scispace - formally typeset
Journal ArticleDOI

An Improved Performance Poly-Si Pirani Vacuum Gauge Using Heat-Distributing Structural Supports

Reads0
Chats0
TLDR
In this article, a ladder-shaped structure with two parallel bridges and crosslinks in between has been designed and fabricated for a micro-Pirani vacuum gauge that enhances the physical performance of the gauge by increasing structural rigidity, thus allowing for longer beams and a wider selection of materials.
Abstract
A new micro-Pirani vacuum gauge that employs a ladder-shaped structure with two parallel bridges and crosslinks in between has been designed and fabricated. This design enhances the physical performance of the gauge by increasing structural rigidity, thus allowing for longer beams and a wider selection of materials, and by allowing for better heat distribution across the sensor - therefore improving the full-scale range of sensor response. Furthermore, this Pirani gauge can be fabricated in a one-, two-, or three-mask process without postprocessing steps such as KOH etching. In a CMOS-compatible process, poly-Si 4 times 2 times 250-mum and 4 times 2 times 1000-mum Pirani gauges with the ladder structure were fabricated and tested with pressure ranges from 10-3 to 50 torr (0.133 to 1 times 103 Pa) and 5 times 10-2 to 760 torr (6.67 to 1.01 times 105-Pa atmospheric pressure) and with resolutions of approximately 10-3 and 5 times 10-2 (0.133 to 6.67 Pa), respectively. Constant temperature circuitry and thermoelectric temperature stabilization would further extend the range of operation and the resolution of these devices. Furthermore, these sensors operate at very low powers ranging from 300 to 600 muW depending on their geometry and pressure measurement range.

read more

Citations
More filters
Journal ArticleDOI

Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs

TL;DR: In this article, a MEMS vacuum package with vertical feedthroughs formed in a glass substrate all at the wafer level is reported. Butler et al. used a micro-Pirani gauge on a glass substrategies for in situ monitoring, a silicon cap, and vertical feed throughs through the glass.
Proceedings ArticleDOI

Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

TL;DR: In this paper, the first wafer-level vacuum packages created with gold-indium transient liquid phase (TLP) wafer bonding were tested in a commercially available wafer bonder.
Journal ArticleDOI

The nanogap Pirani-a pressure sensor with superior linearity in an atmospheric pressure range

TL;DR: In this paper, a surface micromachined Pirani pressure sensor with an extremely narrow gap between its heater and heatsink (substrate) with superior output linearity in the atmospheric pressure range was designed and fabricated.
Proceedings ArticleDOI

Encapsulation of vacuum sensors in a wafer level package using a gold-silicon eutectic

TL;DR: In this article, a vacuum package based on gold-silicon eutectic wafer bonding has been developed and evaluated using high sensitivity poly-Si Pirani vacuum sensors, achieving initial pressures from 2 to 12 torr with initial leak/outgassing rates of -0.073 to 80 torr/year.
Journal ArticleDOI

Pirani Vacuum Gauges Using Silicon-on-Glass and Dissolved-Wafer Processes for the Characterization of MEMS Vacuum Packaging

TL;DR: In this article, the authors present the design and implementation of Pirani vacuum gauges for the characterization of vacuum packaging of microelectromechanical systems (MEMS), which are fabricated with two different standard in-house fabrication processes, namely the silicon-on-glass (SOG) process and dissolved-wafer process (DWP).
References
More filters
Journal ArticleDOI

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

TL;DR: A glass vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated in this article, where a constant heat flux model shows that heating can be confined locally in the dielectric layer underneath a microheater as long as the width of the microheaters and the thickness of silicon substrate are much smaller than the die size and a good heat sink is placed underneath the silicon substrate.
Journal ArticleDOI

Microfabricated thermal absolute-pressure sensor with on-chip digital front-end processor

TL;DR: A thermal absolute pressure sensor of the heated microbridge type has been integrated with an active bias circuit and an 8-b successive approximation register analog/digital (A/D) converter as discussed by the authors.
Journal ArticleDOI

Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

TL;DR: The fabrication and reliability of a solder wafer-to-wafer bonding process is discussed in this article, where factors affecting hermeticity, shorts, Q values, shifting cavity pressure, wafer saw cleanliness and corrosion resistance are discussed.
Journal ArticleDOI

High performance Pirani vacuum gauge

TL;DR: In this article, a wide range Pirani gauge that is capable of measuring vacuum pressure down to 10−7 Torr reproducibly has been built, with a thermal drift as small as 5.7 μV/°C.
Journal ArticleDOI

A microfabricated Pirani pressure sensor operating near atmospheric pressure

TL;DR: In this article, a micromachined pressure sensor based on the measurement of the pressure-dependent thermal conductivity of gaseous media (Pirani principle) is presented, which consists of a freestanding microbridge with a defined distance to the substrate which acts as a heat sink.
Related Papers (5)