S
Sin-Ting Chen
Researcher at National Sun Yat-sen University
Publications - 15
Citations - 565
Sin-Ting Chen is an academic researcher from National Sun Yat-sen University. The author has contributed to research in topics: Ground plane & Ground bounce. The author has an hindex of 9, co-authored 15 publications receiving 553 citations. Previous affiliations of Sin-Ting Chen include National Taiwan University.
Papers
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Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits
TL;DR: In this article, a power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure.
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Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB
TL;DR: In this article, the effect of the partitioning and bridging of the power/ground planes on the radiation caused by the switching noise on the dc reference planes is investigated both theoretically and experimentally.
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A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures
TL;DR: In this article, a power/ground planes design for eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period photonic bandgap (PBG) structure.
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A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit
Tzong-Lin Wu,Sin-Ting Chen +1 more
TL;DR: In this paper, a photonic crystal power/ground layer (PCPL) is proposed to suppress the power and ground bounce noise (P/GBN) or simultaneously switching noise (SSN) in high-speed digital circuits.
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Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method
TL;DR: In this article, an efficient numerical approach based on the 2D finite-difference time-domain (FDTD) method is proposed to model the power/ground plane noise or simultaneously switching noise (SSN), including the interconnect effect between the package and the print circuit board (PCB).