Khai D. T. Ngo

TL;DR: In this paper, along with the design example, automatic design processes by using a genetic algorithm are presented and some practical considerations and implementations are introduced in the optimization of module layout design.

TL;DR: In this paper, the authors provide a survey of the literature on point-of-load converters and magnetic integration technologies and approaches, focusing on three levels of integration, namely board-level, package-level and wafer-level.

TL;DR: In this article, seven encapsulants with operating temperature up to 250 °C are surveyed for possible use in high-temperature high-power planar packages, and their performance is assessed by studying the flow fronts and the cured properties of the surveyed materials between paralleled plates.

Abstract: This paper presents the development of an ultra-fast SiC phase-leg module built in modified hybrid structure. Being a three-dimensional (3D) packaging technology, the hybrid structure achieves the same footprint as and similar parasitics to the planar packaging, but requires no double-sided solderability on the bare dice, which is not available on current SiC devices. Compared to its previous generation, the modified hybrid structure also simplifies the fabrication significantly, and allows much more complicated module design. A compact 1200 V, 10 A SiC MOSFET phase-leg module is designed and built in the proposed structure. Through proper layout design, ultra-low switching loop inductances can be realized, and experiments verify that the switching speed of the SiC MOSFET can be pushed to its very limit without excessive parasitic ringing.

TL;DR: In this article, the design issues concerning the construction of planar windings for modern magnetic components are presented, along with some practical methods to achieve low winding resistances, and three representative pattern types are explored, namely, the circular, rectangular, and spiral patterns.