Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which has led to the fabrication of high performance n- and p-type oxide transistors as well as the fabrication of CMOS devices with and on paper.

Oxide Semiconductor Thin‐Film Transistors: A Review of Recent Advances

We report high-performance ZnO thin-film transistor (ZnO-TFT) fabricated by rf magnetron sputtering at room temperature with a bottom gate configuration. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 19V, a saturation mobility of 27cm2∕Vs, a gate voltage swing of 1.39V∕decade and an on/off ratio of 3×105. The ZnO-TFT presents an average optical transmission (including the glass substrate) of 80% in the visible part of the spectrum. The combination of transparency, high mobility, and room-temperature processing makes the ZnO-TFT a very promising low-cost optoelectronic device for the next generation of invisible and flexible electronics.

Wide-bandgap high-mobility ZnO thin-film transistors produced at room temperature

Enhancement mode, field effect transistors wherein at least a portion of the transistor structure may be substantially transparent. One variant of the transistor includes a channel layer comprising a substantially insulating, substantially transparent, material selected from ZnO, Sn02, or In203. A gate insulator layer comprising a substantially transparent material is located adjacent to the channel layer so as to define a channel layer/gate insulator layer interface. A second variant of the transistor includes a channel layer comprising a substantially transparent material selected from substantially insulating ZnO, Sn02or In2O3, the substantially insulating ZnO, Sn02, or In203 being produced by annealing. Devices that include the transistors and methods for making the transistors are also disclosed.

Transistor structures and methods for making the same

Thin-film transistors (TFTs) were fabricated using amorphous indium gallium zinc oxide (a-IGZO) channels by rf-magnetron sputtering at room temperature. The conductivity of the a-IGZO films was controlled from ∼10−3to10−6Scm−1 by varying the mixing ratio of sputtering gases, O2∕(O2+Ar), from ∼3.1% to 3.7%. The top-gate-type TFTs operated in n-type enhancement mode with a field-effect mobility of 12cm2V−1s−1, an on-off current ratio of ∼108, and a subthreshold gate voltage swing of 0.2Vdecade−1. It is demonstrated that a-IGZO is an appropriate semiconductor material to produce high-mobility TFTs at low temperatures applicable to flexible substrates by a production-compatible means.

High-mobility thin-film transistor with amorphous InGaZnO4 channel fabricated by room temperature rf-magnetron sputtering

— High-performance top-gate thin-film transistors (TFTs) with a transparent zinc oxide (ZnO) channel have been developed. ZnO thin films used as active channels were deposited by rf magnetron sputtering. The electrical properties and thermal stability of the ZnO films are controlled by the deposition conditions. A gate insulator made of silicon nitride (SiNx) was deposited on the ZnO films by conventional P-CVD. A novel ZnO-TFT process based on photolithography is proposed for AMLCDs. AMLCDs having an aperture ratio and pixel density comparable to those of a-Si:H TFT-LCDs are driven by ZnO TFTs using the same driving scheme of conventional AMLCDs.

Novel top‐gate zinc oxide thin‐film transistors (ZnO TFTs) for AMLCDs

We have fabricated high performance ZnO thin film transistors (TFTs) using CaHfOx buffer layer between ZnO channel and amorphous silicon?nitride gate insulator. The TFT structure, dimensions, and materials set are identical to those of the commercial amorphous silicon (a-Si) TFTs in active matrix liquid crystal display, except for the channel and buffer layers replacing a-Si. The field effect mobility can be as high as 7 cm2?V-1?s-1 for devices with maximum process temperature of 300?C. The process temperature can be reduced to 150?C without much degrading the performance, showing the possibility of the use of polymer substrate.

High Mobility Thin Film Transistors with Transparent ZnO Channels.

A low on-resistance and high-breakdown-voltage enhancement-mode (E-mode) AlGaN/AlN/GaN high electron mobility transistor (HEMT) was fabricated without the recessed-gate process. A thin AlGaN barrier layer (4.5 nm) was used for the normally-off operation. In order to decrease the on-state resistance, two different techniques are used. One is the side-ohmic contact, which has a low contact resistance, due to the direct contact with the two-dimensional electron gas (2DEG). The other is SiO2 passivation, which induces the sheet carriers and decreases the sheet resistance. As a result, an on-state resistance of 1.9 mΩcm2 and an off-state breakdown voltage of 610 V were achieved for the E-mode HEMT within a threshold voltage of approximately -0.1 V.

https://iopscience.iop.org/article/10.1143/JJAP.45.L1168/pdf

Enhancement-Mode AlGaN/AlN/GaN High Electron Mobility Transistor with Low On-State Resistance and High Breakdown Voltage

Department of Innovative and Engineered Materials, Tokyo Institute of Technology 4259 Nagatsuta, M idori, Yokoham a 226-8502, l apan Phone: +81-45-924-5362 Fax: *81-45-924-5399 e-mail: kawasaki@oxide.rlem.titech.acjp rResearch Institute of Electronic Communication, Tohoku University, Sendai 980-8577, Japan 'Photodynamics Research Center, RIKEN, Sendai, 980-0868, Japan 3Department of Physics, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

Yuji Ohmaki

Papers

High Mobility Thin Film Transistors with Transparent ZnO Channels.

Enhancement-Mode AlGaN/AlN/GaN High Electron Mobility Transistor with Low On-State Resistance and High Breakdown Voltage

Can ZnO Eat Market in Optoelectronic Applications