Gallium nitride (GaN) and its allied binaries InN and AIN as well as their ternary compounds have gained an unprecedented attention due to their wide-ranging applications encompassing green, blue, violet, and ultraviolet (UV) emitters and detectors (in photon ranges inaccessible by other semiconductors) and high-power amplifiers. However, even the best of the three binaries, GaN, contains many structural and point defects caused to a large extent by lattice and stacking mismatch with substrates. These defects notably affect the electrical and optical properties of the host material and can seriously degrade the performance and reliability of devices made based on these nitride semiconductors. Even though GaN broke the long-standing paradigm that high density of dislocations precludes acceptable device performance, point defects have taken the center stage as they exacerbate efforts to increase the efficiency of emitters, increase laser operation lifetime, and lead to anomalies in electronic devices. The p...

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Luminescence properties of defects in GaN

Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

A Survey of Wide Bandgap Power Semiconductor Devices

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

and Perspectives Sophie Carenco,†,‡,§,∥,⊥ David Portehault,*,†,‡,§ Ced́ric Boissier̀e,†,‡,§ Nicolas Meźailles, and Cleḿent Sanchez*,†,‡,§ †Chimie de la Matier̀e Condenseé de Paris, UPMC Univ Paris 06, UMR 7574, Colleg̀e de France, 11 Place Marcelin Berthelot, 75231 Paris Cedex 05, France ‡Chimie de la Matier̀e Condenseé de Paris, CNRS, UMR 77574, Colleg̀e de France, 11 Place Marcellin Berthelot, 75231 Paris Cedex 05, France Chimie de la Matier̀e Condenseé de Paris, Colleg̀e de France, 11 Place Marcellin Berthelot, 75231 Paris Cedex 05, France Laboratory Heteroelements and Coordination, Chemistry Department, Ecole Polytechnique, CNRS-UMR 7653, Palaiseau, France

Nanoscaled metal borides and phosphides: recent developments and perspectives

Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper.

https://ieeexplore.ieee.org/ielaam/41/8031005/7815312-aam.pdf

Review of Silicon Carbide Power Devices and Their Applications

A technique for mixing various polarity, crystal surface, crystal orientation on a SiC substrate surface is provided to form SiC, III party Nitride, or II party Oxide layer on the surface. The first SiC substrate with (0001) surface and the second SiC substrate with (000-1) surface are prepared. The SiC substrates are oxidized to form an oxide film, and the two substrates are welded in a manner that the backside of the second SiC substrate facing the surface of the first SiC substrate. The portion relating to the second SiC substrate is thinned into a thin layer. By using lithography and RIE skill, the thin layer of the second SiC substrate is fabricated into strips according to the required period. A substrate with alternative (0001) and (000-1) surfaces of SiC can be manufactured out.

Compound semiconductor device and method of manufacturing the compound semiconductor device

AlGaN surface potentials in AlGaN/GaN heterostructures with and without SiN passivation were investigated using x-ray photoelectron spectroscopy (XPS). SiN films were formed on AlGaN surfaces by catalytic chemical vapor deposition (Cat-CVD), which has already been found to increase two-dimensional electron gas (2DEG) density. Based on a simple electrostatic analysis, the 2DEG density is expected to increase as the AlGaN surface potential decreases. This study experimentally demonstrates that a reduction in the AlGaN surface potential is actually induced by Cat-CVD SiN passivation. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

XPS study of surface potential in AlGaN/GaN heterostructure with Cat-CVD SiN passivation

In this paper, high-field hole transport in germanium nanowires was studied by using Boltzmann's transport equation in an atomistic framework. The scattering mechanisms taken into account are phonon and surface roughness. The hole drift velocities of [110], [111], and [112]-oriented germanium nanowires showed negative-differential characteristics, while that of the [001] nanowire did not. The behavior of hole drift velocity was analyzed based on the highly nonparabolic and orientation-dependent valence band structure. High-field hole transport properties in silicon nanowires were also calculated, and the differences between germanium and silicon nanowires were discussed, focusing mainly on momentum and energy relaxation times. The [110], [111], and [112] silicon nanowires showed faster hole drift velocity at high field than the germanium nanowires with the same orientation. This was attributed to faster energy relaxation in silicon nanowires, which mitigates the negative differential mobility in silicon nanowires compared to germanium nanowires.

Analysis of High-Field Hole Transport in Germanium and Silicon Nanowires Based on Boltzmann's Transport Equation

Deep-level transient spectroscopy (DLTS) using Schottky barrier diodes (SBDs) is widely used for quantitative analysis of deep levels. This study focuses on the dependence of Schottky barrier height on apparent time constants and concentrations of electron traps in n-type GaN. DLTS using SBDs with various barrier heights was carried out. Experimental data show that large reverse leakage currents due to low barrier heights resulted in underestimation of time constants and concentrations. Theoretical calculations considering the impact of leakage currents reproduced experimental results well. Based on the calculations, we suggest a minimum required barrier height where accurate time constants and concentrations can be evaluated.

Effect of Schottky barrier height on quantitative analysis of deep-levels in n-type GaN by deep-level transient spectroscopy

The phonon-dispersion curves of the NdGaO 3 crystal are calculated on the basis of a rigid-ion model by using the measured frequency values by Raman and infrared polarized spectroscopy at room temperature. The temperaturedependence of the molar heat capacity of NdGaO 3 is also calculated using the one-phonon density of states obtained from the phonon-dispersion curves. The first-order polarized Raman spectra of the A 1 g mode in the NdGaO 3 crystal have been measured in the temperature range between 31 and 500 K. The temperature dependence for the linewidth of the A 1 g modes has been analyzed at 339 and 470 cm - 1 by using the phonon-dispersion curves, and the calculated result reproduces the observed one in the temperature range 31-500 K. Thus, the temperature dependence of the linewidth of the A 1 g modes in the NdGaO 3 crystal is approximately explained by the cubic anharmonic term in the expansion series of the crystal potential energy.

Jun Suda

Papers

Compound semiconductor device and method of manufacturing the compound semiconductor device

XPS study of surface potential in AlGaN/GaN heterostructure with Cat-CVD SiN passivation

Analysis of High-Field Hole Transport in Germanium and Silicon Nanowires Based on Boltzmann's Transport Equation

Effect of Schottky barrier height on quantitative analysis of deep-levels in n-type GaN by deep-level transient spectroscopy

First-order Raman spectra and lattice dynamics of a NdGaO3 crystal