P
Peng Wang
Researcher at University of Maryland, College Park
Publications - 32
Citations - 903
Peng Wang is an academic researcher from University of Maryland, College Park. The author has contributed to research in topics: Thermoelectric cooling & Thermoelectric effect. The author has an hindex of 15, co-authored 32 publications receiving 798 citations.
Papers
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Journal ArticleDOI
Thermal Management of On-Chip Hot Spot
Avram Bar-Cohen,Peng Wang +1 more
TL;DR: The physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described in this paper, where attention is devoted to thermoelectric microcoolers.
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Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
TL;DR: In this paper, the authors compared single-phase and two-phase cold plates for a specified inverter module, consisting of 12 pairs of silicon insulated gate bipolar transistor (IGBT) devices and diodes.
Journal ArticleDOI
On-chip hot spot cooling using silicon thermoelectric microcoolers
Peng Wang,Avram Bar-Cohen +1 more
TL;DR: In this article, a three-dimensional analytical thermal model of the silicon chip was developed and used to predict the on-chip hot spot cooling performance, and the effects of hot spot size, hot spot heat flux, silicon chip thickness, microcooler size, doping concentration in the silicon, and parasitic Joule heating from electric contact resistance on the cooling of onchip hot spots, were investigated in detail.
Journal ArticleDOI
Analytical modeling of silicon thermoelectric microcooler
TL;DR: In this article, an analytical thermal model for silicon microcooler, which couples Peltier cooling with heat conduction and heat generation in the silicon substrate, and which includes heat convection and heat generating in the metal lead, is derived and used to study the thermal characteristics of silicon thermoelectric microcoolers.
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Thermal management of high heat flux nanoelectronic chips
TL;DR: In this paper, the authors describe several cooling techniques, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation.