Journal ArticleDOI
A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
TLDR
In this paper, a new method based on the strain rate ratio was developed, which predicted the creep-fatigue life within a factor of 4 scatter band, and the method was applied to the experimental data.Abstract:
This paper studies creep-fatigue life prediction under shear loading by making extensive torsion creep-fatigue experiments using four kinds of strain waves. The linear damage rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model were applied to the experimental data, but no methods accurately predicted the creep-fatigue life. A new method based on the strain rate ratio, which predicted the creep-fatigue life within a factor of 4 scatter band, was developed.read more
Citations
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Journal ArticleDOI
A review of mechanical properties of lead-free solders for electronic packaging
Hongtao Ma,Jeffrey C. Suhling +1 more
TL;DR: In this article, a review of the available data in the field and give rise to the possible factors including room temperature effects, which causes the large discrepancies of data for both lead-free and SnPb solders.
Proceedings ArticleDOI
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
TL;DR: In this paper, the effects of elevated temperature isothermal aging on the mechanical behavior and reliability of lead free solders were explored by performing stress-strain and creep tests on SAC405 and SAC305 samples that were aged for various durations (0-6 months).
Proceedings ArticleDOI
Reliability of the aging lead free solder joint
TL;DR: In this article, a novel specimen preparation procedure has been developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process.
Proceedings ArticleDOI
The effects of aging temperature on SAC solder joint material behavior and reliability
TL;DR: In this paper, the effects of aging on mechanical behavior of lead free solders have been examined by performing creep tests on four different SAC alloys (SAC105, SAC205, SC305, SC405) that were aged for various durations (0-4 months) at room temperature (25degC), and several elevated temperatures (75, 100, and 125 degC).
Proceedings ArticleDOI
The effects of SAC alloy composition on aging resistance and reliability
TL;DR: In this paper, it was shown that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25 °C) and elevated temperature aging(125 °C), were unexpectedly large and universally detrimental to reliability.
References
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Journal ArticleDOI
Fatigue of 60/40 Solder
TL;DR: In this paper, a model is presented which describes the influence of plastic strain and cycling frequency and temperature changes on fatigue life, which account for temperature changes, cycling waveshape, and joint geometries.
Book ChapterDOI
Fatigue at High Temperature
TL;DR: In this article, the state of the art of high temperature fatigue is reviewed, focusing on the relative rotes of crack initiation and crack propagation, to damage processes resulting from cyclic strain including that of the substructure, of cyclic strains aging, at grain boundaries, by the environment, from wave shape effects and from plastic instabilities.
Journal ArticleDOI
Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy
TL;DR: In this paper, a low cycle isothermal mechanical fatigue testing of a eutectic alloy 63Sn/37Pb was carried out in a systematic manner over a wide range of frequencies (10 24 ‐1 Hz) and temperatures (240 to 150°C) with the total strain set at different values (1 − 50%).
Journal ArticleDOI
Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
TL;DR: In this paper, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10 s to 10 s over a wide temperature range from − 40 C to 125 C to study the effect of strain rate and testing temperature on the mechanical properties.