K
Khai D. T. Ngo
Researcher at Virginia Tech
Publications - 329
Citations - 7607
Khai D. T. Ngo is an academic researcher from Virginia Tech. The author has contributed to research in topics: Inductor & Power module. The author has an hindex of 38, co-authored 315 publications receiving 6526 citations. Previous affiliations of Khai D. T. Ngo include University of Florida & Toyota Motor Engineering & Manufacturing North America.
Papers
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Modeling and simulation of a high-temperature SiC JFET/JBS power electronics building block
TL;DR: In this paper, the authors presented a methodology for modeling a high-temperature silicon carbide (SiC) JFET-Junction-Barrier Schottky (JBS) Power Electronics Building Block (PEBB).
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New Way of Generating Electromagnetic Waves
TL;DR: In this paper, the magnetic reluctance of the medium around the permanent magnet is modulated to alter the magnetic flux intensity and direction (disturb the stored energy) in order to achieve this goal.
Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices
Boyan Wang,Ming Xiao,Zichen Zhang,Yifan Wang,Yuan Qin,Qihao Song,Guo-Quan Lu,Khai D. T. Ngo,Yuhao Zhang +8 more
TL;DR: In this article , the authors presented a new, holistic, electrothermal approach to optimize the power consumption of wide bandgap (WBG) and ultrawide bandgap power devices.
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Hetero-Magnetic Swinging Inductor (HMSI) and Its Application for Power Factor Correction Converters
TL;DR: In this paper, a variable inductor concept based on a magnetic structure consisting of a composite of magnetic materials is introduced to meet designed inductance function of current, which is called hetero-magnetic swinging inductor (HMSI).
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Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection
TL;DR: A newly designed packaging structure and the fabrication process of a functional double-sided power module switching units utilizing LTJT sintered silver for each interface are outlined, demonstrating significant improvement of thermal performance of the fabricated module.