High leakage current in deep-submicrometer regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, the identification and modeling of different leakage components is very important for estimation and reduction of leakage power, especially for low-power applications. This paper reviews various transistor intrinsic leakage mechanisms, including weak inversion, drain-induced barrier lowering, gate-induced drain leakage, and gate oxide tunneling. Channel engineering techniques including retrograde well and halo doping are explained as means to manage short-channel effects for continuous scaling of CMOS devices. Finally, the paper explores different circuit techniques to reduce the leakage power consumption.

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Deep-submicron CMOS designs have resulted in large leakage energy dissipation in microprocessors. While SRAM cells in on-chip cache memories always contribute to this leakage, there is a large variability in active cell usage both within and across applications. This paper explores an integrated architectural and circuit-level approach to reducing leakage energy dissipation in instruction caches. We propose, gated-V/sub dd/, a circuit-level technique to gate the supply voltage and reduce leakage in unused SRAM cells. Our results indicate that gated-V/sub dd/ together with a novel resizable cache architecture reduces energy-delay by 62% with minimal impact on performance.

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Gated-V/sub dd/: a circuit technique to reduce leakage in deep-submicron cache memories

Power dissipation is increasingly important in CPUs ranging from those intended for mobile use, all the way up to high-performance processors for high-end servers. While the bulk of the power dissipated is dynamic switching power, leakage power is also beginning to be a concern. Chipmakers expect that in future chip generations, leakage's proportion of total chip power will increase significantly.This paper examines methods for reducing leakage power within the cache memories of the CPU. Because caches comprise much of a CPU chip's area and transistor counts, they are reasonable targets for attacking leakage. We discuss policies and implementations for reducing cache leakage by invalidating and “turning off” cache lines when they hold data not likely to be reused. In particular, our approach is targeted at the generational nature of cache line usage. That is, cache lines typically have a flurry of frequent use when first brought into the cache, and then have a period of “dead time” before they are evicted. By devising effective, low-power ways of deducing dead time, our results show that in many cases we can reduce LI cache leakage energy by 4x in SPEC2000 applications without impacting performance. Because our decay-based techniques have notions of competitive on-line algorithms at their roots, their energy usage can be theoretically bounded at within a factor of two of the optimal oracle-based policy. We also examine adaptive decay-based policies that make energy-minimizing policy choices on a per-application basis by choosing appropriate decay intervals individually for each cache line. Our proposed adaptive policies effectively reduce LI cache leakage energy by 5x for the SPEC2000 with only negligible degradations in performance.

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Cache decay: exploiting generational behavior to reduce cache leakage power

Is your memory hierarchy stopping your microprocessor from performing at the high level it should be? Memory Systems: Cache, DRAM, Disk shows you how to resolve this problem. The book tells you everything you need to know about the logical design and operation, physical design and operation, performance characteristics and resulting design trade-offs, and the energy consumption of modern memory hierarchies. You learn how to to tackle the challenging optimization problems that result from the side-effects that can appear at any point in the entire hierarchy.As a result you will be able to design and emulate the entire memory hierarchy. . Understand all levels of the system hierarchy -Xcache, DRAM, and disk. . Evaluate the system-level effects of all design choices. . Model performance and energy consumption for each component in the memory hierarchy.

Memory Systems: Cache, DRAM, Disk

Low supply voltage requires the device threshold to be reduced in order to maintain performance. Due to the exponential relationship between leakage current and threshold voltage in the weak inversion region, leakage power can no longer be ignored. In this paper we present a technique to accurately estimate leakage power by accurately modeling the leakage current in transistor stacks. The standby leakage current model has been verified by IISPICE. We demonstrate that the dependence of leakage power on primary input combinations can be accounted for by this model. Based on our analysis we can determine good bounds for leakage power in the standby mode. As a by-product of this analysis, we can also determine the set of input vectors which can put the circuits in the low-power standby mode. Results on a large number of benchmarks indicate that proper input selection can reduce the standby leakage power by more than 50% for some circuits.

Estimation of standby leakage power in CMOS circuits considering accurate modeling of transistor stacks

Reduction in leakage power has become an important concern in low-voltage, low-power, and high-performance applications. In this paper, we use the dual-threshold technique to reduce leakage power by assigning a high-threshold voltage to some transistors in noncritical paths, and using low-threshold transistors in critical path(s). In order to achieve the best leakage power saving under target performance constraints, an algorithm is presented for selecting and assigning an optimal high-threshold voltage. A general leakage current model which has been verified by HSPICE simulations is used to estimate leakage power. Results show that the dual-threshold technique is good for leakage power reduction during both standby and active modes. For some ISCAS benchmark circuits, the leakage power can be reduced by more than 80%. The total active power saving can be around 50% and 20% at low- and high-switching activities, respectively.

Design and optimization of dual-threshold circuits for low-voltage low-power applications

Reduction in leakage power has become an important concern in low voltage, low power and high performance applications. In this paper, we use dual threshold technique to reduce leakage power by assigning high threshold voltage to some transistors in non-critical paths, and using low-threshold transistors in critical paths. In order to achieve the best leakage power saving under target performance constraints, an algorithm is presented for selecting and assigning an optimal high threshold voltage. A general standby leakage current model which has been verified by IISPICE is used to estimate standby leakage power. Results show that dual threshold technique is good for power reduction during both standby and active modes. The standby leakage power savings for some ISCAS benchmarks can be more than 50%.

Design and optimization of low voltage high performance dual threshold CMOS circuits

Dual threshold technique has been proposed to reduce leakage power in low voltage and low power circuits by applying a high threshold voltage to some transistors in non-critical paths, while a low-threshold is used in critical path(s) to maintain the performance. Mixed-V/sub th/ (MVT) static CMOS design technique allows different thresholds within a logic gate, thereby increasing the number of high threshold transistors compared to the gate-level dual threshold technique. In this paper, a methodology for MVT CMOS circuit design is presented. Different MVT CMOS circuit schemes are considered and three algorithms are proposed for the transistor-level threshold assignment under performance constraints. Results indicate that MVT CMOS design technique can provide about 20% more leakage reduction compared to the corresponding gate-level dual threshold technique.

Mixed-V/sub th/ (MVT) CMOS circuit design methodology for low power applications

-A low-power, high-speed SRAM macro is designed in a 65 nm ultra-low-power (ULP) logic technology for mobile applications. The 65 nm strained silicon technology improves transistor performance/leakage tradeoff, which is essential to achieve fast SRAM access speed at substantially low operating voltage and standby leakage. The 1 Mb SRAM macro features a 0.667 μm 2 low-leakage memory cell and can operate over a wide range of supply voltages from 1.2 V to 0.5 V. It achieves operating frequency of 1.1 GHz and 250 MHz at 1.2 V and 0.7 V, respectively. The SRAM leakage is reduced to 12 μA/Mb at the data retention voltage of 0.5 V. The measured bitcell leakage from the SRAM array is ∼ 2 pA/bit at retention voltage with integrated leakage reduction schemes.

Liqiong Wei

Papers

Estimation of standby leakage power in CMOS circuits considering accurate modeling of transistor stacks

Design and optimization of dual-threshold circuits for low-voltage low-power applications

Design and optimization of low voltage high performance dual threshold CMOS circuits

Mixed-V/sub th/ (MVT) CMOS circuit design methodology for low power applications

A 1.1 GHz 12 μA/Mb-Leakage SRAM Design in 65 nm Ultra-Low-Power CMOS Technology With Integrated Leakage Reduction for Mobile Applications