Journal ArticleDOI
Thermal management of high heat flux nanoelectronic chips
TLDR
In this paper, the authors describe several cooling techniques, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation.Abstract:
Driven by the continuing Moore’s Law evolution in chip technology, power dissipation of nanoelectronics chips could exceed 300W, with heat fluxes above 150W/cm2, within the next few years, along with localized, sub-millimeter zones with heat fluxes in excess of 1kW/cm2. New and novel cooling techniques, with the ability to selectively cool sub-millimeter “sun spots” while providing effective global cooling for high heat flux chips are needed. Several promising approaches, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation, will be described.read more
Citations
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Journal ArticleDOI
A review of small heat pipes for electronics
TL;DR: A review of small heat pipes, including their design, analysis, and fabrication, is presented in this article, where the authors also discuss the potential of nano-wicks, such as carbon nanotubes (CNTs), to represent the future of heat pipes.
Journal ArticleDOI
Temperature mapping near plasmonic nanostructures using fluorescence polarization anisotropy.
TL;DR: It is shown that fluorescence polarization anisotropy is a robust and reliable method which overcomes the limitations of previous thermal imaging techniques and opens new perspectives in medicine, nanoelectronics and nanofluidics where a control of temperature of a few degrees at the nanoscale is required.
Journal ArticleDOI
A review of the capabilities of high heat flux removal by porous materials, microchannels and spray cooling techniques
TL;DR: In this article, a comparison of spray cooling techniques with respect to the media type, operating fluids and flow character, maximal achievable heat flux dissipation and heat transfer coefficient, pressure drop, the Reynolds number, other selected thermal and/or flow parameters is presented.
Journal ArticleDOI
Enhanced flow boiling in a microchannel with integration of nanowires
TL;DR: In this article, the performance of a micro-channel with copper nanowires (CuNWs) coatings has been investigated experimentally, and the results from a single microchannel with bare surface are used as the baseline data.
Journal ArticleDOI
High thermal conductivity in short-period superlattices.
TL;DR: By variation of the mass mismatch between the constituent materials in the superlattice, it is found that this enhancement in thermal conductivity can be engineered, providing avenues to achieve high thermal conductivities in nanostructured materials.
References
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Book
The Physics of Blown Sand and Desert Dunes
TL;DR: The physics of blown sand and desert dunes, The physics of windblown sand and sand dunes, this paper, and the physics of dunes in the Middle East and Africa.
Journal ArticleDOI
Measurement and correlation of critical heat flux in two-phase micro-channel heat sinks
Weilin Qu,Issam Mudawar +1 more
TL;DR: In this paper, critical heat flux (CHF) was measured for a water-cooled micro-channel heat sink containing 21 parallel 215 × 821 μm channels, and a new CHF correlation was proposed which showed excellent accuracy in predicting existing heat sink data.
Journal ArticleDOI
Investigation of saturated critical heat flux in a single, uniformly heated microchannel
TL;DR: In this paper, a new microscale version of the Katto-Ohno correlation for the prediction of saturated critical heat flux (CHF) during forced convective boiling in microchannels has been proposed.
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