T
Tzong-Lin Wu
Researcher at National Taiwan University
Publications - 313
Citations - 4871
Tzong-Lin Wu is an academic researcher from National Taiwan University. The author has contributed to research in topics: Equivalent circuit & Signal integrity. The author has an hindex of 31, co-authored 302 publications receiving 4239 citations. Previous affiliations of Tzong-Lin Wu include National Sun Yat-sen University & TSMC.
Papers
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Journal ArticleDOI
A Novel Wideband Common-Mode Suppression Filter for Gigahertz Differential Signals Using Coupled Patterned Ground Structure
TL;DR: In this paper, a wideband and compact filter design for common-mode noise suppression in high-speed differential signals is proposed based on two U-shaped and one H-shaped coupled patterned ground structure.
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Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits
TL;DR: In this article, a power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure.
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An Embedded Common-Mode Suppression Filter for GHz Differential Signals Using Periodic Defected Ground Plane
TL;DR: In this article, a low-cost filter design for common-mode noise suppression in high-speed differential signals is proposed, which is realized by periodically etching the dumbbell-shape defected ground structure (DGS) to perturb the return current of the common mode noise.
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Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
TL;DR: In this article, the authors reviewed possible solutions based on decoupling or isolation for suppressing power distribution network (PDN) noise on package or printed circuit board (PCB) levels.
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Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress
TL;DR: The fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades are reviewed and the necessity of practical training of designers is mentioned.