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Journal ArticleDOI

Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphere

F.N. Fuss, +2 more
- 16 May 1977 - 
- Vol. 43, pp 189-213
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TLDR
In this paper, the corrosion of a metal system that simulates gold-plated bonding pads on a thin film hybrid-integrated circuit after lead attachment by soldering was investigated.
About: 
This article is published in Thin Solid Films.The article was published on 1977-05-16. It has received 9 citations till now. The article focuses on the topics: Corrosion & Soldering.

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Citations
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Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures

H. Naguib, +1 more
- 01 Jun 1979 - 
TL;DR: In this paper, the relative performance characteristics of thin-film Pd/Ag conductors for dielectric crossover structures in hybrid microelectronic circuits are described, and the results of these tests were considerably scattered for electrodes of high Pd content.
Journal ArticleDOI

New acceleration factors for temperature, humidity, bias testing

N. L. Sbar, +1 more
- 01 Jan 1979 - 
TL;DR: In this paper, temperature-humidity acceleration factors for surface conductance (G ) were determined to predict failure rates due to electrolytic conduction on active devices in a high-stress laboratory environment.
Journal ArticleDOI

Metal Migrations Outside the Package During Accelerated Life Tests

P. Dumoulin, +2 more
- 01 Dec 1982 - 
TL;DR: In this paper, various large-scale integrated (LSI) ceramic and plastic packages are stressed through different accelerated life tests, including temperature, humidity, hostile gases, and bias.
Journal ArticleDOI

Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films

H. Keller
- 01 Jun 1979 - 
TL;DR: In this paper, an investigation of the mechanism of solder joint strength degradation due to the temperature aging of clip-on terminals to HIC Ti-Pd-Au thin films is described.
Journal ArticleDOI

Low-temperature deposition of crystalline silicon nitride nanoparticles by hot-wire chemical vapor deposition

Chan-Soo Kim, +4 more
- 15 Jul 2009 - 
TL;DR: The nanocrystalline alpha silicon nitride (α-Si 3 N 4 ) was deposited on a silicon substrate by hot-wire chemical vapor deposition at the substrate temperature of 700°C under 4 and 40 Torr at the wire temperatures of 1430 and 1730°C, with a gas mixture of SiH 4 and NH 3.
References
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Journal ArticleDOI

Adsorption of Gases in Multimolecular Layers

Stephen Brunauer, +2 more
- 01 Feb 1938 - 
Journal ArticleDOI

Electrical Conduction Mechanism in Ultrathin, Evaporated Metal Films

C. A. Neugebauer, +1 more
- 01 Jan 1962 - 
TL;DR: In this paper, the authors investigated the electrical conduction mechanism in the film plane of ultrathin, evaporated metal films and showed that the conductivity depends exponentially on reciprocal temperature, and it should be independent of field at low fields.
Book

Thin Film Technology

R. W. Berry, +3 more
Journal ArticleDOI

Primary Standards for Trace Gas Analysis.

A. E. O'Keeffe, +1 more
- 01 May 1966 - 
Book

Solders and Soldering

Howard H. Manko, +1 more
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Bias Humidity Performance and Failure Mechanisms of Nonhermetic Aluminum SIC's in an Enviornment Contaminated with Cl 2

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- 01 Dec 1982 - 

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