Gallium nitride (GaN) and its allied binaries InN and AIN as well as their ternary compounds have gained an unprecedented attention due to their wide-ranging applications encompassing green, blue, violet, and ultraviolet (UV) emitters and detectors (in photon ranges inaccessible by other semiconductors) and high-power amplifiers. However, even the best of the three binaries, GaN, contains many structural and point defects caused to a large extent by lattice and stacking mismatch with substrates. These defects notably affect the electrical and optical properties of the host material and can seriously degrade the performance and reliability of devices made based on these nitride semiconductors. Even though GaN broke the long-standing paradigm that high density of dislocations precludes acceptable device performance, point defects have taken the center stage as they exacerbate efforts to increase the efficiency of emitters, increase laser operation lifetime, and lead to anomalies in electronic devices. The p...

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Luminescence properties of defects in GaN

Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

A Survey of Wide Bandgap Power Semiconductor Devices

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

and Perspectives Sophie Carenco,†,‡,§,∥,⊥ David Portehault,*,†,‡,§ Ced́ric Boissier̀e,†,‡,§ Nicolas Meźailles, and Cleḿent Sanchez*,†,‡,§ †Chimie de la Matier̀e Condenseé de Paris, UPMC Univ Paris 06, UMR 7574, Colleg̀e de France, 11 Place Marcelin Berthelot, 75231 Paris Cedex 05, France ‡Chimie de la Matier̀e Condenseé de Paris, CNRS, UMR 77574, Colleg̀e de France, 11 Place Marcellin Berthelot, 75231 Paris Cedex 05, France Chimie de la Matier̀e Condenseé de Paris, Colleg̀e de France, 11 Place Marcellin Berthelot, 75231 Paris Cedex 05, France Laboratory Heteroelements and Coordination, Chemistry Department, Ecole Polytechnique, CNRS-UMR 7653, Palaiseau, France

Nanoscaled metal borides and phosphides: recent developments and perspectives

Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper.

https://ieeexplore.ieee.org/ielaam/41/8031005/7815312-aam.pdf

Review of Silicon Carbide Power Devices and Their Applications

High-Voltage 4H-SiC RESURF MOSFETs Processed by Oxide Deposition and N2O Annealing

The conduction-type dependent thermal oxidation rate in SiC was discovered. The oxidation was performed for SiC(0001) with nitrogen doping (n-type) in the range from 2.0×1016 cm−3 to 1.0×1019 cm−3, and aluminum doping (p-type) in the range from 2.0×1015 cm−3 to 1.0×1019 cm−3, exhibiting a clear dependence. For n-type SiC the oxide thickness increases for higher doping density, and for p-type the thickness decreases. Note that in the case of Si oxidation, there exists very little difference of oxidation rate between the conduction types in such low doping density, and the dependence is peculiar to SiC. The authors speculate the difference originates from the difference in carrier (electron/hole) density during the oxidation, which can reasonably explain the difference in the oxidation rate between Si and SiC.

Conduction-type dependence of thermal oxidation rate on SiC(0001)

Vacancies in Mg-implanted GaN were probed using positron annihilation technique. Mg was implanted into GaN with [Mg] = 1E19 /cm3. For an as-implanted sample, the major defect species was identified as Ga-vacancy related defects. The sample was annealed under a nitrogen pressure of 1 GPa in a temperature range of 1000–1480C without a protective capping layer. Comparing with the sample annealed with the capping layer, although no large difference in the defect spices was observed, their concentration was decreased by the cap-less annealing. The diffusion of Mg during annealing was influenced by the presence of residual vacancies. H was unintentionally incorporated into the sample during annealing, and its diffusion property were also affected by vacancies and Mg. A part of this work was supported by MEXT “Research and development of next-generation semiconductor to realize energy-saving society (JPJ005357)” and the Polish National Science Centre through project No 2018/29/B/ST5/00338.

Behaviors of vacancy-type defects in Mg-implanted GaN during ultra-high-pressure annealing studied by using a monoenergetic positron beam

We fabricated 〈100〉, 〈110〉, 〈111〉, and 〈112〉 p-channel gate-all-around Si nanowire (SiNW) MOSFETs, cross sections of which are rectangles with various widths, and investigated the hole mobility of the SiNW MOSFETs using the double L m method. Measured hole mobilities of SiNW MOSFETs were about 80–140 cm2/Vs at surface carrier density of 1 × 1013 cm−2. The dependences of the hole mobility on orientations and cross-sectional shapes of nanowires were analyzed. The orientation and geometry dependences can be explained by the band structures calculated by tight-binding approximation.

Impacts of orientation and cross-sectional shape on hole mobility of Si nanowire MOSFETs

SiC lateral MOSFETs with multi-RESURF structures have been fabricated by a self-aligned process. The “multi-RESURF” means “double RESURF” and “buried-p RESURF” structures, which have the buried-p region at the top and at the middle of RESURF region, respectively. The increase of net RESURF dose and the decrease of channel length lead to the reduced on-resistance. The “buried-p RESURF” MOSFETs have higher on-resistances than the “double RESURF” MOSFETs, due to the resistance of parasitic JFET inside the RESURF region. The dose designing for double RESURF MOSFETs has been optimized by using device simulation. A double RESURF MOSFET exhibits a breakdown voltage of 750 V and an on-resistance of 52 m/cm2.

Jun Suda

Papers

High-Voltage 4H-SiC RESURF MOSFETs Processed by Oxide Deposition and N2O Annealing

Conduction-type dependence of thermal oxidation rate on SiC(0001)

Behaviors of vacancy-type defects in Mg-implanted GaN during ultra-high-pressure annealing studied by using a monoenergetic positron beam

Impacts of orientation and cross-sectional shape on hole mobility of Si nanowire MOSFETs

Reduction of on-resistance in 4H-SiC multi-RESURF MOSFETs