Journal ArticleDOI
Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys
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In this paper, the microstructures and tensile properties of three typical Sn-Ag-Cu alloys, Sn-30wt%Ag-05wt%Cu and Sn-39Ag-06Cu, were evaluated after casting under three different cooling conditions.Abstract:
The microstructures and tensile properties of three typical Sn–Ag–Cu alloys, Sn–30wt%Ag–05wt%Cu, Sn–35wt%Ag–07wt%Cu and Sn–39wt%Ag–06wt%Cu, prepared under three different cooling conditions were evaluated after casting The microstructures of all rapidly cooled specimens consisted of the eutectic phase of β-Sn with fine fibrous Ag3Sn dispersion surrounding primary β-Sn grains The slowly cooled Sn–35Ag–07Cu and Sn–39Ag–06Cu alloys exhibited additional large primary Ag3Sn platelets, while the Sn–30Ag–05Cu did not For all alloys, both ultimate tensile strength and 02% proof stress increased with increasing strain-rates in tensile tests Lowering cooling speed decreased tensile strength Elongation increased with an increasing strain rate from 10−5 to 10−2 s−1, and decreased slightly at 10−1 s−1 for the rapidly cooled specimens Elongation remarkably decreased for the slowly cooled Sn–35Ag–07Cu and Sn–39Ag–06Cu alloys, a degradation attributable to the formation of large primary Ag3Sn plateletsread more
Citations
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Journal ArticleDOI
Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
TL;DR: In this paper, the effects of alloy composition on microstructural, especially the formation of large intermetallic compounds, and mechanical properties of various Sn-Ag-Cu solder joints were investigated.
Journal ArticleDOI
Properties of lead-free solder alloys with rare earth element additions
TL;DR: In this article, the effect of rare earth (RE) elements on the microstructure, mechanical properties, wetting behavior of certain Pb-free solder alloys is summarized. But, the authors do not consider the effects of RE elements on ICs.
Journal ArticleDOI
A review of mechanical properties of lead-free solders for electronic packaging
Hongtao Ma,Jeffrey C. Suhling +1 more
TL;DR: In this article, a review of the available data in the field and give rise to the possible factors including room temperature effects, which causes the large discrepancies of data for both lead-free and SnPb solders.
Journal ArticleDOI
Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
TL;DR: The effects of the fourth elements, i.e., Fe, Ni, Co, Mn and Ti, on microstructural features, undercooling characteristics, and monotonic tensile properties of Sn–3 wt.%Ag–0.%Cu lead-free solder were investigated and Ni alloy is more reliable solder alloy with improved properties for all tests in the present work.
Journal ArticleDOI
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
Donald W. Henderson,James John Woods,Timothy A. Gosselin,Jay Bartelo,David E. King,T.M. Korhonen,Matt A. Korhonen,L.P. Lehman,Eric J. Cotts,Sung K. Kang,Paul A. Lauro,Da-Yuan Shih,Charles C. Goldsmith,Karl J. Puttlitz +13 more
TL;DR: In this article, the solder joint fatigue process is characterized by the recrystallization of the Sn phase in the higher deformation regions with the production of a much smaller grain size.
References
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Journal ArticleDOI
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Kil-Won Moon,William J. Boettinger,Ursula R. Kattner,Frank S. Biancaniello,Carol A. Handwerker +4 more
TL;DR: In this paper, phase diagram data in the Sn-Ag-Cu system were measured and the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases was confirmed to be at a composition of 3.5 wt.% Ag, 0.91 wt% Cu at a temperature of 216.2±0.3°C.
Journal ArticleDOI
A viable tin-lead solder substitute: Sn-Ag-Cu
TL;DR: In this paper, a new lead-free base solder alloy Sn-4.7Agl. (wt.7Cu) has been developed upon which a family of lead free solders can be based.
Journal ArticleDOI
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
TL;DR: In this article, two eutectic lead-free solders (965Sn-35Ag and 91Sn-9Zn) are investigated for their creep and stress relaxation behavior.
Journal ArticleDOI
Tin-silver-copper eutectic temperature and composition
M. E. Loomans,Morris E. Fine +1 more
TL;DR: In this article, a careful investigation of the Sn-Ag-Cu phase diagram near the ternary eutectic composition was undertaken using annealed alloys and differential scanning calorimetry to settle some uncertainties.
Journal ArticleDOI
New, lead-free solders
M. McCormack,Sungho Jin +1 more
TL;DR: In this paper, two specific examples of the new lead-free alloys are described: Sn-3.5%Ag-l%Zn alloy and Sn-Zn-In based alloys.
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