Patent
Electroless gold-plating method and electronic component
Masayuki Kiso,Seigo Kurosaka,Yukinori Oda,Toru Okada,Ayumi Okubo,阿弓 大久保,幸典 小田,亨 岡田,雅之 木曽,成吾 黒坂 +9 more
TLDR
In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.Abstract:
PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPITread more
Citations
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Patent
Plating catalyst and method
TL;DR: In this paper, the authors describe a catalyst solution consisting of a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom, which is useful for a catalyzing an electroless process for plating metal on nonconductive surfaces.
Patent
Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof
TL;DR: In this article, a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof is described, where the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.
Patent
Reductive electroless gold plating solution, and electroless gold plating method using the plating solution
Kato Tomohito,Hideto Watanabe +1 more
TL;DR: In this article, an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance, was presented.
Patent
Substrate with fine metal pattern, print circuit board and semiconductor device, and production method of substrate with fine metal pattern, print circuit board and semiconductor device
TL;DR: In this paper, a manufacturing method of a substrate with fine metal patterns is proposed to prevent abnormal metal precipitation on the surface of a resin base when non-electrolyte nickel palladium gold plating processing is performed on the surfaces of fine metal pattern on a substrate such as the terminal part of a print circuit board.
Patent
Electroless plating method and led mounting substrate
TL;DR: In this article, an electroless plating method was proposed to improve reflectivity of light and to prevent discoloration of a silver-plated film under a high temperature condition, which included applying palladium treatment on a Ni-P plating film formed on an article to be plated.
References
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Patent
Electroless palladium plating liquid, and three layer-plated film terminal formed using the same
TL;DR: In this paper, the problem of providing an electroless palladium plating liquid where a gold film is formed only by easily treatable substitution gold plating is solved, which has excellent joining strength in both of wire bonding joining and solder ball joining.