Journal ArticleDOI
Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU
Abdelillah Abed Belarbi,M’hamed Beriache,Nor Azwadi Che Sidik,Rizalman Mamat +3 more
- Vol. 50, Iss: 3, pp 2242-2258
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The article was published on 2021-05-01. It has received 7 citations till now. The article focuses on the topics: Jet (fluid) & Electronics cooling.read more
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Heat transfer characteristics of jet impingement on a surface mounted with ribs using LES
TL;DR: In this paper , the authors investigated flow and heat transfer features of jet impingement on a surface fitted with detached ribs at Re = 20,000 using OpenFOAM 4.1 based large eddy simulation (LES).
Journal ArticleDOI
A novel thermoelectric CPU cooling system controlled by artificial intelligence
İlhan Umut,Dinçer Akal +1 more
TL;DR: In this article , the authors show that the CPU's sıcaklık farkından faydalanarak fazla ısıyı iletim ve konveksiyon yoluyla uzaklaştırmaktır.
References
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Journal ArticleDOI
Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Assessment of high-heat-flux thermal management schemes
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Journal ArticleDOI
A review of thermoelectric cooling: Materials, modeling and applications
Dongliang Zhao,Gang Tan +1 more
TL;DR: In this paper, the authors reviewed the recent advances of thermoelectric materials, modeling approaches, and applications, and summarized the achievements in past decade have been summarized and the modeling techniques have been described for both the thermoelement modeling and TEC modeling.
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