Journal ArticleDOI
Fatigue of 60/40 Solder
TLDR
In this paper, a model is presented which describes the influence of plastic strain and cycling frequency and temperature changes on fatigue life, which account for temperature changes, cycling waveshape, and joint geometries.Abstract:
Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results are obtained when total strain limits are employed. This difference is discussed. The influence of cycling frequency and temperature changes are also discussed. A model is presented which describes the influence of plastic strain and cycling frequency. Corrections to the model predicted fatigue life, which account for temperature changes, cycling waveshape, and joint geometries, are also discussed.read more
Citations
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Journal ArticleDOI
Thermal cycling analysis of flip-chip solder joint reliability
TL;DR: In this paper, the authors investigated different methods of implementing thermal cycling analysis, namely using the "dwell creep" and "full creep" methods based on a phenomenological approach to modeling time independent plastic and time dependent creep deformations.
Journal ArticleDOI
A new bonding technology using gold and tin multilayer composite structures
TL;DR: In this paper, a multilayer composite of chromium, gold, and tin and gold is used to form a die-to-die die composite, where the die and the substrate are brought into contact and heated to 310-320 degrees C. This technology eliminates the requirement of preforms, prevents tin oxidation, and provides precise control of the bonding thickness.
Journal ArticleDOI
Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions
TL;DR: In this article, the thermal, mechanical, and vibrational responses of flip chip and plastic ball grid array (PBGA) solder joints have been determined by bending and twisting experiments.
Journal ArticleDOI
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
TL;DR: In this paper, a low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37wt%Pb, Sn-3.5wt%Ag, and Sn-4.0-Cu was carried out at room temperature over a wide range of strains (1% 10%).
Journal ArticleDOI
A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices
TL;DR: This paper discusses various types of failure mechanisms, precursor parameters, and accelerated aging-based procedures to estimate the remaining life of power electronic devices, and the different techniques typically used for measuring the junction temperature.
References
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Book ChapterDOI
Fatigue at High Temperature
TL;DR: In this article, the state of the art of high temperature fatigue is reviewed, focusing on the relative rotes of crack initiation and crack propagation, to damage processes resulting from cyclic strain including that of the substructure, of cyclic strains aging, at grain boundaries, by the environment, from wave shape effects and from plastic instabilities.
Journal ArticleDOI
Fatigue at High Temperature-Prediction and Interpretation:
TL;DR: In this article, the authors reviewed the significant developments in fatigue over the last twenty years as they pertain to the prediction of life in high-temperature service, focusing on the interpretation of fatigue test results for both low and high cycle fatigue at room and elevated temperatures.
Book ChapterDOI
The Challenge to Unify Treatment of High Temperature Fatigue—A Partisan Proposal Based on Strainrange Partitioning
TL;DR: The strain-range partitioning concept divides the imposed strain into four basic ranges involving time-dependent and time-independent components as discussed by the authors, which can be used for the treatment of frequency and hold-time effects.