Arista Networks

About: Arista Networks is a based out in . It is known for research contribution in the topics: Network element & Networking hardware. The organization has 280 authors who have published 289 publications receiving 2497 citations.

Electrical connection mechanism for reversible fan module

Abstract: A reversible fan module may include a first attachment member that may receive power from a controller when an orientation of the reversible fan module is a first orientation; a second attachment member that may receive power from the controller when the orientation of the reversible fan module is a second orientation; a first electrical connection, disposed between the first attachment member and the second attachment member, that may transmit power from the second attachment member to the first attachment member when the orientation of the reversible fan module is the second orientation; and a second electrical connection, disposed between the first attachment member and a fan unit, that may transmit power to the fan unit.

Method and system for managing port bandwidth in network devices

Abstract: A method for managing port bandwidth in network devices. The method includes determining a first and a second ingress bandwidth of a first and a second network chip, respectively, determining an egress bandwidth of an egress port of a third network chip, determining a first and a second weight for the first and the second network chip, respectively, where the first and the second weight are determined based on a bandwidth including the first and second ingress bandwidth, processing a first data packet, received by a first ingress port administrated by the first network chip, based on the first weight and the egress bandwidth, and processing a second data packet, received by a second ingress port administrated by the second network chip, based on the second weight, and the egress bandwidth, where the destination of the first and the second data packet is the egress port.

Method and system for using a top of rack switch as an overlay routing intermediate point

Abstract: A method for transmitting MAC frames between remote and/or virtual machines, across network devices (i.e., switches, multilayer switches, and routers) that conventionally do not hold capacity to address MAC rewrites to any and all possible destinations within expanding data centers. More specifically, a network device retains MAC rewrite table entries corresponding to Top of Rack (ToR) switches versus to the hosts and virtual machines that reside under those ToR switches. This use of a ToR switch as an overlay routing intermediate point may reduce the number of required MAC addresses stored on a network device for the purposes of performing rewrites, thereby once again establishing the capability for packets to reach any arbitrary destination as data centers scale.

Heat sink for optical transceiver

Abstract: An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

Connector for printed circuit board

Abstract: A printed circuit board is provided. The board includes a plurality of vias through the printed circuit board, each having a first section with a first width, a second section with a second width less than the first width, and a third section with a third width greater than the second width and less than the first width. The second section is located between the first section and the third section, the first and second sections are plated, and the third section lacks plating. At least one of the plurality of vias has the first width dimensioned to receive a connector pin inserted through the first face. A further at least one of the plurality of vias has the first width dimensioned to receive a further connector pin inserted through the second face. Further versions of the printed circuit board and method of making a printed circuit board are provided.