising semiconductor memories, the device comprising: a first layer and a second layer of layer-transferred mono-crystallized silicon, wherein the first layer comprises a first plurality of horizontally-oriented transistors; wherein the second layer comprises a second plurality of horizontally-oriented transistors; and wherein the second plurality of horizontally-oriented transistors overlays the first plurality of horizontally-oriented transistors.

Semiconductor device and structure

A method to process an Integrated Circuit device including processing a first layer of first transistors, then processing a first metal layer overlaying the first transistors and providing at least one connection to the first transistors, then processing a second metal layer overlaying the first metal layer, then processing a second layer of second transistors overlaying the second metal layer, wherein the second metal layer is connected to provide power to at least one of the second transistors.

Method for fabrication of a semiconductor device and structure

An Integrated Circuit device, including: a first layer including first single crystal transistors; a second layer overlaying the first layer, the second layer including second single crystal transistors, where the second layer thickness is less than one micron, where a plurality of the first transistors is circumscribed by a first dice lane of at least 10 microns width, and there are no first conductive connections to the plurality of the first transistors that cross the first dice lane, where a plurality of the second transistors are circumscribed by a second dice lane of at least 10 microns width, and there are no second conductive connections to the plurality of the second transistors that cross the second dice lane, and at least one thermal conducting path from at least one of the second single crystal transistors to an external surface of the device.

3D semiconductor device and structure

We propose Bit-Cost Scalable (BiCS) technology which realizes a multi-stacked memory array with a few constant critical lithography steps regardless of number of stacked layer to keep a continuous reduction of bit cost. In this technology, whole stack of electrode plate is punched through and plugged by another electrode material. SONOS type flash technology is successfully applied to achieve BiCS flash memory. Its cell array concept, fabrication process and characteristics of key features are presented.

Bit Cost Scalable Technology with Punch and Plug Process for Ultra High Density Flash Memory

Various critical issues related with 3-D stacked nand Flash memory are examined in this paper. Our single-crystalline STacked ARray (STAR) has many advantages such as better scalability, possibility of single-crystal channel, less sensitivity to 3-D interference, stable virtual source/drain characteristic, and more extendability over other stacked structures. With STAR, we proposed a unit 3-D structure, i.e., “building.” Then, using this new component, 3-D block and full chip architecture are successfully designed. For the first time, the structure and operation methods of the “full” array are considered. The fully designed 3-D nand Flash architecture will be the novel solution of reliable 3-D stacked nand Flash memory for terabit density.

Three-Dimensional nand Flash Architecture Design Based on Single-Crystalline STacked ARray

In this letter, we propose a layer selection method by permutations (LSMPs) of string select line (SSL) bias and string select transistor with multi-level states. Due to the increased number of threshold voltage orderings by the permutation, the number of required SSLs for the layer selection and the space occupied by SSLs can be minimized. Also, the operation scheme for the layer selection is discussed. To verify the operation of proposed LSMP, a fabricated pseudo-LSM is measured. As a result, it is clearly revealed that the number of selectable layer can be increased drastically by the LSMP.

Layer Selection by Multi-Level Permutation in 3-D Stacked NAND Flash Memory

Channel-stacked 3D NAND flash memory is very promising candidate for the next-generation NAND flash memory. However, there is an inherent issue on cell size variation between stacked channels due to the declined etch slope. In this paper, the effect of the cell variation on the incremental step pulse programming (ISPP) characteristics is studied with 3D TCAD simulation. The ISPP slope degradation of elliptical channel is investigated. To solve that problem, a new programming method is proposed, and we can alleviate the VT variation among cells and reduce the total programming time.

A New Programming Method to Alleviate the Program Speed Variation in Three-Dimensional Stacked Array NAND Flash Memory

Program disturbance is analyzed in a simplified channel-stacked array with layer selection by multilevel operation after setting the threshold voltages ( $V_{\textrm {th}}$ ) of string select transistors (SSTs)/dummy SSTs. There are additional unselected cells that should be inhibited in different ways, and they have the worse disturbance characteristics compared with conventional NAND arrays. Technology computer-aided design simulations and measurements are performed to investigate the disturbance mechanism of the additional cases. It is found that initially nonprecharged channel and large leakage current flowing from channel to bitline degrade the disturbance. New program method is proposed along with low gate bias of dummy wordline. As a result, program disturbance is significantly improved and reliability is also enhanced by reducing the potential difference between the SST gate and the channel.

Analysis on Program Disturbance in Channel-Stacked NAND Flash Memory With Layer Selection by Multilevel Operation

In this paper, the channel stacked array (CSTAR) NAND flash memory with layer selection by multi-level operation (LSM) of string select transistor (SST) is proposed and investigated to solve problems of conventional channel stacked array. In case of LSM architecture, the stacked layers can be distinguished by combinations of multi-level states of SST and string select line (SSL) bias. Due to the layer selection performed by the bias of SSL, the placement of bit lines and word lines is similar to the conventional planar structure, and proposed CSTAR with LSM has no island-type SSLs. As a result of the advantages of the proposed architecture, various issues of conventional channel stacked NAND flash memory array can be solved.

Joo Yun Seo

Papers

Three-Dimensional nand Flash Architecture Design Based on Single-Crystalline STacked ARray

Layer Selection by Multi-Level Permutation in 3-D Stacked NAND Flash Memory

A New Programming Method to Alleviate the Program Speed Variation in Three-Dimensional Stacked Array NAND Flash Memory

Analysis on Program Disturbance in Channel-Stacked NAND Flash Memory With Layer Selection by Multilevel Operation

Channel-stacked NAND flash memory with layer selection by multi-level operation (LSM)