Physical mechanisms responsible for nondestructive single-event effects in digital microelectronics are reviewed, concentrating on silicon MOS devices and integrated circuits. A brief historical overview of single-event effects in space and terrestrial systems is given, and upset mechanisms in dynamic random access memories, static random access memories, and combinational logic are detailed. Techniques for mitigating single-event upset are described, as well as methods for predicting device and circuit single-event response using computer simulations. The impact of technology trends on single-event susceptibility and future areas of concern are explored.

Basic mechanisms and modeling of single-event upset in digital microelectronics

This paper describes an analytical model for the access and cycle times of on-chip direct-mapped and set-associative caches. The inputs to the model are the cache size, block size, and associativity, as well as array organization and process parameters. The model gives estimates that are within 6% of Hspice results for the circuits we have chosen. This model extends previous models and fixes many of their major shortcomings. New features include models for the tag array, comparator, and multiplexor drivers, nonstep stage input slopes, rectangular stacking of memory subarrays, a transistor-level decoder model, column-multiplexed bitlines controlled by an additional array organizational parameter, load-dependent size transistors for wordline drivers, and output of cycle times as well as access times. Software implementing the model is available via ftp.

CACTI: an enhanced cache access and cycle time model

Is your memory hierarchy stopping your microprocessor from performing at the high level it should be? Memory Systems: Cache, DRAM, Disk shows you how to resolve this problem. The book tells you everything you need to know about the logical design and operation, physical design and operation, performance characteristics and resulting design trade-offs, and the energy consumption of modern memory hierarchies. You learn how to to tackle the challenging optimization problems that result from the side-effects that can appear at any point in the entire hierarchy.As a result you will be able to design and emulate the entire memory hierarchy. . Understand all levels of the system hierarchy -Xcache, DRAM, and disk. . Evaluate the system-level effects of all design choices. . Model performance and energy consumption for each component in the memory hierarchy.

Memory Systems: Cache, DRAM, Disk

Radiation-induced single event upsets (SEUs) pose a major challenge for the design of memories and logic circuits in high-performance microprocessors in technologies beyond 90nm. Historically, we have considered power-performance-area trade offs. There is a need to include the soft error rate (SER) as another design parameter. In this paper, we present radiation particle interactions with silicon, charge collection effects, soft errors, and their effect on VLSI circuits. We also discuss the impact of SEUs on system reliability. We describe an accelerated measurement of SERs using a high-intensity neutron beam, the characterization of SERs in sequential logic cells, and technology scaling trends. Finally, some directions for future research are given.

Characterization of soft errors caused by single event upsets in CMOS processes

General-purpose computing devices allow us to (1) customize computation after fabrication and (2) conserve area by reusing expensive active circuitry for different functions in time. We define RP-space, a restricted domain of the general-purpose architectural space focussed on reconfigurable computing architectures. Two dominant features differentiate reconfigurable from special-purpose architectures and account for most of the area overhead associated with RP devices: (1) instructions which tell the device how to behave, and (2) flexible interconnect which supports task dependent dataflow between operations.
We can characterize RP-space by the allocation and structure of these resources and compare the efficiencies of architectural points across broad application characteristics. Conventional FPGAs fall at one extreme end of this space and their efficiency ranges over two orders of magnitude across the space of application characteristics. Understanding RP-space and its consequences allows us to pick the best architecture for a task and to search for more robust design points in the space.
Our DPGA, a fine-grained computing device which adds small, on-chip instruction memories to FPGAs is one such design point. For typical logic applications and finite-state machines, a DPGA can implement tasks in one-third the area of a traditional FPGA. TSFPGA, a variant of the DPGA which focuses on heavily time-switched interconnect, achieves circuit densities close to the DPGA, while reducing typical physical mapping times from hours to seconds.
Rigid, fabrication-time organization of instruction resources significantly narrows the range of efficiency for conventional architectures. To avoid this performance brittleness, we developed MATRIX, the first architecture to defer the binding of instruction resources until run-time, allowing the application to organize resources according to its needs. Our focus MATRIX design point is based on an array of 8-bit ALU and register-file building blocks interconnected via a byte-wide network. With today's silicon, a single chip MATRIX array can deliver over 10 Gop/s (8-bit ops). On sample image processing tasks, we show that MATRIX yields 10-20$\times$ the computational density of conventional processors.
Understanding the cost structure of RP-space helps us identify these intermediate architectural points and may provide useful insight more broadly in guiding our continual search for robust and efficient general-purpose computing structures. (Copies available exclusively from MIT Libraries, Rm. 14-0551, Cambridge, MA 02139-4307. Ph. 617-253-5668; Fax 617-253-1690.)

