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Journal ArticleDOI

A Review of Silicon-On-Insulator Formation by Oxygen Ion Implantation

R. F. Pinizzotto
- 01 Jan 1983 - 
- Vol. 27, Iss: 1, pp 265-274
TLDR
The most mature SOI technology other than silicon-on-sapphire is SIMOX, or Separation by Implanted Oxygen as discussed by the authors, where high energy oxygen ions are implanted into single crystal silicon until a stoichiometric buried silicon dioxide layer is formed.
Abstract
Silicon-on-Insulator structures will be an important technological advance used in future VLSI, VHSIC and threedimensional integrated circuits. The most mature SOI technology other than silicon-on-sapphire is SIMOX, or Separation by Implanted Oxygen. High energy oxygen ions are implanted into single crystal silicon until a stoichiometric buried silicon dioxide layer is formed. After implantation, the material is annealed at high temperature to remove implantation induced defects. The structure is completed by the growth of a thin epitaxial silicon layer. Devices and complex circuits have been successfully fabricated by several research groups. This paper reviews the development of this buried oxide SOI technology from 1973 to 1983. The five major sections discuss the advantages of SOI, the basics of buried oxide formation, the literature published between 1973 and 1983, key issues that must be solved before large scale implementation takes place and, finally, predictions of future developments.

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Citations
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Journal ArticleDOI

Microstructure of high‐temperature annealed buried oxide silicon‐on‐insulator

TL;DR: In this paper, the microstructure of the buried oxide silicon-on-insulator (SOI) was improved by increasing the annealing temperature, which was attributed to the dissolution of oxygen precipitates and oxygen outdiffusion during high-temperature Annealing.
Journal ArticleDOI

Novel semiconductor substrate formed by hydrogen ion implantation into silicon

TL;DR: In this article, a high resistivity layer formed beneath the silicon surface layer by using proton implantation and two-step annealing is described, which will likely be a new material for the manufacture of very high speed integrated circuits.
Journal ArticleDOI

EPR of defects in silicon-on-insulator structures formed by ion implantation. I. O+ implantation

TL;DR: In this paper, the main features of the EPR spectra are attributed to three types of defect, with (i) g=2.0003(3), (ii) g =2.0013(2), (iii) g-1.0082(2) with the axis parallel to any (111)-type direction.
Journal ArticleDOI

High‐temperature annealing of implanted buried oxide in silicon

TL;DR: In this article, a silicon-on-insulator structure was formed by implanting 2×1018 oxygen ions cm−2 into crystalline silicon at 150 keV, and the effect of annealing temperature on the microstructure and oxygen concentration profile was investigated by using cross-sectional transmission-electron microscopy and Auger analysis.
Journal ArticleDOI

Low-Defect, High-Quality Simox Produced By Multiple Oxygen Implantation with Substoichiometric Total Dose

TL;DR: In this paper, the formation of separation by IMplantation of OXygen (SIMOX) structures by multiple oxygen implantation into silicon and high temperature annealing was addressed.
References
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Journal ArticleDOI

C.M.O.S. devices fabricated on buried SiO2 layers formed by oxygen implantation into silicon

TL;DR: In this paper, the impurity distribution of the oxygen-implanted silicon substrate was analyzed by auger spectroscopy, and the epitaxially-grown silicon layer on this substrate showed a good monocrystalline structure and a 19-stage c.m.o.s. ring oscillator exhibited high performance in operation.
Journal ArticleDOI

Surface Silicon Crystallinity and Anomalous Composition Profiles of Buried SiO 2 and Si 3 N 4 Layers Fabricated by Oxygen and Nitrogen Implantation in Silicon

TL;DR: In this article, the implanted SiO2 and Si3N4 with residual crystalline surface silicon were fabricated by implantation of O+, O2+, N+ and N2+ into single-crystal silicon with 0.6-3.0×1018 atom/cm2 dose at an energy of 70-150 keV/atom.
Journal ArticleDOI

Epitaxial silicon layers grown on ion‐implanted silicon nitride layers

TL;DR: In this article, the authors describe a set of silicon nitride layers formed by ion implantation while retaining a relatively undamaged silicon surface region, which exhibits significantly lower defect concentrations than do silicon layers on spinel, as determined by optical microscopy and by proton channeling measurements.
Journal ArticleDOI

A study of silicon oxides prepared by oxygen implantation into silicon

M H Badawi, +1 more
- 01 Oct 1977 - 
TL;DR: In this paper, the electrical properties of the implanted oxides were compared to those of thermally grown oxides which were also prepared in this work, and the results showed that the electrical and physical properties of these implantable oxides are superior to those reported elsewhere.
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