Khai D. T. Ngo

TL;DR: In this article, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested.

TL;DR: A new topology for a pulse width modulation (PWM) rectifier which can achieves both sinusoidal input current on the ac side and ripple power decoupling on the DC side without additional switches is proposed.

TL;DR: In this article, a measurement system for thermal impedance is developed to evaluate three die-attach materials, and the experimental results show that, after 500 cycles, the thermal impedance of SAC305 samples and SN100C samples is increased by 12.9% and 13.3%, respectively, which is much higher than that of the sample using the sintered nano-silver for the die attach (3.1%).

TL;DR: In this paper, a phase-leg power module is packaged by a novel planar packaging technique for high-temperature (250°C) operation, where the nanosilver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads.

TL;DR: In this paper, five types of encapsulants, including conformal coatings, underfills, molding compounds, potting compounds, and glob tops, are surveyed, and standard test methods for several crucial properties, including glass-transition temperature (T g), coefficient of thermal expansion (CTE), dielectric strength, and so on are reviewed.