Reconfigurable Architectures for General-Purpose Computing

The authors describe a 512 K CMOS static RAM (SRAM) with emitter-coupled-logic (ECL) interfaces which has a 2-ns cycle time and a 3.8-ns access time, both of which are valid for random READ/WRITE operations. The CMOS technology and the physical organization of the chip are briefly discussed, and the pipelined architecture of the chip is described. Detailed measurements of internal chip waveforms demonstrating 2-ns cycle time operation are presented. The impact of wire RC delays on performance is discussed. Circuit examples that demonstrate the implementation of the pipelined architecture are included. Measurements of operating margins, access time, and cycle time are outlined. >

A 2-ns cycle, 3.8-ns access 512-kb CMOS ECL SRAM with a fully pipelined architecture

A resonant global clock-distribution network operating at 4.6GHz is designed in a 90nm 1.0V CMOS technology. Unique to this approach is the set of on-chip spiral inductors that resonate with the clock capacitance, resulting in 20% recycling of global clock power.

A 4.6GHz resonant global clock distribution network

Timing uncertainty in microprocessors is comprised of several sources including PLL jitter, clock distribution skew and jitter, across chip device variations, and power supply noise. The on-chip measurement macro called SKITTER (SKew+jITTER) was designed to measure timing uncertainty from all combined sources by measuring the number of logic stages that complete in a cycle. This measure of completed delay stages has proven to be a very sensitive monitor of power supply noise, which has emerged as a dominant component of timing uncertainty. This paper describes the Skitter measurement experiences of several IBM microprocessors including PPC970MP, XBOX360trade, CELL Broadband Enginetrade, and POWER6trade microprocessors running different workloads.

/pdf/on-chip-timing-uncertainty-measurements-on-ibm-47a0h4m43k.pdf

On-chip timing uncertainty measurements on IBM microprocessors

An advanced 0.1 /spl mu/m CMOS technology on SOI is presented. In order to minimize short channel effects, relatively thick nondepleted (0.15 /spl mu/m) SOI film, highly nonuniform channel doping and source-drain extension-halo were used. Excellent short channel effects (SCE) down to channel lengths below 0.1 /spl mu/m were obtained. It is shown that undepleted SOI results in better short channel effect when compared to ultrathin depleted SOI. Devices with little short channel effect all the way to below 500 /spl Aring/ effective channel length were obtained. Furthermore, utilization of source-drain extension-halo minimizes the bipolar effect inherent in the floating body. These devices were applied to a variety of circuits: Very high speeds were obtained: Unloaded delay was 20 ps, unloaded NAND (FI=FO=3) was 64 ps, and loaded NAND (FI=FO=3, C/sub L/=0.3 pF) delay was 130 ps at supply of 1.8 V. This technology was applied to a self-resetting 512 K SRAM. Access times of 2.5 ns at 1.5 V and 3.5 ns at 1.0 V were obtained. >

A room temperature 0.1 /spl mu/m CMOS on SOI

CMOS emitter-coupled logic (ECL) receiver circuits consisting of a differential-amplifier stage and a CMOS inverter are shown to convert 100-mV input signals to on-chip CMOS levels even with worst-case parameter variations in a 5-V 1- mu m technology. Two different receiver circuits are used to cover a range of power supply options; a third circuit provides a comparison case. The differential amplifiers feature built-in feedback compensation for common-mode parameter variations. The differential input devices are designed with large widths, minimum channel lengths, and an interleaved layout to enhance gain, speed, and margin for differential mismatches. The simplicity of the circuits and the effectiveness of the built-in compensation facilitate analysis. Partitioning and simplifying assumptions are used to thoroughly test the worst case without complex simulations, while providing insight into the design process. >

R.L. Franch

Papers

A 2-ns cycle, 3.8-ns access 512-kb CMOS ECL SRAM with a fully pipelined architecture

A 4.6GHz resonant global clock distribution network

On-chip timing uncertainty measurements on IBM microprocessors

A room temperature 0.1 /spl mu/m CMOS on SOI

Fast CMOS ECL receivers with 100-mV worst-case sensitivity