Journal ArticleDOI
A novel fluid-filler/polymer composite as high-temperature thermally conductive and electrically insulating material
Zhaodongfang Gao,Qi Zhao,Chuanbin Li,Shan Wang,Lijie Dong,Guo-Hua Hu,Quanling Yang,Chuanxi Xiong +7 more
TLDR
In this paper, liquid paraffin microcapsules (LPMs) were incorporated into epoxy resin to prepare fluid-filler/polymer composite materials, with the objective of introducing fluid heat convection into thermally conductive and electrically insulting materials.About:
This article is published in Composites Science and Technology.The article was published on 2017-09-29. It has received 21 citations till now. The article focuses on the topics: Liquid paraffin & Epoxy.read more
Citations
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Electrically insulating, layer structured SiR/GNPs/BN thermal management materials with enhanced thermal conductivity and breakdown voltage
Chang-Ping Feng,Shen-Shen Wan,Wei-Chun Wu,Lu Bai,Rui-Ying Bao,Zheng-Ying Liu,Ming-Bo Yang,Jun Chen,Wei Yang +8 more
TL;DR: In this article, the advantages of boron nitride (BN) and graphene nanoplatelets (GNP) as fillers were realized by a facile and scalable strategy.
Journal ArticleDOI
Highly thermal conductive and electrically insulating polymer composites based on polydopamine-coated copper nanowire
Yuan Hao,Yang Wang,Ting Li,Piming Ma,Shengwen Zhang,Mingliang Du,Mingqing Chen,Weifu Dong,Weihua Ming +8 more
TL;DR: In this article, highly thermally conductive but electrically insulating epoxy nanocomposites were prepared by incorporating polydopamine-coated copper nanowires (CuNWs).
Journal ArticleDOI
Enhanced through-plane thermal conductivity and high electrical insulation of flexible composite films with aligned boron nitride for thermal interface material
TL;DR: In this paper, a generalizable step-by-step orientation method without chemical modification or special treatment is adopted to prepare the composite films (boron nitride/poly (vinylidene fluoride) (i.e. x-BN/PVDF)).
Journal ArticleDOI
High-performance polyimide nanocomposites with polydopamine-coated copper nanoparticles and nanowires for electronic applications
TL;DR: A multilayer-structured polyimide nanocomposite based on a combination of polydopamine (PDA)-coated copper nanoparticles and copper nanowires was synthesized using a flexible and rapid method as mentioned in this paper.
Journal ArticleDOI
Compatible paraffin@SiO2 microcapsules/polydimethylsiloxane composites with heat storage capacity and enhanced thermal conductivity for thermal management
TL;DR: In this article , phase change microcapsules with SiO 2 shell were combined with polydimethylsiloxane (PDMS) to construct a novel kind of polymeric composite.
References
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Journal ArticleDOI
Autonomic healing of polymer composites
Scott R. White,Nancy R. Sottos,Philippe H. Geubelle,Jeffrey S. Moore,Jeffrey S. Moore,Michael R. Kessler,Suresh R. Sriram,Suresh R. Sriram,Eric Brown,S. Viswanathan +9 more
TL;DR: A structural polymeric material with the ability to autonomically heal cracks is reported, which incorporates a microencapsulated healing agent that is released upon crack intrusion and polymerization of the healing agent is triggered by contact with an embedded catalyst, bonding the crack faces.
Journal ArticleDOI
Flexible high-temperature dielectric materials from polymer nanocomposites
Qi Li,Lei Chen,Matthew R. Gadinski,Shihai Zhang,Guangzu Zhang,Haoyu U. Li,Aman Haque,Long Qing Chen,Thomas N. Jackson,Qing Wang +9 more
TL;DR: Crosslinked polymer nanocomposites that contain boron nitride nanosheets have outstanding high-voltage capacitive energy storage capabilities at record temperatures and have been demonstrated to preserve excellent dielectric and capacitive performance after intensive bending cycles, enabling broader applications of organic materials in high-temperature electronics and energy storage devices.
Journal ArticleDOI
Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
TL;DR: The modeling results suggest that graphene-multilayer graphene nanocomposite used as the thermal interface material outperforms those with carbon nanotubes or metal nanoparticles owing to graphene's aspect ratio and lower Kapitza resistance at the graphene-matrix interface.
Journal ArticleDOI
Low dielectric constant polymers for microelectronics
TL;DR: In this paper, a large variety of polymers have been proposed for use as materials with low dielectric constants for applications in microelectronics, including polyimides, heteroaromatic polymers, poly(aryl ether)s, fluoropolymers, hydrocarbon polymers without any polar groups, films deposited from the gas phase by chemical vapor deposition, plasma enhanced chemical vapor (PEVD) and other techniques.
Journal ArticleDOI
Graphene -- Based Nanocomposites as Highly Efficient Thermal Interface Materials
TL;DR: In this paper, the authors found that an optimized mixture of graphene and multilayer graphene can lead to an extremely strong enhancement of the cross-plane thermal conductivity of the composite.
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